Diodes Incorporated AP2141DSG-13
- Part No.:
- AP2141DSG-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
AP2141DSG-13.pdf
- Description:
- IC PWR SWITCH P-CHANNEL 1:1 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:3,700
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP2141DSG-13 from Diodes Incorporated is a single-channel, active-low enable, high-side USB power switch with integrated current limiting (0.8A typ), output discharge, and fault reporting. It operates from 2.7V–5.5V input, features 90mΩ RDS(ON) in U-DFN2018-6 package, and delivers controlled 0.6ms rise time for hot-swap USB port protection in laptops and docking stations.
For engineers reviewing the AP2141DSG-13 datasheet, AP2141DSG-13 pinout, AP2141DSG-13 application, or AP2141DSG-13 equivalent, key selection criteria include active-low EN polarity, 7ms FLG deglitch timing, reverse current blocking, thermal shutdown at 140°C, and compatibility with 120µF output capacitance under low-temperature operation.
Technical Context
The AP2141DSG-13 implements a thermally protected high-side NMOS switch with internal current-sense FET architecture-eliminating external sense resistors-and integrates UVLO (1.9V threshold), slew-rate control, and open-drain FLG with 7ms blanking to suppress false over-current triggers during capacitive load turn-on.
Its discharge function activates on EN de-assertion via a dedicated 100Ω internal NMOS path, enabling rapid VOUT collapse (<0.6ms for 1µF); reverse current blocking prevents backflow when VOUT > VIN, and thermal hysteresis (25°C) ensures stable cycling during sustained overload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Current Limit | 0.8A typical; clamps output current during overload to protect downstream circuitry without shutdown. |
| RDS(ON) | 90mΩ max (U-DFN2018-6, 5V, 25°C); minimizes conduction loss and self-heating at 500mA continuous load. |
| Input Voltage Range | 2.7V–5.5V; supports full USB 2.0 bus voltage range and accommodates Li-ion battery-backed supplies. |
| Enable Polarity | Active-low; simplifies direct interface with microcontroller GPIOs asserting logic low to power-enable peripherals. |
| FLG Blanking Time | 7ms typical; suppresses transient inrush-induced false faults when driving large output capacitors (e.g., 120µF). |
| Discharge Resistance | 100Ω nominal; provides predictable RC-based VOUT decay (e.g., <0.6ms to <0.5V for 1µF load). |
| Thermal Shutdown | 140°C trip with 25°C hysteresis; enables safe pulsed operation during sustained short-circuit conditions. |
Pinout & Package
AP2141DSG-13 is packaged in U-DFN2018-6: 2.0mm × 1.8mm, 0.5mm pitch, exposed thermal pad internally connected to GND. The package supports high-power density PCB layouts with low θJA = 70°C/W (2″×2″ FR-4, 2oz Cu, thermal vias).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - GND | Ground reference and thermal pad connection | Must be externally tied to PCB ground plane via thermal vias; not intended as primary current return path. |
| 2 - IN | Power input supply node | Accepts 2.7V–5.5V; requires local 0.1µF ceramic bypass capacitor placed adjacent to pin. |
| 3 - EN | Active-low enable control input | Pulled low to activate switch; VIH ≥2.0V, VIL ≤0.8V; compatible with 3.3V/5V logic systems. |
| 4 - FLG | Open-drain fault indicator output | Asserts low on over-current or over-temperature; requires external pull-up (e.g., 10kΩ to VIN). |
| 5,6 - OUT | Switched power output node | Drives load; all OUT pins must be shorted externally; supports up to 500mA continuous current. |
Key Features
| Feature | Design Value |
|---|---|
| Output Discharge | Integrated 100Ω NMOS discharge path activated on EN de-assertion-eliminates need for external discharge circuitry. |
| Reverse Current Blocking | Prevents backflow from VOUT to VIN when switch is disabled-even if VOUT exceeds VIN by >100mV. |
| UVLO Protection | 1.9V turn-on threshold ensures switch remains off until input rail stabilizes-critical for hot-plug reliability. |
| ESD Robustness | 15kV IEC 61000-4-2 system-level ESD rating (with external 2.2µF output cap)-enables direct USB port integration. |
| Low Shutdown Current | 1µA max at TA = 85°C-preserves battery life in always-on portable applications such as smartphones and GPS units. |
Applications
| USB Port Power Control | Laptop Docking Station |
|---|---|
Use Scenario: Managing power delivery to USB peripherals during hot-plug insertion into powered host systems. IC Role / Device Role / Timing Role: High-side power switch with controlled 0.6ms rise time and 7ms FLG deglitch to prevent false fault reporting during capacitive inrush. Use Value: Enables safe, repeatable hot-swap without host system reset or port enumeration failure. |
Use Scenario: Isolating and sequencing power to multiple peripheral interfaces (HDMI, Ethernet, USB) on a compact docking station PCB. IC Role / Device Role / Timing Role: Single-channel load switch providing independent enable control and fault monitoring per interface rail. Use Value: Reduces BOM count vs discrete MOSFET + driver solutions while meeting USB 2.0 compliance and thermal safety requirements. |
| Smartphone Charging Circuit | Set-Top Box USB Hub |
Use Scenario: Enabling/disabling charging path from USB host to smartphone battery management IC during cable connect/disconnect events. IC Role / Device Role / Timing Role: Reverse-current blocking high-side switch preventing battery discharge back into host port when disconnected. Use Value: Eliminates need for external Schottky diode, reducing forward voltage drop and heat generation in space-constrained designs. |
Use Scenario: Providing individually controllable power rails to USB peripherals (keyboard, storage, camera) in consumer STB platforms. IC Role / Device Role / Timing Role: Current-limited power switch with thermal foldback protecting against sustained short circuits on shared USB hub outputs. Use Value: Maintains system uptime by isolating faulty ports without disabling entire hub controller or requiring firmware intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side USB power switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TUSB2036IRHBR | 3-port USB 2.0 hub controller with integrated power switches; includes USB transceivers and PHY layer. | Designed for multi-port hub functionality-not a standalone load switch; larger footprint and higher quiescent current (120µA). | Select when full USB protocol handling and multi-port distribution are required; not suitable for single-rail isolation. |
| TPS2051BDBVR | Single-channel 0.5A current-limited switch with active-high EN; RDS(ON) = 120mΩ (SO-8); no integrated discharge or reverse-blocking. | Lacks output discharge and reverse-current protection-requires external components for equivalent functionality. | Choose only if active-high EN is mandatory and discharge/reverse-blocking are handled elsewhere in design. |
Compared with TUSB2036IRHBR and TPS2051BDBVR, AP2141DSG-13 uniquely combines active-low EN, integrated discharge, reverse-current blocking, and 7ms FLG deglitch in a 2.0mm×1.8mm U-DFN package-making it optimal for space-constrained, single-rail USB hot-swap where minimal external components and robust fault immunity are critical.
Availability
AP2141DSG-13 is available at Aetrix Electronics and suitable for USB port protection, laptop docking stations, and set-top box peripheral power management requiring stable component supply, long-term lifecycle support, and RoHS-compliant green packaging.
Supply support for AP2141DSG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, computing, and industrial markets.
The AP2141D/AP2151D product line targets USB 2.0-compliant hot-swap applications, delivering integrated protection (current, thermal, UVLO), precise current limiting, and compact packaging for space-sensitive portable and docked systems.
FAQ
What is the maximum continuous load current supported by AP2141DSG-13?
The AP2141DSG-13 supports 500mA maximum continuous load current per the Recommended Operating Conditions table. Although its current limit is 0.8A typical, sustained operation above 500mA requires careful thermal design due to RDS(ON) heating-especially in the U-DFN2018-6 package with θJA = 70°C/W. Derating is advised above +60°C ambient.
Does AP2141DSG-13 require external components for basic USB port protection?
No external components are required for core functionality: the 7ms FLG deglitch, output discharge, reverse-current blocking, and UVLO operate autonomously. However, Diodes recommends a 0.1µF ceramic capacitor between IN and GND, plus a 10–120µF bulk capacitor on OUT depending on load-especially below –20°C-to ensure stable current-limiting behavior and avoid false trips.
How does the FLG pin behave during simultaneous over-current and over-temperature events?
The FLG pin asserts low when either over-current or over-temperature occurs-and remains low until both fault conditions are fully cleared. There is no prioritization: if thermal shutdown activates while current limiting is active, FLG stays asserted. Recovery requires removal of both faults and a minimum 7ms blanking window before FLG releases, preventing chatter during marginal conditions.
Can AP2141DSG-13 be used in dual-role USB ports that support both data and charging?
No-Diodes explicitly advises against using AP2141DSG-13 in dual-purpose ports (e.g., HDMI/MHL with simultaneous charging). Its architecture lacks bidirectional data path support and is optimized solely for unidirectional high-side power switching. For such applications, purpose-built USB Type-C PD controllers with integrated power path management are required.
AP2141DSG-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 500mA
- Rds On (Typ):
- 95mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
AP2141DSG-13 FAQ
1.How can I place an order for AP2141DSG-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP2141DSG-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP2141DSG-13 reliable?
The price and inventory of AP2141DSG-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP2141DSG-13 is usually 5 days.
3.What payment methods are accepted for AP2141DSG-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP2141DSG-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP2141DSG-13?
AP2141DSG-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP2141DSG-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP2141DSG-13?
For technical support, including AP2141DSG-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP2141DSG-13 requirements.
6.How does Aetrix verify that AP2141DSG-13 is sourced from the original manufacturer or authorized distributors?
All AP2141DSG-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP2141DSG-13 meets industry standards.
7.What is the process for return or replacement of AP2141DSG-13?
All AP2141DSG-13 units undergo pre-shipment inspection (PSI). If there is an issue with AP2141DSG-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP2141DSG-13 part is unused and in its original packaging.
Return procedure for AP2141DSG-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP2141DSG-13 Tags

-
TPS22919DCKR
Texas Instruments

-
MIC2091-1YM5-TR
Microchip Technology

-
MIC2090-1YM5-TR
Microchip Technology

-
TPS22995RZFR
Texas Instruments

-
TPS22975DSGR
Texas Instruments

-
SIP32510DT-T1-GE3
Vishay Siliconix

-
ULN2003D1013TR
STMicroelectronics

-
MIC2005A-1YM5-TR
Microchip Technology

-
MIC2005A-1YM6-TR
Microchip Technology

-
TPS22916BYFPR
Texas Instruments

-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

