Diodes Incorporated AP2141MPG-13

Overview

AP2141MPG-13 from Diodes Incorporated is an active-low enable, single-channel, 0.5A high-side USB power switch with 95mΩ R_DS(ON), 0.8A current limiting, and integrated thermal/short-circuit protection. It operates from 2.7V to 5.5V input, features 0.6ms typical rise time, 7ms FLG deglitch, and reverse current blocking - deployed in USB 2.0-compliant hot-swap ports for laptops, docking stations, and set-top boxes.

For engineers reviewing the AP2141MPG-13 datasheet, AP2141MPG-13 pinout, AP2141MPG-13 application, or AP2141MPG-13 equivalent, key selection criteria include enable polarity (active-low), current-limit accuracy (±25% over temperature), thermal shutdown threshold (+140°C), and package-specific thermal resistance (60°C/W for MSOP-8EP).

Technical Context

The AP2141MPG-13 implements a MOSFET-based high-side switch with internal current-sense FET architecture-eliminating external sense resistors while maintaining precise 0.8A current limiting across -40°C to +85°C ambient. Its UVLO (1.9V typ) ensures safe turn-on only after stable input rail establishment.

Thermal protection uses die-temperature sensing with +140°C trip and +25°C hysteresis, enabling auto-recovery cycling during sustained overload. The open-drain FLG output asserts low after 7ms deglitch upon over-current or over-temperature fault, requiring no external RC filtering.

Key Specifications

Pinout & Package

AP2141MPG-13 is packaged in MSOP-8EP (exposed pad), offering 60°C/W junction-to-ambient thermal resistance with proper PCB thermal vias to ground plane. The exposed pad must be soldered to GND for thermal performance but not used as primary electrical ground path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side USB power switch applications.

Compared with AP2141MPG-13, AP2151MPG-13 offers identical protection and performance with reversed enable polarity, while TUSB2036IRHBR delivers integrated hub logic at the cost of lower per-port current capacity and non-equivalent functional scope.

Availability

AP2141MPG-13 is available at Aetrix Electronics and suitable for USB 2.0 host ports, hot-swap module controllers, and set-top box power distribution requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for AP2141MPG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection devices for consumer, computing, and industrial markets.

The AP2141MPG-13 belongs to Diodes' USB power switch product line, engineered specifically for robust, low-R_DS(ON) hot-swap control in space-constrained USB 2.0 applications with strict thermal and ESD requirements.

FAQ

What is the maximum continuous load current supported by AP2141MPG-13?

The AP2141MPG-13 is rated for 0.5A maximum continuous load current per the datasheet's Recommended Operating Conditions. Although its current limit is 0.8A typical, sustained operation above 0.5A risks exceeding thermal limits in MSOP-8EP without aggressive heatsinking - confirmed by θ_JA = 60°C/W and T_J(MAX) = +150°C.

Does AP2141MPG-13 require external components for fault reporting?

No. The FLG output incorporates a built-in 7ms deglitch circuit that filters transient over-current events without external RC networks. This eliminates false triggering during capacitive load turn-on and is validated across -40°C to +85°C ambient per DS31562 Rev. 10–2.

Can AP2141MPG-13 be used in dual-role USB ports (e.g., charging + data)?

No. Diodes explicitly advises against use in dual-purpose ports like HDMI/MHL where output voltage may persist while VIN ramps - risking overstress due to body diode conduction. The device is qualified only for standard USB 2.0 host/self-powered hub configurations with unidirectional power flow.

How does the exposed pad on MSOP-8EP affect thermal performance?

The exposed pad must be soldered to a dedicated GND copper area with ≥3 thermal vias to an internal ground plane. Under these conditions, θ_JA is 60°C/W - reducing junction temperature rise by ~50°C versus non-connected pad. It serves solely for thermal conduction, not electrical grounding.