Diodes Incorporated AP2141SG-13

Overview

AP2141SG-13 from Diodes Incorporated is a single-channel, active-low high-side USB power switch optimized for hot-swap and USB 2.0-compliant applications. It delivers 0.5A continuous load current with 95mΩ R_DS(ON), 0.8A accurate current limiting, and integrated thermal/short-circuit protection. Its 7ms FLG deglitch, 0.6ms typical rise time, and 2.7V–5.5V input range support robust port power control in consumer and computing systems.

For engineers reviewing the AP2141SG-13 datasheet, AP2141SG-13 pinout, AP2141SG-13 application, or AP2141SG-13 equivalent, key selection criteria include enable polarity (active-low), SO-8 package thermal performance (θ_JA = 110°C/W), reverse current blocking capability, UVLO threshold (1.9V typ), and FLG open-drain fault reporting with blanking - all critical for USB port compliance and system-level fault management.

Technical Context

The AP2141SG-13 implements a monolithic N-channel MOSFET high-side switch with integrated current-sense FET architecture, eliminating external sense resistors while maintaining precise 0.8A over-current trip (ILIMIT) and 0.6A short-circuit limit (ISHORT). Its UVLO circuit ensures turn-on only above 1.9V and immediate shutdown below that threshold, enabling safe hot-insertion.

Thermal protection activates at +140°C junction temperature with +25°C hysteresis, causing automatic cycling until fault removal. The FLG output combines over-current and over-temperature detection into a single open-drain signal with 7ms deglitch timing, preventing false triggers from capacitive inrush without external components.

Key Specifications

Pinout & Package

AP2141SG-13 is supplied in SO-8 package (Package Code S), featuring exposed pad for thermal enhancement. The exposed pad must be externally connected to GND plane but not used as primary electrical ground path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side USB power switch applications.

Compared with TUSB2036IRHBR, AP2141SG-13 offers simpler integration and lower BOM count for pure power-switching roles; versus TPS2051BDBVR, it provides tighter current limit accuracy (±25% vs ±35%), lower on-resistance, and shorter fault response latency due to 7ms vs 14ms blanking.

Availability

AP2141SG-13 is available at Aetrix Electronics and suitable for USB host port protection, laptop docking station power control, and set-top box peripheral interface applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant green packaging.

Supply support for AP2141SG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, computing, and industrial markets.

The AP2141/AP2151 product line was designed specifically for USB 2.0-compliant hot-swap power distribution, emphasizing low R_DS(ON), precise current limiting, and integrated fault reporting to simplify USB port design in space-constrained applications.

FAQ

What is the function of the NC pin (Pin 1) on the AP2141SG-13 SO-8 package?

Pin 1 is a no-connect terminal with no internal bond wire or circuit connection. Per the datasheet, it must be externally tied to the OUT pins to ensure mechanical stability and optimal thermal path through the copper pour. Leaving it floating may compromise solder joint reliability and thermal dissipation in high-current operation.

Can AP2141SG-13 be used in USB-C applications?

No - AP2141SG-13 is specified only for USB 2.0 applications and lacks the voltage rating, current capacity, and CC logic interface required for USB-C. Its 5.5V max input and 0.5A continuous rating do not meet USB-C power delivery specifications (up to 20V/5A), and it has no support for configuration channel signaling or VCONN management.

How does the 7ms FLG deglitch time affect system-level fault response?

The 7ms deglitch window prevents FLG assertion during benign inrush events, such as charging a 22µF output capacitor. True over-current faults (e.g., sustained >500mA load) trigger FLG within 7ms, allowing host firmware time to log the event and disable the port. This avoids spurious interrupts while ensuring timely fault detection for destructive conditions.

Is the exposed pad on the SO-8 package electrically connected internally?

No - the exposed pad is thermally connected to the die substrate but has no internal electrical connection. It must be soldered to a PCB GND plane for thermal performance, yet must not serve as the primary current return path. Electrical grounding must occur through Pin 8 (GND) to maintain signal integrity and avoid ground loop issues.