Diodes Incorporated AP2176MPG-13

Overview

AP2176MPG-13 from Diodes Incorporated is a dual-channel, active-high enable, high-side USB power switch with 1.5A current limiting, 90mΩ on-resistance (MSOP-8EP), and integrated short-circuit/thermal protection - designed for USB 2.0-compliant hot-swap applications in host-powered hubs and portable electronics.

For engineers reviewing the AP2176MPG-13 datasheet, AP2176MPG-13 pinout, AP2176MPG-13 application, or AP2176MPG-13 equivalent, key selection criteria include enable polarity compatibility, dual-channel independent fault reporting (FLG1/FLG2), 7ms deglitch timing, reverse current blocking, and thermal shutdown hysteresis of +25°C - all validated for operation across –40°C to +85°C ambient.

Technical Context

The AP2176MPG-13 integrates two independent high-side N-channel MOSFETs with matched current-limit sensing and separate open-drain FLG outputs. Each channel features UVLO (1.9V typ), 0.6ms typical rise time, and thermal shutdown at +140°C with +25°C hysteresis.

Its architecture employs internal sense-FET current monitoring (no external resistor), reverse-blocking capability during disable, and deglitched fault reporting that suppresses transient overcurrent events below 7ms - eliminating need for external RC filtering while maintaining fast short-circuit response (<20µs).

Key Specifications

Pinout & Package

AP2176MPG-13 is housed in an MSOP-8EP (Exposed Pad) package. The exposed pad must be externally connected to GND and thermal mass for optimal θ_JA = 60°C/W performance; it is not an electrical ground conduction path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel USB power switch applications.

Compared with AP2166MPG-13, AP2176MPG-13 simplifies control logic by accepting direct 3.3V/5V high-enable signals; versus TUSB2036IPWR, it delivers higher accuracy current limiting (±10% vs ±30%) and dedicated per-port fault flags - making it superior for custom power management in non-standard USB form factors.

Availability

AP2176MPG-13 is available at Aetrix Electronics and suitable for USB host hubs, portable docking stations, and industrial USB I/O modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant green packaging.

Supply support for AP2176MPG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, industrial, and computing markets.

The AP2176 belongs to Diodes' USB Power Switch product line - engineered specifically for USB 2.0-compliant hot-swap applications requiring precise current limiting, dual-channel independence, and safety-certified operation in space-constrained designs.

FAQ

What is the maximum continuous load current per channel for AP2176MPG-13?

The recommended maximum continuous load current per channel is 1.0A, as specified in the datasheet's "Available Options" table. Although the current limit is set at 1.5A, sustained operation above 1.0A requires careful thermal design due to power dissipation (P_D = I² × R_DS(ON)) and junction temperature limits - especially in the MSOP-8EP package with θ_JA = 60°C/W.

Does AP2176MPG-13 support reverse current blocking when disabled?

Yes. When disabled, the internal high-side MOSFETs block reverse current flow from OUT to IN - verified by the "Reverse Leakage Current" parameter (I_REV ≤ 1µA at V_OUT = 5V, V_IN = 0V). This feature prevents backfeeding from powered downstream devices into the main supply rail, meeting USB On-The-Go (OTG) requirements.

Can FLG1 and FLG2 be tied together to a single microcontroller interrupt pin?

No - FLG1 and FLG2 are independent open-drain outputs and must be monitored separately. Tying them together would prevent identification of which channel experienced a fault. Each FLG requires its own pull-up resistor (typically 10kΩ to V_CC) and dedicated GPIO input to preserve per-channel fault diagnostics essential for USB compliance and system-level error logging.

Is the exposed pad on the MSOP-8EP package electrically connected to GND?

The exposed pad is thermally connected to the die substrate and must be soldered to a PCB GND plane for thermal performance, but it is not internally bonded to the GND pin electrically. Diodes Incorporated explicitly states it "should not be used as electrical ground conduction path." Electrical grounding must be done through Pin 6 (GND); the pad serves only thermal enhancement and mechanical stability.