Diodes Incorporated AP2192MPG-13

Overview

AP2192MPG-13 from Diodes Incorporated is a dual-channel, active-high high-side power switch optimized for USB 2.0-compliant hot-swap applications. It delivers 1.5A continuous load current per channel, features 115mΩ typical R_DS(ON) at 5V, integrated 7ms deglitch on open-drain FLG outputs, and operates across 2.7V–5.5V input range. It is used in USB host/hub power distribution where controlled inrush, over-current reporting, and reverse current blocking are required.

For engineers reviewing the AP2192MPG-13 datasheet, AP2192MPG-13 pinout, AP2192MPG-13 application, or AP2192MPG-13 equivalent, key selection criteria include enable polarity (active-high), dual independent fault flags with blanking, thermal shutdown threshold (~140°C), SO-8/MSOP-8EP package compatibility, and USB 2.0 compliance without external components.

Technical Context

The AP2192MPG-13 integrates two independent high-side N-channel MOSFET drivers with current-sense FETs for accurate 2.1A current limiting and thermal foldback. Each channel includes UVLO (1.9V nominal), controlled 0.6ms rise time, and open-drain FLG outputs with 7ms deglitch to suppress false triggers during capacitive load turn-on.

Its architecture supports hot-plug sequencing via voltage ramp control and automatic recovery after over-temperature events (140°C trip, 25°C hysteresis). Reverse current blocking prevents backfeed when output voltage exceeds input, and the exposed thermal pad must be connected to GND for θ_JA = 60°C/W in MSOP-8EP.

Key Specifications

Pinout & Package

AP2192MPG-13 is supplied in MSOP-8EP (exposed pad) package. The exposed thermal pad must be soldered to a PCB ground plane for thermal performance (θ_JA = 60°C/W); it is not an electrical ground path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel high-side power switch applications.

Compared with AP2182MPG-13, the AP2192MPG-13 eliminates need for external inverters in active-high control systems; compared with TPS2051BDR, it reduces component count by 50% and improves fault immunity via integrated 7ms deglitch-critical for high-capacitance USB loads.

Availability

AP2192MPG-13 is available at Aetrix Electronics and suitable for USB host/hub power distribution, hot-plug module control, and laptop docking station designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for AP2192MPG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for consumer, computing, and industrial markets.

The AP2192 belongs to Diodes' USB power switch product line, designed specifically to replace discrete MOSFET + driver + sense resistor combinations in USB 2.0-compliant hot-swap applications with integrated protection and minimal external components.

FAQ

What is the maximum continuous current per channel for AP2192MPG-13?

The AP2192MPG-13 supports 1.5A continuous load current per channel under recommended operating conditions (T_A ≤ +85°C, proper PCB thermal layout). This rating accounts for thermal derating due to R_DS(ON) power dissipation and junction temperature limits-not the 2.1A current-limit threshold, which is a short-duration fault condition.

Can AP2192MPG-13 be used in 3.3V-only systems?

Yes. The AP2192MPG-13 operates from 2.7V to 5.5V input, making it fully compatible with 3.3V supply rails. Its EN inputs accept VIH ≥ 2V, so standard 3.3V GPIOs directly drive EN1/EN2. R_DS(ON) increases to ~140mΩ at 3.3V, resulting in ~315mW conduction loss at 1.5A-still within thermal limits with adequate copper pour.

How does the 7ms FLG blanking time improve system reliability?

The 7ms deglitch on FLG1/FLG2 prevents false over-current assertions during normal output capacitor charging (e.g., 68µF USB loads), eliminating spurious interrupts to the host controller. This avoids unnecessary port disablement or firmware error handling-especially critical in multi-port hubs where simultaneous load switching could trigger cascading faults without blanking.

Is the exposed pad on the MSOP-8EP package electrically connected?

No. The exposed pad on AP2192MPG-13's MSOP-8EP package is a thermal pad only-it must be soldered to a PCB ground plane for heat dissipation (θ_JA = 60°C/W) but must not be used as an electrical ground conduction path. Internal GND connections are made solely through Pin 1; the pad has no internal metal connection to any bond wire or die substrate.