Diodes Incorporated AP2192SG-13

Overview

AP2192SG-13 from Diodes Incorporated is a dual-channel, active-high high-side power switch optimized for USB 2.0 hot-swap applications, featuring 2.1A current limiting, 115mΩ typical R_DS(ON), 2.7V–5.5V input range, and integrated short-circuit/thermal protection. It delivers controlled 0.6ms rise time and 7ms deglitched fault reporting in SO-8 packaging for USB host hubs and embedded power rail control.

For engineers reviewing the AP2192SG-13 datasheet, AP2192SG-13 pinout, AP2192SG-13 application, or AP2192SG-13 equivalent, this device supports precise current-limited power sequencing in multi-port USB systems, hot-plug module insertion, and fault-aware 5V rail distribution where reverse-current blocking and low shutdown current (1µA max) are critical design requirements.

Technical Context

The AP2192SG-13 integrates two independent high-side N-channel MOSFET drivers with matched current-sense FETs, UVLO (1.9V threshold), and thermal shutdown at +140°C with +25°C hysteresis. Each channel operates with separate EN1/EN2 inputs and dedicated FLG1/FLG2 open-drain flags.

Its architecture employs deglitched over-current detection (7ms blanking), internal current-limit regulation (ILIMIT = 2.1A typ), and reverse-current blocking-enabling safe power-up into capacitive loads up to 68µF without external components. The SO-8 package provides θ_JA = 110°C/W on standard 2-layer FR-4.

Key Specifications

Pinout & Package

AP2192SG-13 is housed in an SO-8 package with exposed pad (not electrically connected to GND; requires thermal connection only). Pin 1 is OUT1; pin 8 is FLG1. The exposed tab must be soldered to PCB ground plane for thermal performance but must not serve as primary current return path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel high-side USB power switch applications.

Compared with AP2192SG-13, TUSB2036IPWR adds USB protocol logic but removes current-limit precision and fault reporting granularity, while TPS2051BDBVR increases component count and reduces system-level reliability due to missing deglitch and reverse-blocking features.

Availability

AP2192SG-13 is available at Aetrix Electronics and suitable for USB host hubs, hot-swappable industrial modules, and consumer electronics docking stations requiring stable component supply with full RoHS and halogen-free compliance.

Supply support for AP2192SG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for high-volume industrial and consumer markets.

The AP2192 belongs to Diodes' USB power switch product line, engineered specifically for robust, low-component-count 5V rail control in USB 2.0-compliant host and peripheral equipment.

FAQ

What is the maximum continuous load current supported by AP2192SG-13?

The AP2192SG-13 is rated for 1.5A maximum continuous load current per channel, as specified in the Recommended Operating Conditions table. This value accounts for thermal limits in SO-8 packaging at +85°C ambient and ensures reliable operation without derating under typical PCB layout conditions.

Does AP2192SG-13 support reverse-current blocking during hot-removal?

Yes. The AP2192SG-13 incorporates intrinsic reverse-current blocking that prevents backfeed from downstream loads when the switch is disabled or during V_IN loss. This feature eliminates the need for external blocking diodes in USB peripheral applications where safe hot-removal is required.

Can FLG1 and FLG2 be tied together for single-fault interrupt monitoring?

No. FLG1 and FLG2 are independent open-drain outputs with separate deglitch timers and fault detection paths. Tying them together risks masking individual channel faults and violates the recommended usage in the datasheet, which specifies dedicated MCU GPIO connections for accurate per-port fault diagnosis.

Is the exposed pad on the SO-8 package electrically connected to GND?

No. The exposed pad is thermally conductive only and must be soldered to the PCB ground plane for heat dissipation, but it is not electrically connected to the internal GND pin. Using it as a current return path may cause thermal instability or electrical noise coupling into sensitive analog blocks.