Diodes Incorporated AP2213M-3.0TRG1

Overview

AP2213M-3.0TRG1 from Diodes Incorporated is a fixed 3.0V, 500mA low-noise LDO regulator in SOIC-8 package, featuring 350mV dropout at full load, ±1% output accuracy, 75dB PSRR at 100Hz, and 1µA shutdown current. It delivers stable power to noise-sensitive RF circuitry and portable battery-powered systems where low quiescent current and tight regulation are critical.

For engineers reviewing the AP2213M-3.0TRG1 datasheet, AP2213M-3.0TRG1 pinout, AP2213M-3.0TRG1 application, or AP2213M-3.0TRG1 equivalent, key selection criteria include dropout voltage under 500mA load, thermal resistance (θJA = 160°C/W), enable logic compatibility (VIH = 2.0V), reverse-current protection, and BYP pin noise-reduction capability with 100pF capacitor.

Technical Context

The AP2213M-3.0TRG1 integrates a bandgap reference, error amplifier, and PMOS pass transistor in a single SOIC-8 IC. Its internal architecture enables ultra-low dropout operation without requiring external compensation, while the dedicated BYP terminal directly filters the reference node to suppress output noise below 260nV/√Hz.

It implements CMOS/TTL-compatible enable control (VIL ≤ 0.4V, VIH ≥ 2.0V), thermal shutdown at +150°C, overcurrent limiting (700–1000mA), and reversed current protection-ensuring safe operation during input short-circuit or output pre-bias conditions across -40°C to +125°C junction temperature range.

Key Specifications

Pinout & Package

AP2213M-3.0TRG1 uses the SOIC-8 surface-mount package (body size 4.9mm × 6.0mm, lead pitch 1.27mm), rated Moisture Sensitivity Level 3 per J-STD-020, with matte tin-plated leads compliant to MIL-STD-202 Method 208.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1703T-3002E/MB and TLC7603IDR, AP2213M-3.0TRG1 uniquely combines 500mA capability, 1µA shutdown, reverse-current blocking, and BYP-enabled sub-300nV/√Hz noise - making it the only choice for compact, battery-operated RF systems needing full fault resilience.

Availability

AP2213M-3.0TRG1 is available at Aetrix Electronics and suitable for wireless transceivers, portable medical sensors, industrial I/O modules, and smart home hub MCUs requiring stable component supply with full RoHS 3 and "Green" compliance.

Supply support for AP2213M-3.0TRG1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal ICs, with design centers in Asia, Europe, and the US, serving industrial, computing, consumer, and communications markets.

The AP2213 product line delivers low-noise, low-dropout regulators optimized for battery-powered and noise-sensitive applications - emphasizing ultra-low standby current, reverse-current protection, and integrated thermal safety.

FAQ

What is the minimum input voltage required for AP2213M-3.0TRG1 to maintain regulation at 500mA load?

The minimum input voltage is 3.35V, calculated as VOUT + VDROP = 3.0V + 0.35V. At this input, the device sustains nominal output voltage with ≤1% deviation at +25°C. For reliable PSRR performance and margin against thermal derating, Diodes recommends VIN ≥ 4.0V (VOUT + 1V) across the full -40°C to +125°C operating range.

Can the BYP pin be left unconnected, and what is the impact on output noise?

Yes, the BYP pin may be left open if rapid startup is prioritized over noise performance. With BYP open, output noise rises from 260nV/√Hz to approximately 1.2µV/√Hz. The trade-off is faster turn-on time (inversely proportional to BYP capacitance), but stability remains assured with ≥2.2µF COUT and no additional ESR constraints.

Does AP2213M-3.0TRG1 require an input capacitor, and what value is recommended?

A minimum 1.0µF X5R/X7R ceramic capacitor is required between VIN and GND to prevent oscillation and absorb high-frequency transients. Diodes specifies this as mandatory for stable operation; omitting it risks instability, especially under dynamic load conditions. Placement within 5mm of the VIN and GND pins is critical for effectiveness.

How does the SOIC-8 package's thermal resistance affect maximum continuous output current at +70°C ambient?

With θJA = 160°C/W and TJ(max) = +150°C, the maximum allowable power dissipation at TA = +70°C is (150 − 70) / 160 = 0.5W. At 3.0V output and 500mA load, PD = (VIN − 3.0V) × 0.5A + VIN × I_GND. For VIN = 5.0V, PD ≈ 1.0W - exceeding the limit. Thus, continuous 500mA requires VIN ≤ 4.6V or forced airflow/heatsinking above +70°C ambient.