Diodes Incorporated AP2213M-3.3TRE1

Overview

AP2213M-3.3TRE1 from Diodes Incorporated is a fixed 3.3V, 500mA low-noise LDO regulator in SOIC-8 package, featuring 350mV dropout at full load, ±1% output accuracy, and 75dB PSRR at 100Hz. It delivers stable power to noise-sensitive RF circuitry and portable electronics with logic-compatible enable control and reversed current protection.

For engineers reviewing the AP2213M-3.3TRE1 datasheet, AP2213M-3.3TRE1 pinout, AP2213M-3.3TRE1 application, or AP2213M-3.3TRE1 equivalent, key selection criteria include dropout voltage under 500mA load, standby current ≤1µA, thermal shutdown behavior, BYP capacitor interface for noise reduction, and SOIC-8 thermal resistance (θJA = 160°C/W).

Technical Context

The AP2213M-3.3TRE1 integrates a bandgap reference, current-limiting circuitry, and thermal shutdown into a single-pass transistor architecture. Its enable input accepts TTL/CMOS logic levels (VIH ≥ 2.0V, VIL ≤ 0.4V), and the BYP pin connects to a 100pF capacitor to suppress reference noise-reducing output noise to 260µV_RMS while narrowing ESR stability margin.

It operates across –40°C to +125°C junction temperature with input voltage range 4.3V–18V (VIN ≥ VOUT + 1V recommended). Ground pin current rises linearly with load (11mA typical at 500mA), and PSRR remains ≥75dB at 100Hz but degrades above 10kHz due to internal compensation.

Key Specifications

Pinout & Package

AP2213M-3.3TRE1 uses the SOIC-8 package (body size 3.9mm × 4.9mm, lead pitch 1.27mm), with matte tin-plated leads compliant to MIL-STD-202 Method 208. Thermal pad is not present; power dissipation relies on PCB copper area and θJA = 160°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1700-3302E/TO and TLS850F3TBV50, AP2213M-3.3TRE1 uniquely balances 500mA delivery, ultra-low noise via BYP, and industrial-grade reliability in a standard SOIC-8 - making it optimal for non-automotive, noise-critical embedded designs where cost and qualification overhead must be minimized.

Availability

AP2213M-3.3TRE1 is available at Aetrix Electronics and suitable for portable medical sensors, RF power amplifier biasing, and industrial PLC I/O modules requiring stable component supply, RoHS-compliant packaging, and consistent SOIC-8 thermal performance.

Supply support for AP2213M-3.3TRE1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions, with design and manufacturing facilities certified to IATF 16949 and ISO 9001 standards.

The AP2213 series belongs to Diodes' precision LDO portfolio, engineered specifically for battery-powered and noise-sensitive applications where low dropout, low quiescent current, and high PSRR are mandatory - not general-purpose regulation.

FAQ

What is the minimum input voltage required for AP2213M-3.3TRE1 to maintain regulation?

The absolute minimum input is VOUT + VDROP = 3.3V + 0.35V = 3.65V at 500mA and +25°C. However, Diodes recommends VIN ≥ 4.3V (VOUT + 1V) to ensure full PSRR performance and avoid dropout-related instability. Below 4.3V, PSRR degrades rapidly and transient response weakens.

Can the BYP pin be left unconnected, and what is the impact?

Yes, BYP can be left open. Doing so disables the internal reference bypass path, increasing output noise to ~600µV_RMS but widening the stable ESR range for output capacitors and improving startup time. Use open BYP only when noise sensitivity is low and rapid turn-on is critical.

Does AP2213M-3.3TRE1 require an input capacitor, and what value is recommended?

Yes - a minimum 1.0µF X5R/X7R ceramic capacitor between VIN and GND is required for stability and transient suppression. Place it within 5mm of pins 1 and 2. Larger values (e.g., 4.7µF) improve line transient response but do not affect dropout or noise performance.

How does thermal shutdown behave during sustained 500mA operation in SOIC-8 package?

In still air with no heatsink, SOIC-8 θJA = 160°C/W limits continuous 500mA operation to ambient ≤50°C. At TA = 60°C, junction temperature exceeds 150°C within seconds, triggering thermal shutdown. Recovery occurs after cooldown to ~130°C, with hysteresis preventing rapid cycling.