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Diodes Incorporated AP22804BM8-13
- Part No.:
- AP22804BM8-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
AP22804BM8-13.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,384
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Product details
Overview
AP22804BM8-13 from Diodes Incorporated is a single-channel, active-low enable, high-side load switch optimized for USB and hot-swap applications. It delivers 2.5A continuous output current with 50mΩ RDS(ON), integrated over-current/over-temperature/short-circuit protection with auto-recovery, reverse-voltage blocking (50mV trip), and 0.6ms typical soft-start rise time. Used in notebook power sequencing and SSD power rail control.
For engineers reviewing the AP22804BM8-13 datasheet, AP22804BM8-13 pinout, AP22804BM8-13 application, or AP22804BM8-13 equivalent, key selection criteria include enable polarity (active-low), thermal shutdown threshold (+140°C), 6ms FLG deglitch timing, reverse-current blocking capability, and MSOP-8 package thermal resistance (165°C/W).
Technical Context
The AP22804BM8-13 integrates an N-channel MOSFET power switch with current-sense FET-based overload detection, eliminating external sense resistors. Its UVLO activates at 2.0V (180mV hysteresis) and disables the switch below that threshold to prevent erratic turn-on during brown-out conditions.
Protection logic combines fast short-circuit response (<20µs turn-off delay), thermal cycling with +35°C hysteresis, and open-drain FLG reporting with built-in 6ms blanking to suppress false triggers from capacitive inrush. The internal discharge path (90–130Ω) actively discharges output capacitance when disabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports full USB 2.0/3.0 bus voltage range with margin. |
| RDS(ON) | 50mΩ typ - enables low conduction loss at 2.5A, reducing thermal stress in MSOP-8 package. |
| Output Current Limit | 3.0A typ (AP22804) - clamps sustained overload before thermal shutdown, preserving system integrity. |
| FLG Blanking Time | 6ms typ - prevents false fault reporting during capacitor charging transients without external RC. |
| Reverse-Voltage Trip | 50mV - blocks reverse current when VOUT exceeds VIN by ≥50mV, protecting upstream sources. |
| Thermal Shutdown | +140°C - triggers automatic shutdown under sustained overload; +35°C hysteresis enables safe recovery. |
| Soft-Start Rise Time | 0.6ms typ - controls inrush into 100μF+ loads, preventing input rail droop and supply instability. |
Pinout & Package
AP22804BM8-13 is housed in a thermally enhanced MSOP-8 package with exposed pad (recommended to connect to GND for improved heat dissipation). Pin assignments are validated per Diodes DS39137 Rev. 1–2 (p. 4).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | OUT | Switched output node; connects to load and 0.1μF + ≥10μF bulk capacitor for USB compliance. |
| 2 | GND | Power ground reference; ties to PCB ground plane and exposed pad for thermal management. |
| 3 | FLG | Open-drain fault flag; active-low after 6ms deglitch on over-current or over-temperature event. |
| 4 | EN | Active-low enable input; logic low ≤0.65V enables switch; must not float. |
| 5 | IN | Input power rail; requires 1μF ceramic bypass close to pin to suppress switching noise. |
| 6,7 | IN | Dual IN pins - paralleled internally to reduce trace inductance and improve current handling. |
| 8 | NC | No internal connection - left unconnected or tied to GND per layout best practice. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Output Discharge | 90–130Ω internal discharge path ensures controlled VOUT decay <0.4ms when disabled. |
| Auto-Recovery Protection | Over-current, short-circuit, and over-temperature faults self-clear once condition resolves - no manual reset required. |
| Reverse-Current Blocking | Prevents backfeed from VOUT to VIN via MOSFET gate control triggered at 50mV differential. |
| UVLO with Hysteresis | Enables only above 2.0V and disables below 1.82V - avoids oscillation during slow-rising or noisy supplies. |
| Thermally Optimized Package | MSOP-8 with exposed pad achieves 165°C/W θJA; enables 2.5A operation at +85°C ambient with minimal heatsinking. |
Applications
| Ultrabook Power Sequencing | SSD Power Rail Control |
|---|---|
Use Scenario: Controlled power-up/down of discrete voltage rails in dual-battery ultrabooks with strict inrush limits. IC Role / Device Role / Timing Role: High-side load switch managing 3.3V/5V SSD interface rails with precise soft-start and fault isolation. Use Value: Prevents system brown-out during hot-plug events using 0.6ms rise time and 6ms FLG blanking to ignore transient inrush. |
Use Scenario: Enabling/disabling 3.3V power to SATA or NVMe SSD modules during sleep/wake transitions. IC Role / Device Role / Timing Role: Load switch providing reverse-current blocking and rapid fault shutdown to protect host controller from SSD failure modes. Use Value: Eliminates need for external reverse-blocking diode and discrete current-limit circuitry while maintaining <20µs short-circuit response. |
| Notebook USB Port Power | Set-Top Box Peripheral Management |
Use Scenario: Individual port power control in multi-port USB hubs embedded in premium notebooks. IC Role / Device Role / Timing Role: USB-compliant high-side switch delivering 2.5A per port with over-current reporting via FLG pin. Use Value: Meets USB 2.0/3.0 power delivery specs with integrated 50mΩ RDS(ON) and auto-recovery - no firmware intervention needed. |
Use Scenario: Isolating HDMI, USB, or Ethernet peripheral rails in STB designs subject to field-replaceable module insertion. IC Role / Device Role / Timing Role: Hot-swap power switch enabling live insertion/removal of add-on modules without main board reset. Use Value: Integrated discharge function clears residual VOUT in <0.4ms, preventing latch-up or ESD damage during module swap. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP22804AM8-13 | Active-high EN (vs. active-low B version); identical RDS(ON), protection, and timing specs. | Requires GPIO logic high to enable; incompatible with systems designed for active-low control signaling. | Select when host MCU GPIO defaults to pull-down or when EN signal inversion is undesirable. |
| TCK112G,LF | Lower RDS(ON) (28mΩ), higher ILIMIT (4.5A), but no integrated discharge function and larger TQFN package. | Lacks output discharge path - requires external resistor network for VOUT bleed-down in hot-swap use cases. | Choose for higher current density where board space permits TQFN and discharge is handled externally. |
Compared with AP22804AM8-13, the B-version offers direct compatibility with active-low enable architectures without level-shifting; versus TCK112G, it trades lower on-resistance for integrated discharge and smaller MSOP-8 footprint - critical for space-constrained notebook designs.
Availability
AP22804BM8-13 is available at Aetrix Electronics and suitable for notebook power sequencing, SSD rail control, USB port management, and set-top box peripheral isolation requiring stable component supply across industrial temperature ranges (−40°C to +85°C).
Supply support for AP22804BM8-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for computing and consumer markets.
The AP22804/AP22814 family targets USB-compliant hot-swap and load-switching applications, emphasizing robust fault handling, minimal external components, and thermal efficiency in compact packages.
FAQ
What is the maximum continuous output current rating for AP22804BM8-13?
The AP22804BM8-13 is rated for 2.5A continuous output current under recommended operating conditions (VIN = 2.7V to 5.5V, TA ≤ +85°C, with proper PCB thermal design). Its over-current limit is specified at 3.0A typical, and short-circuit current is 0.45A typical - both with auto-recovery behavior.
Does AP22804BM8-13 require external components for fault blanking or discharge?
No. The device integrates a 6ms deglitch timer on the FLG pin to suppress false over-current reports from capacitive inrush, and a 90–130Ω internal discharge path that activates automatically when EN is de-asserted - eliminating need for external RC networks or bleed resistors.
How does reverse-voltage protection operate in AP22804BM8-13?
When VOUT exceeds VIN by ≥50mV for ≥6ms, the internal comparator disables the MOSFET gate drive, blocking reverse current flow. Recovery occurs automatically once the reverse-voltage condition is removed, with no latch or reset required.
Can AP22804BM8-13 be used in automotive applications?
No. AP22804BM8-13 is qualified for industrial temperature range (−40°C to +85°C) and lacks AEC-Q100 qualification, automotive-grade screening, or extended junction temperature rating. It is intended for computing, consumer, and telecom applications - not under-hood automotive environments.
AP22804BM8-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2.5A
- Rds On (Typ):
- 50mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
AP22804BM8-13 FAQ
1.How can I place an order for AP22804BM8-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP22804BM8-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP22804BM8-13 reliable?
The price and inventory of AP22804BM8-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP22804BM8-13 is usually 5 days.
3.What payment methods are accepted for AP22804BM8-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP22804BM8-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP22804BM8-13?
AP22804BM8-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP22804BM8-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP22804BM8-13?
For technical support, including AP22804BM8-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP22804BM8-13 requirements.
6.How does Aetrix verify that AP22804BM8-13 is sourced from the original manufacturer or authorized distributors?
All AP22804BM8-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP22804BM8-13 meets industry standards.
7.What is the process for return or replacement of AP22804BM8-13?
All AP22804BM8-13 units undergo pre-shipment inspection (PSI). If there is an issue with AP22804BM8-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP22804BM8-13 part is unused and in its original packaging.
Return procedure for AP22804BM8-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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