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Diodes Incorporated AP22814AM8-13
- Part No.:
- AP22814AM8-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
AP22814AM8-13.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,988
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Product details
Overview
AP22814AM8-13 from Diodes Incorporated is a single-channel, active-high enable, high-side load switch optimized for USB 2.0/3.0 hot-swap applications. It delivers 3.0 A continuous output current with 50 mΩ RDS(ON), integrated reverse-current blocking, over-current/over-temperature/short-circuit protection with auto-recovery, and a 6 ms deglitched open-drain FLG output. Used in ultrabook power sequencing and SSD power rails.
For engineers reviewing the AP22814AM8-13 datasheet, AP22814AM8-13 pinout, AP22814AM8-13 application, or AP22814AM8-13 equivalent, key selection criteria include its 2.7–5.5 V input range, 0.6 ms typical soft-start rise time, thermally enhanced MSOP-8 package with exposed pad, and guaranteed 3.0 A current limit at 5 V input.
Technical Context
The AP22814AM8-13 integrates an N-channel MOSFET power switch with current-sense FET-based overload detection, UVLO (2.0 V threshold with 180 mV hysteresis), and thermal shutdown at +140 °C with +35 °C hysteresis. Its internal discharge path activates on disable to drain output capacitance within 0.4 ms.
It implements dual-stage fault response: fast current limiting (3.45 A typ) during short-circuit events, followed by thermal cycling if sustained; FLG asserts low only after 6 ms deglitching to reject transient inrush spikes. Reverse-voltage protection triggers at 50 mV differential (VOUT – VIN) with 6 ms delay before MOSFET turn-off.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports full USB 2.0/3.0 bus voltage range with margin for ripple and drop. |
| RDS(ON) | 50 mΩ max at 5 V, 1 A - enables <150 mW conduction loss at 3 A, reducing thermal stress in MSOP-8. |
| Continuous Output Current | 3.0 A - rated per AP22814 variant; higher than AP22804's 2.5 A, enabling denser power rail designs. |
| FLG Blanking Time | 6 ms typ - suppresses false fault reporting during capacitive inrush without external RC components. |
| Output Discharge Time | 0.4 ms max (CL = 1 µF) - ensures rapid safe discharge of output bulk caps during hot-removal sequences. |
| Reverse-Voltage Trip Point | 50 mV (VOUT – VIN) - prevents backfeed from downstream supplies while allowing minor overshoot tolerance. |
| Thermal Shutdown Threshold | +140 °C - protects silicon integrity under sustained overload; +35 °C hysteresis enables controlled recovery. |
Pinout & Package
AP22814AM8-13 uses the thermally enhanced MSOP-8 package with exposed thermal pad (pin 8), rated at RθJA = 165 °C/W and RθJC = 33 °C/W. The exposed pad must be soldered to PCB ground plane for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OUT) | Power Output | Switched high-side output node; requires 0.1 µF ceramic + ≥10 µF bulk capacitor to GND for stability and hot-swap immunity. |
| 2 (GND) | Ground Reference | Primary signal and power return; connects to PCB ground plane and exposed thermal pad for thermal dissipation. |
| 3 (FLG) | Fault Reporting | Open-drain active-low flag; sinks current when over-current or over-temperature occurs after 6 ms deglitch. |
| 4 (EN) | Enable Control | Active-high logic input (A version); valid high level ≥1.5 V, low level ≤0.65 V; must not float. |
| 5 (IN) | Power Input | Main supply input; requires 1 µF X7R/X5R ceramic bypass cap close to pin to suppress switching noise and transients. |
| 6,7 (IN) | Power Input (Dual) | Second and third IN pins are paralleled internally; reduce trace inductance and improve current sharing in high-current paths. |
| 8 (PAD) | Thermal & Electrical Ground | Exposed copper pad; must be connected to solid GND plane for thermal management and EMI reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Built-in Soft-start | 0.6 ms typical rise time - limits inrush current into large output capacitors (e.g., 120 µF SSD rails) to prevent input droop. |
| Integrated Output Discharge | 90–130 Ω discharge resistance - safely drains residual charge from output caps during disable, eliminating floating voltage hazards. |
| Reverse Current Blocking | Active MOSFET cutoff at 50 mV reverse bias - eliminates need for external back-to-back FETs or diodes in bidirectional power domains. |
| Auto-Recovery Protection | Over-current, short-circuit, and over-temperature all recover automatically after fault removal - no manual reset required. |
| No External Components Required | 6 ms FLG deglitch, UVLO, discharge, and protection logic fully integrated - reduces BOM count and layout area vs discrete solutions. |
Applications
| Ultrabook Power Sequencing | SSD Power Rail Control |
|---|---|
|
Use Scenario: Controlled power-up/down of multiple voltage rails (e.g., +3.3 V, +1.8 V) in ultrabook motherboards to meet Intel IMVP timing requirements. IC Role / Device Role / Timing Role: High-side load switch providing precise enable timing, inrush limiting, and fault isolation between subsystems. Use Value: Eliminates need for discrete MOSFET + gate driver + protection IC combinations, reducing footprint by >40% and improving timing repeatability. |
Use Scenario: Hot-plug power control for M.2 NVMe SSD modules where sudden insertion must not disrupt host system voltage stability. IC Role / Device Role / Timing Role: Load switch with fast (<0.4 ms) output discharge and reverse-current blocking to prevent backfeed during hot-removal. Use Value: Enables true hot-swap compliance per USB/PCIe specs; avoids data corruption or host controller latch-up during module replacement. |
| Notebook USB Port Power Management | Set-Top Box Peripheral Power Gating |
|
Use Scenario: Individual USB port power delivery with over-current protection and status reporting in thin-and-light notebooks. IC Role / Device Role / Timing Role: USB-compliant high-side switch with FLG reporting to EC/firmware for per-port fault diagnostics and graceful shutdown. Use Value: Supports USB Battery Charging spec via accurate current limiting (3.45 A typ); FLG enables real-time port health monitoring without polling. |
Use Scenario: Selective powering of HDMI CEC, IR receiver, or USB peripherals in set-top boxes to meet Energy Star standby power targets. IC Role / Device Role / Timing Role: Low-quiescent (80 µA enabled) load switch enabling sub-100 µA system standby current when peripherals are disabled. Use Value: Meets <100 µA total system standby requirement by eliminating leakage paths; integrated discharge prevents wake-up glitches from floating outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK107AG,3 | Lower 2.5 A rating, 60 mΩ RDS(ON), no integrated discharge, 10 ms FLG blanking | Lacks output discharge and reverse-voltage protection; requires external circuitry for hot-swap safety | Choose only if cost sensitivity outweighs need for integrated protection and discharge in space-constrained designs |
| TPS22915BYFPR | 3.0 A rating, 42 mΩ RDS(ON), but no reverse-current blocking and no UVLO hysteresis | Cannot prevent backfeed in multi-rail systems; less robust against input brownout conditions | Select when lowest on-resistance is critical and reverse-blocking is handled elsewhere in the power architecture |
Compared with TCK107AG,3 and TPS22915BYFPR, AP22814AM8-13 uniquely combines 3.0 A current capability, integrated reverse-current blocking, 0.4 ms discharge, and 6 ms deglitched FLG-enabling single-chip USB-compliant hot-swap without external components.
Availability
AP22814AM8-13 is available at Aetrix Electronics and suitable for ultrabook power sequencing, SSD hot-plug interfaces, and notebook USB port management requiring stable component supply across long-lifecycle consumer electronics programs.
Supply support for AP22814AM8-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for computing, consumer, and industrial markets.
AP22814AM8-13 belongs to Diodes' AP228xx family of USB-optimized load switches, designed specifically to replace discrete MOSFET+driver+protection circuits in space- and reliability-critical portable computing platforms.
FAQ
What is the maximum continuous output current supported by AP22814AM8-13?
The AP22814AM8-13 is rated for 3.0 A continuous output current at 5 V input and +25 °C ambient, with current-limit threshold specified at 3.1–3.8 A depending on VOUT. Derating applies above +85 °C ambient or with elevated board temperatures due to its 165 °C/W junction-to-ambient thermal resistance in MSOP-8.
Does AP22814AM8-13 require external components for basic operation?
No external components are required for core functionality: the 6 ms FLG deglitch, UVLO, soft-start, discharge, and protection features are fully integrated. Only two mandatory external capacitors are needed - a 1 µF ceramic on IN and a 0.1 µF ceramic on OUT - both placed adjacent to their respective pins per layout guidelines.
How does the FLG pin behave during a short-circuit event?
During a short-circuit, FLG remains high for the first 6 ms (deglitch window), then pulls low and stays low until both over-current and over-temperature faults are cleared. If thermal shutdown cycles occur, FLG stays asserted low throughout - it does not pulse or toggle during thermal cycling.
Can AP22814AM8-13 be used in reverse-voltage scenarios where VOUT > VIN?
Yes - the device actively blocks reverse current when VOUT exceeds VIN by ≥50 mV for ≥6 ms, turning off the internal MOSFET. This prevents backfeed from downstream supplies (e.g., battery-backed rails) and eliminates need for external reverse-protection diodes.
AP22814AM8-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 3A
- Rds On (Typ):
- 50mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
AP22814AM8-13 FAQ
1.How can I place an order for AP22814AM8-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP22814AM8-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP22814AM8-13 reliable?
The price and inventory of AP22814AM8-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP22814AM8-13 is usually 5 days.
3.What payment methods are accepted for AP22814AM8-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP22814AM8-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP22814AM8-13?
AP22814AM8-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP22814AM8-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP22814AM8-13?
For technical support, including AP22814AM8-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP22814AM8-13 requirements.
6.How does Aetrix verify that AP22814AM8-13 is sourced from the original manufacturer or authorized distributors?
All AP22814AM8-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP22814AM8-13 meets industry standards.
7.What is the process for return or replacement of AP22814AM8-13?
All AP22814AM8-13 units undergo pre-shipment inspection (PSI). If there is an issue with AP22814AM8-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP22814AM8-13 part is unused and in its original packaging.
Return procedure for AP22814AM8-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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