My Inquiry
My Account
Diodes Incorporated AP22814BM8-13
- Part No.:
- AP22814BM8-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
AP22814BM8-13.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:817
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP22814BM8-13 from Diodes Incorporated is a single-channel, active-low enable, high-side load switch optimized for USB 2.0/3.0 hot-swap and power sequencing in ultrabooks, SSDs, and tablets. It delivers 3.0A continuous output current, features 50mΩ RDS(ON), integrated output discharge, reverse-voltage protection (50mV trip), and 6ms deglitched fault reporting via open-drain FLG pin.
For engineers reviewing the AP22814BM8-13 datasheet, AP22814BM8-13 pinout, AP22814BM8-13 application, or AP22814BM8-13 equivalent, this device serves as a robust, thermally efficient, RoHS-compliant solution for controlled power delivery in systems with heavy capacitive loads and short-circuit risk.
Technical Context
The AP22814BM8-13 integrates an N-channel MOSFET with current-sense FET-based over-current detection, thermal shutdown at +140°C with +35°C hysteresis, and UVLO activation at 2.0V (±0.4V hysteresis). Its soft-start circuit achieves 2.1ms typical rise time under 3.3V input and 4.7μF load capacitance.
It implements reverse-current blocking by disabling the MOSFET when VOUT exceeds VIN by ≥50mV for ≥6ms, and provides active discharge via internal 90–130Ω path (tDIS = 0.4ms into 1μF). The FLG pin asserts low only after 6ms blanking to reject transient inrush false triggers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports full USB 3.0 bus voltage range and 3.3V/5V system rails. |
| RDS(ON) | 50mΩ typ @ 5V, 1A - enables <150mW conduction loss at 3A, reducing thermal stress in MSOP-8 package. |
| Continuous Output Current | 3.0A - rated per AP22814 variant; higher than AP22804's 2.5A, enabling denser power rail designs. |
| Over-Current Limit | 3.45A typ @ 5V, 4.5V VOUT - provides margin above 3.0A rating while maintaining safe SOA during sustained overload. |
| FLG Blanking Time | 6ms typ - suppresses false fault flags during capacitor inrush (e.g., 120μF hot-plug), eliminating need for external RC filtering. |
| Discharge Resistance | 90–130Ω - ensures rapid, controlled VOUT decay (<0.4ms to <0.5V into 1μF), preventing floating outputs and latch-up risks. |
| Reverse-Voltage Trip | 50mV threshold - blocks reverse current before parasitic body diode conduction, protecting upstream supplies in multi-rail systems. |
Pinout & Package
AP22814BM8-13 is housed in a thermally enhanced MSOP-8 package with exposed pad (recommended to be connected to GND for optimal power dissipation). Pin assignments are validated per Diodes DS39137 Rev. 3-2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (MSOP-8) | OUT | Switched output node; requires 0.1μF ceramic + ≥10μF bulk capacitor to GND for stability and hot-swap immunity. |
| 2 (MSOP-8) | GND | Power and signal reference ground; must be low-impedance connection to PCB ground plane. |
| 3 (MSOP-8) | FLG | Open-drain fault flag; pulls low during over-current or over-temperature events after 6ms deglitch window. |
| 4 (MSOP-8) | EN | Active-low enable input; logic low ≤0.65V disables switch and activates discharge; must not float. |
| 5 (MSOP-8) | IN | Input power rail connection; requires 1μF X7R/X5R ceramic bypass capacitor placed adjacent to pin. |
| 6–7 (MSOP-8) | IN | Dual IN pins share input current path; reduce trace resistance and improve thermal distribution. |
| 8 (MSOP-8) | NC | No internal connection; electrically isolated; may be left unconnected or tied to GND for mechanical stability. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Output Discharge | 90–130Ω internal path discharges VOUT to <0.5V in ≤0.4ms (1μF), eliminating need for external discharge FET/resistor. |
| Reverse-Voltage Protection | 50mV comparator trip with 6ms delay prevents reverse current flow without external diodes or controllers. |
| Auto-Recovery Over-Current | Clamps output at 3.45A typ during overload; recovers automatically once fault clears - no manual reset required. |
| Thermal Shutdown with Hysteresis | Shuts down at +140°C junction temp; re-enables only after cooling ≥+35°C - prevents thermal cycling instability. |
| UVLO with 180mV Hysteresis | Enables switching only above 2.0V and disables cleanly below 1.6V - ensures reliable startup/shutdown in noisy 3.3V rails. |
Applications
| USB 3.0 Port Power Switching | SSD Power Rail Sequencing |
|---|---|
|
Use Scenario: Hot-plug insertion of USB 3.0 peripherals into ultrabook or docking station ports with 120μF downstream capacitance. IC Role / Device Role / Timing Role: High-side load switch controlling VBUS delivery; provides inrush limiting, short-circuit protection, and FLG fault signaling to host controller. Use Value: Prevents bus voltage droop and host controller reset during plug-in; 6ms FLG blanking avoids false disconnect reports from capacitor charging transients. |
Use Scenario: Controlled power-up of NAND flash and controller ICs in M.2 SATA/NVMe SSD modules with staggered voltage requirements. IC Role / Device Role / Timing Role: Independent 3.0A power rail switch enabling precise timing between 3.3V I/O and 1.2V core rails. Use Value: Eliminates need for discrete MOSFET + gate driver + protection IC; soft-start rise time (2.1ms) prevents supply coupling noise across shared PCB planes. |
| Ultrabook Power-Up Sequencing | Tablet PC Battery Backup Switchover |
|
Use Scenario: Enabling auxiliary power domains (e.g., keyboard backlight, touch controller) only after main SoC rail stabilizes. IC Role / Device Role / Timing Role: Logic-controlled high-side switch activated by PMIC GPIO; coordinates with system power manager via EN and FLG signals. Use Value: Reduces standby current leakage via 0.1μA shutdown current; reverse-voltage blocking prevents backfeed from always-on rails into disabled domains. |
Use Scenario: Seamless transition from AC adapter to battery power during unplugging, with no output voltage interruption or reverse current. IC Role / Device Role / Timing Role: Bidirectional isolation switch placed between battery charger output and system VDD; blocks reverse current when adapter is disconnected. Use Value: 50mV reverse-voltage threshold ensures immediate MOSFET turn-off before battery discharges into adapter circuitry, extending battery life and preventing thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP22814AW5-7 | SOT25 package (vs. MSOP-8); same 3.0A rating, 50mΩ RDS(ON), but higher RθJA (123°C/W vs. 165°C/W) and no exposed pad. | Better suited for space-constrained layouts where thermal mass is lower; less effective for sustained 3A loads in ambient >60°C. | Select when board area is critical and peak load duration is short; verify thermal derating using RθJA = 123°C/W. |
| TCK107BG,TL | Toshiba part; 3.5A rating, 32mΩ RDS(ON), active-high EN only, no integrated discharge function. | Lacks output discharge and reverse-voltage protection; requires external 10kΩ pull-down on EN and external discharge FET for safe hot-swap. | Choose only if lower on-resistance is mandatory and system design accommodates added external components and complexity. |
Compared with AP22814AW5-7, the AP22814BM8-13 offers superior thermal performance via exposed-pad MSOP-8 and integrated discharge - critical for compact ultrabook chassis. Versus TCK107BG,TL, it reduces BOM count and layout area by embedding protection functions that otherwise require discrete support circuitry.
Availability
AP22814BM8-13 is available at Aetrix Electronics and suitable for USB 3.0 port management, SSD power sequencing, and ultrabook subsystem power control requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for AP22814BM8-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for computing, consumer, and industrial markets.
The AP228xx family targets USB-compliant hot-swap and power-domain isolation in portable computing platforms, emphasizing integration of protection, sequencing, and thermal resilience in minimal footprint packages.
FAQ
What is the maximum continuous output current rating for AP22814BM8-13?
The AP22814BM8-13 is rated for 3.0A continuous output current under recommended operating conditions (VIN = 2.7V to 5.5V, TA ≤ +85°C, with proper PCB thermal design). This is confirmed in the Recommended Operating Conditions table of DS39137 Rev. 3-2, distinguishing it from the 2.5A AP22804 variant.
Does AP22814BM8-13 require external components for over-current fault debouncing?
No. The device includes a built-in 6ms deglitch timer on the FLG pin, which prevents false over-current reporting during capacitor inrush events. This eliminates the need for external RC filters or microcontroller firmware debouncing, as verified in the Electrical Characteristics table (tBLANK = 2–13ms).
How does the reverse-voltage protection function operate in AP22814BM8-13?
The device monitors VOUT – VIN; if the difference exceeds +50mV for ≥6ms, the internal MOSFET turns off to block reverse current. Recovery occurs automatically when the condition is removed, with no latch or external intervention required - detailed in the Application Information section of DS39137.
Can AP22814BM8-13 be used with 3.3V-only systems without 5V present?
Yes. Its 2.7V to 5.5V input range fully supports 3.3V operation. All specifications - including 50mΩ RDS(ON), 3.0A current limit, and 2.1ms rise time - are characterized down to 3.3V, and UVLO (2.0V) ensures reliable turn-on even with marginal 3.3V rails.
AP22814BM8-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 3A
- Rds On (Typ):
- 50mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
AP22814BM8-13 FAQ
1.How can I place an order for AP22814BM8-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP22814BM8-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP22814BM8-13 reliable?
The price and inventory of AP22814BM8-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP22814BM8-13 is usually 5 days.
3.What payment methods are accepted for AP22814BM8-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP22814BM8-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP22814BM8-13?
AP22814BM8-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP22814BM8-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP22814BM8-13?
For technical support, including AP22814BM8-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP22814BM8-13 requirements.
6.How does Aetrix verify that AP22814BM8-13 is sourced from the original manufacturer or authorized distributors?
All AP22814BM8-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP22814BM8-13 meets industry standards.
7.What is the process for return or replacement of AP22814BM8-13?
All AP22814BM8-13 units undergo pre-shipment inspection (PSI). If there is an issue with AP22814BM8-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP22814BM8-13 part is unused and in its original packaging.
Return procedure for AP22814BM8-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP22814BM8-13 Tags
-
TPS22919DCKR
Texas Instruments
-
MIC2091-1YM5-TR
Microchip Technology
-
MIC2090-1YM5-TR
Microchip Technology
-
TPS22995RZFR
Texas Instruments
-
TPS22975DSGR
Texas Instruments
-
SIP32510DT-T1-GE3
Vishay Siliconix
-
ULN2003D1013TR
STMicroelectronics
-
MIC2005A-1YM5-TR
Microchip Technology
-
MIC2005A-1YM6-TR
Microchip Technology
-
TPS22916BYFPR
Texas Instruments
-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
