Diodes Incorporated AP22816BKBWT-7
- Part No.:
- AP22816BKBWT-7
- Manufacturer:
- Diodes Incorporated
- Package:
- SOT-23-5 Thin, TSOT-23-5
- Datasheet:
-
AP22816BKBWT-7.pdf
- Description:
- USBPOWERSWITCHTSOT25T&R3K
- Quantity:
- Payment:

- Shipping:

Inventory:1,355
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP22816BKBWT-7 from Diodes Incorporated is a single-channel, active-low enable, high-side load switch optimized for USB 2.0/3.x and hot-swap applications. It delivers 1.0A continuous output current with 75mΩ RDS(ON), integrated reverse-current blocking, overcurrent/overtemperature/short-circuit protection with auto-recovery, and 0.6ms typical soft-start rise time. Used in Ultrabook power sequencing and SSD power rails.
For engineers reviewing the AP22816BKBWT-7 datasheet, AP22816BKBWT-7 pinout, AP22816BKBWT-7 application, or AP22816BKBWT-7 equivalent, key selection criteria include active-low EN logic compatibility, 2.7–5.5V input range, 6ms FLG deglitch timing, integrated output discharge, and TSOT25 package thermal performance (RθJA = 123°C/W).
Technical Context
The AP22816BKBWT-7 implements a thermally robust N-channel MOSFET high-side switch with bidirectional current sensing and UVLO (2.3V typ. turn-on, 180mV hysteresis). Its fault management uses a dedicated open-drain FLG pin with 6ms blanking to suppress false triggers during capacitive inrush.
It integrates reverse-voltage protection (trip at 70mV VOUT–VIN), output discharge (140Ω typical RDIS, 0.4ms tDIS), and thermal shutdown at +150°C with +40°C hysteresis-enabling autonomous recovery without external circuitry in transient overload conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports full USB 2.0/3.x bus voltage tolerance and legacy 3.3V/5V system rails. |
| RDS(ON) | 75mΩ (typ.) at 5V, 1A - enables <100mV drop at rated load, minimizing power loss and self-heating in compact layouts. |
| Output Current Limit | 1.5A (typ.) - clamps sustained overloads to prevent damage while maintaining partial functionality under short-circuit. |
| FLG Blanking Time | 6ms (typ.) - filters transient inrush spikes from heavy capacitive loads (e.g., 120μF SSD rail), eliminating need for external RC filtering. |
| Output Discharge Resistance | 140Ω (typ.) - safely discharges 10μF output capacitance to <0.5V in ≤0.4ms, preventing backfeed and ensuring clean power-down sequencing. |
| Thermal Shutdown Threshold | +150°C with +40°C hysteresis - allows safe cyclic operation during prolonged overload, enabling self-recovery without host intervention. |
| Reverse-Voltage Trip Point | 70mV (typ.) - blocks reverse current when VOUT exceeds VIN by ≥70mV, protecting upstream sources in multi-rail systems. |
Pinout & Package
AP22816BKBWT-7 is housed in a RoHS-compliant, lead-free TSOT25 (SOT-25) package (2.9mm × 1.6mm × 0.8mm), featuring matte tin-plated leads solderable per MIL-STD-202 Method 208 (e3). Thermal resistance is RθJA = 123°C/W on standard FR-4 PCB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 GND | Power Ground Reference | Primary return path for internal control circuitry and power switch; must be low-inductance connection to system ground plane. |
| 2 EN | Active-Low Enable Input | Drives internal driver when pulled low (≤0.5V); high-impedance when pulled high (>1.5V); requires pull-up for default-off behavior. |
| 3 OUT | Switched Output Terminal | Connects to load; requires 0.1μF ceramic + ≥10μF bulk capacitor to GND for stability and short-circuit energy absorption. |
| 4 IN | Input Power Supply | Accepts 2.7–5.5V source; requires 1μF X7R/X5R ceramic bypass cap placed adjacent to pin to suppress high-frequency noise. |
| 5 FLG | Open-Drain Fault Flag | Asserts low during overcurrent/overtemperature events after 6ms deglitch; requires external pull-up resistor (e.g., 10kΩ) to host GPIO. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Output Discharge | 140Ω internal discharge FET ensures controlled VOUT decay to <0.5V within 0.4ms, eliminating need for external discharge resistors in space-constrained designs. |
| Auto-Recovery Protection | Overcurrent, short-circuit, and overtemperature faults trigger automatic current limiting or shutdown, then resume normal operation once fault clears-no reset required. |
| Reverse-Current Blocking | Prevents backflow from VOUT to VIN when VOUT > VIN +70mV, critical for isolated power domains and battery-backed subsystems. |
| UVLO with Hysteresis | Enables switching only above 2.3V (rising) and disables below 2.12V (falling), preventing erratic operation during brown-out or hot-plug insertion. |
| ESD Robustness | 2kV HBM / 500V CDM rating ensures reliability during board handling and system integration without additional protection components. |
Applications
| Ultrabook Power Sequencing | USB Peripheral Port Switching |
|---|---|
Use Scenario: Controlled power-up/down of discrete subsystems (e.g., PCIe SSD, Thunderbolt controller) in dual-battery Ultrabook platforms. IC Role / Device Role / Timing Role: High-side load switch with active-low EN and FLG reporting, coordinating with EC firmware for staggered rail activation. Use Value: Prevents inrush-induced voltage droop on shared 3.3V/5V rails and enables precise fault logging via FLG pulse duration and polarity. | Use Scenario: Hot-swap isolation of USB 3.2 Gen 1 downstream ports supporting up to 900mA per port. IC Role / Device Role / Timing Role: USB-compliant power switch with 0.6ms soft-start and reverse-current blocking to meet USB-IF electrical compliance. Use Value: Eliminates bus contention during cable insertion/removal and prevents backfeed into host controller during device removal. |
| Solid-State Drive (SSD) Power Rail | Set-Top Box Power Management |
Use Scenario: Primary 3.3V power switch for M.2 NVMe SSD modules requiring fast, reliable turn-on and fault containment. IC Role / Device Role / Timing Role: Load switch with 1.0A rating, 75mΩ RDS(ON), and integrated discharge to meet JEDEC JESD22-A114 ESD requirements. Use Value: Enables rapid power cycling during firmware updates and isolates SSD faults from main SoC power domain. | Use Scenario: Independent power control for HDMI receiver, tuner, and storage subsystems in multi-function STB platforms. IC Role / Device Role / Timing Role: Single-channel distribution switch with thermal auto-recovery, allowing safe operation under variable ambient temperatures (−40°C to +85°C). Use Value: Reduces standby power leakage (<1µA shutdown current) and provides real-time fault visibility via FLG to MCU supervisor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP22816AKBWT-7 | Identical specs except active-high EN logic (VIL ≤ 0.5V, VIH ≥ 1.5V) | Requires inverted GPIO drive or level-shifting if host MCU lacks configurable polarity | Select when system control logic natively supports active-high enable signaling. |
| TCK107AG,LF | Higher RDS(ON) (100mΩ), no integrated discharge, 2.5–5.5V range, 1.2A limit | Lacks reverse-current blocking and FLG deglitch; requires external discharge resistor | Choose for cost-sensitive, non-USB applications where 0.6ms soft-start and reverse blocking are not mandatory. |
Compared with AP22816AKBWT-7, AP22816BKBWT-7 simplifies interface design in systems with active-low reset/enable buses; versus TCK107AG,LF, it delivers superior system-level robustness through integrated discharge, reverse-current blocking, and fault blanking-reducing BOM count and layout area.
Availability
AP22816BKBWT-7 is available at Aetrix Electronics and suitable for Ultrabook power sequencing, USB peripheral port switching, and SSD power rail applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for AP22816BKBWT-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, computing, and industrial markets.
The AP22816/17/18 family targets USB-compliant hot-swap and power-distribution applications, delivering integrated protection, precise current limiting, and compact packaging for space-constrained portable and embedded systems.
FAQ
What is the function of the FLG pin on AP22816BKBWT-7?
The FLG pin is an open-drain fault flag that asserts low (≤0.4V) when overcurrent, short-circuit, or overtemperature conditions occur. It incorporates a 6ms deglitch timeout to ignore transient inrush events, and remains low until all faults are cleared. An external pull-up resistor (typically 10kΩ) is required to interface with host microcontroller GPIO inputs.
Does AP22816BKBWT-7 require external components for basic operation?
No external components are required for core switching functionality. However, Diodes recommends a 1μF ceramic capacitor between IN and GND, a 0.1μF ceramic + ≥10μF bulk capacitor between OUT and GND, and a pull-up resistor on FLG. These ensure stable operation, inrush suppression, fault reporting, and compliance with USB hot-swap specifications.
How does AP22816BKBWT-7 handle reverse current flow?
AP22816BKBWT-7 blocks reverse current by turning off the internal N-MOSFET when VOUT exceeds VIN by ≥70mV (typ.), detected by an internal comparator. This occurs within 5ms (typ.) and prevents backfeed into upstream supplies-critical for multi-rail systems and battery-powered devices where cross-conduction must be avoided.
Can AP22816BKBWT-7 be used in automotive applications?
AP22816BKBWT-7 is not AEC-Q100 qualified and is intended for commercial/industrial applications. For automotive use, Diodes offers AEC-Q100 qualified alternatives such as the AP22653Q (TSOP-6, 3A) or AP22916Q (TDFN-8, 6A). Contact Diodes technical support for PPAP-capable, IATF 16949-manufactured variants meeting automotive change-control requirements.
AP22816BKBWT-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- SOT-23-5 Thin, TSOT-23-5
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N/P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 1A
- Rds On (Typ):
- 75mOhm
- Input Type:
- Inverting
- Features:
- Load Discharge
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current, Short Circuit, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TSOT-25
AP22816BKBWT-7 FAQ
1.How can I place an order for AP22816BKBWT-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP22816BKBWT-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP22816BKBWT-7 reliable?
The price and inventory of AP22816BKBWT-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP22816BKBWT-7 is usually 5 days.
3.What payment methods are accepted for AP22816BKBWT-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP22816BKBWT-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP22816BKBWT-7?
AP22816BKBWT-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP22816BKBWT-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP22816BKBWT-7?
For technical support, including AP22816BKBWT-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP22816BKBWT-7 requirements.
6.How does Aetrix verify that AP22816BKBWT-7 is sourced from the original manufacturer or authorized distributors?
All AP22816BKBWT-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP22816BKBWT-7 meets industry standards.
7.What is the process for return or replacement of AP22816BKBWT-7?
All AP22816BKBWT-7 units undergo pre-shipment inspection (PSI). If there is an issue with AP22816BKBWT-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP22816BKBWT-7 part is unused and in its original packaging.
Return procedure for AP22816BKBWT-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP22816BKBWT-7 Tags

-
TPS22919DCKR
Texas Instruments

-
MIC2091-1YM5-TR
Microchip Technology

-
MIC2090-1YM5-TR
Microchip Technology

-
TPS22995RZFR
Texas Instruments

-
TPS22975DSGR
Texas Instruments

-
SIP32510DT-T1-GE3
Vishay Siliconix

-
ULN2003D1013TR
STMicroelectronics

-
MIC2005A-1YM5-TR
Microchip Technology

-
MIC2005A-1YM6-TR
Microchip Technology

-
TPS22916BYFPR
Texas Instruments

-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

