Diodes Incorporated AP22818BKBWT-7

Overview

AP22818BKBWT-7 from Diodes Incorporated is a 2.0A single-channel high-side load switch with active-low enable, 75mΩ R_DS(ON), 2.7–5.5V input range, and integrated reverse-current blocking, overcurrent/overtemperature/short-circuit protection. It serves as a USB-compliant hot-swap power distribution switch in ultrabook power sequencing and SSD power rails.

For engineers reviewing the AP22818BKBWT-7 datasheet, AP22818BKBWT-7 pinout, AP22818BKBWT-7 application, or AP22818BKBWT-7 equivalent, key selection criteria include active-low logic compatibility, 6ms FLG deglitch timing, 0.6ms typical rise time, and TSOT25 package thermal resistance (123°C/W) for high-density portable designs.

Technical Context

The AP22818BKBWT-7 implements a thermally protected N-channel MOSFET power switch with bi-directional current sensing and UVLO (2.3V typ. turn-on, 180mV hysteresis). Its internal discharge FET provides 140–200Ω resistive path to safely bleed output capacitance when disabled.

Protection logic combines fast short-circuit response (<20µs t_D(OFF)) with auto-recovery overcurrent limiting (2.7A typ. ILIMIT at 4.5V), thermal shutdown at +150°C (40°C hysteresis), and reverse-voltage detection (70mV trip point, 5ms trigger delay) - all without external components.

Key Specifications

Pinout & Package

AP22818BKBWT-7 uses the TSOT25 (K-variant) 5-pin ultra-thin surface-mount package (1.6mm × 1.6mm × 0.55mm), optimized for space-constrained mobile PCBs. Matte tin-plated leads meet MIL-STD-202 solderability requirements.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side load switch applications.

Compared with TCK107AG and TPS22916BYFPR, AP22818BKBWT-7 uniquely integrates reverse-voltage protection, 6ms FLG blanking, and output discharge in a 5-pin TSOT25 - making it the only solution requiring zero external components for full USB 3.0 hot-swap compliance.

Availability

AP22818BKBWT-7 is available at Aetrix Electronics and suitable for ultrabook power sequencing, SSD hot-plug interfaces, and set-top box peripheral management requiring stable component supply across industrial temperature ranges (−40°C to +85°C).

Supply support for AP22818BKBWT-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal devices for power management, signal integrity, and connectivity applications.

The AP22816/17/18 family targets USB-compliant hot-swap and high-density portable power distribution, emphasizing integration of protection, timing control, and thermal resilience in minimal footprint packages.

FAQ

What is the function of the FLG pin on AP22818BKBWT-7?

The FLG pin is an open-drain fault flag that asserts low after a 6ms deglitch timeout when overcurrent, short-circuit, or overtemperature conditions occur. It remains low until both fault conditions clear, and requires an external pull-up resistor. Its blanking time prevents false triggering during normal inrush into large output capacitors (e.g., 120μF SSD rails).

Does AP22818BKBWT-7 provide reverse-current blocking, and how does it work?

Yes - it blocks reverse current when VOUT exceeds VIN by ≥70mV (typ.), turning off the internal MOSFET within 5ms. This prevents backfeed from downstream 5V loads into upstream 3.3V supplies, a critical requirement in multi-rail systems like ultrabooks where SSDs may retain charge after host power removal.

Can AP22818BKBWT-7 be used with 3.3V-only systems?

Yes - its 2.7–5.5V input range fully supports 3.3V operation. At 3.3V, R_DS(ON) increases to ~90mΩ (vs. 75mΩ at 5V), resulting in ≤600mW conduction loss at 2A. Thermal performance remains adequate in TSOT25 (R_θJA = 123°C/W) up to +70°C ambient with standard PCB copper.

How does the output discharge function operate, and what is its design impact?

When EN̅ is pulled high (disabled), an internal 140–200Ω discharge FET connects OUT to GND, discharging output capacitance to <0.5V in ≤0.4ms (with 1μF load). This eliminates residual voltage that could cause backfeed or latch-up in multi-rail systems, removing the need for external bleed resistors and simplifying layout.