Diodes Incorporated AP22818BM8-13

Overview

AP22818BM8-13 from Diodes Incorporated is a 2.0A single-channel high-side load switch optimized for USB and hot-swap applications, featuring 75mΩ R_DS(ON), 2.7V–5.5V input range, integrated output discharge, reverse-current blocking, and active-low enable logic in an MSOP-8 package. It delivers controlled power sequencing in ultrabooks and SSDs with auto-recovery overcurrent, short-circuit, overtemperature, and UVLO protection.

For engineers reviewing the AP22818BM8-13 datasheet, AP22818BM8-13 pinout, AP22818BM8-13 application, or AP22818BM8-13 equivalent, this page provides verified functional specifications, real-world timing behavior (t_R = 2.1ms typ., t_D(OFF) = 20µs), fault flag deglitching (6ms), and design-meaningful parameter context for USB-compliant power distribution systems.

Technical Context

The AP22818BM8-13 implements a thermally robust N-channel MOSFET high-side switch with bi-directional current sensing and integrated driver control. Its UVLO threshold (2.3V typ.) and 180mV hysteresis ensure stable turn-on during rail ramp-up, while the 6ms FLG deglitch window prevents false fault reporting during capacitive inrush transients.

Reverse-voltage protection triggers at 70mV (typ.) V_OUT–V_IN differential with 5ms response time, and thermal shutdown activates at +150°C with +40°C hysteresis-enabling safe cycling under sustained overload without external intervention.

Key Specifications

Pinout & Package

AP22818BM8-13 is housed in a thermally efficient, RoHS-compliant MSOP-8 package (3.0mm × 3.0mm × 1.0mm) with matte tin-plated leads solderable per MIL-STD-202 Method 208 (e3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side load switch applications.

Compared with TPS22916BLYR and RT9711CGQW, AP22818BM8-13 uniquely integrates reverse-voltage protection, output discharge, and 6ms fault blanking in a single MSOP-8 package-reducing BOM count and PCB area while enabling USB-compliant hot-swap without design compromises.

Availability

AP22818BM8-13 is available at Aetrix Electronics and suitable for ultrabook power sequencing, USB-C hot-swap port protection, and SSD power enable applications requiring stable component supply, full RoHS compliance, and UL/CB safety certification.

Supply support for AP22818BM8-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP22818 belongs to Diodes' AP228xx family of integrated load switches-designed specifically for USB-compliant hot-swap, portable computing, and solid-state storage systems demanding robust fault protection and minimal external components.

FAQ

What is the function of the FLG pin on AP22818BM8-13?

The FLG pin is an open-drain fault indicator that asserts low (≤0.4V) when overcurrent, short-circuit, or overtemperature conditions occur. It features a built-in 6ms deglitch timer to ignore transient inrush events, and remains low until all fault conditions clear-enabling direct connection to microcontroller GPIOs without external filtering.

Does AP22818BM8-13 support reverse-current blocking, and how does it operate?

Yes. AP22818BM8-13 blocks reverse current when V_OUT exceeds V_IN by ≥70mV (typ.), turning off the internal MOSFET within 5ms. This prevents backfeed from downstream circuits into the input rail-a critical feature for multi-rail systems like USB-C where VBUS may be powered independently.

Can AP22818BM8-13 drive a 120μF output capacitor in USB applications?

Yes. The device's 2.0A current limit, 75mΩ R_DS(ON), and 2.1ms typical rise time are validated for 120μF loads per Diodes' typical application circuit. A minimum 10μF MLCC or 100μF electrolytic capacitor is required at OUT to meet USB inrush specifications and prevent input ringing during hot-plug events.

What is the thermal performance of AP22818BM8-13 in MSOP-8 package?

In standard JEDEC 51-7 2oz copper test board conditions, AP22818BM8-13 has R_θJA = 165°C/W and R_θJC = 33°C/W. At 2A load and 5V input, power dissipation is ~300mW, resulting in ~50°C junction-to-ambient rise-well below the +150°C thermal shutdown threshold, even at +85°C ambient.