Diodes Incorporated AP22908CN4-EVM

Overview

AP22908CN4-EVM from Diodes Incorporated is an evaluation module for the AP22908 1.5A single slew-rate-controlled P-channel load switch, designed to validate high-side power switching in low-voltage portable systems. It supports input voltages from 1.08V to 3.6V, delivers ≤28mΩ R_DS(ON) at 3.6V, enables controlled turn-on (105μs typical rise time), integrates output discharge (80Ω), and draws only 0.05µA quiescent current - used for rapid prototyping of battery-powered load management in smartphones and wearables.

For engineers reviewing the AP22908CN4-EVM datasheet, AP22908CN4-EVM pinout, AP22908CN4-EVM application, or AP22908CN4-EVM equivalent, this page provides verified functional context, board-level interface details, supported test configurations, thermal layout guidance, and direct correlation to the AP22908 IC's electrical behavior under real-world load transients and enable sequencing.

Technical Context

The AP22908CN4-EVM implements the AP22908 IC in X1-WLB0909-4 package with solder-ball mounting, providing direct access to VIN, VOUT, GND, and ON pins via 0.1" pitch headers and test points. It includes recommended 1µF input and 0.1µF output ceramic decoupling capacitors per Diodes' layout guidelines, and exposes the internal 80Ω discharge FET path between VOUT and GND when disabled.

Board operation reflects the IC's active-high enable logic, slew-controlled turn-on (105μs at 3.6V), fast turn-off (5μs), and thermal performance validated up to 1.5A continuous load - enabling accurate measurement of R_DS(ON), output voltage droop, inrush suppression, and discharge decay time under defined ambient and PCB copper conditions.

Key Specifications

Availability

AP22908CN4-EVM is available at Aetrix Electronics and suitable for smartphone power sequencing validation, wearable device battery rail control, portable medical instrument load isolation, and USB-C peripheral power management requiring stable component supply and rapid design-in support.

Supply support for AP22908CN4-EVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and the Americas.

The AP22908CN4-EVM belongs to Diodes' Load Switch Evaluation Platform family, engineered to accelerate qualification of high-efficiency, low-voltage P-channel load switches in space-constrained portable electronics.

FAQ

What is the primary function of the AP22908CN4-EVM?

The AP22908CN4-EVM is a dedicated evaluation board for the AP22908 1.5A slew-rate-controlled load switch IC. It provides a ready-to-use platform to verify turn-on/off timing, inrush current suppression, output discharge behavior, R_DS(ON) performance, and thermal response under real load conditions - without requiring custom PCB design.

Does the AP22908CN4-EVM support multiple AP22908 package variants?

No - the AP22908CN4-EVM is specifically configured for the X1-WLB0909-4 package (orderable part AP22908CN4-7). It does not accommodate U-WLB0909-4 or SOT26 variants due to mechanical and pad-layout differences; each requires its own dedicated evaluation board.

How is the output discharge feature implemented and verified on this board?

The board routes the AP22908's internal 80Ω discharge FET directly between VOUT and GND. When the ON pin is pulled low, the output voltage decays exponentially - measurable via the VOUT test point using an oscilloscope. The decay time constant (τ ≈ R_DIS × C_OUT) matches datasheet expectations with the onboard 0.1µF capacitor.

Can the AP22908CN4-EVM be used for thermal characterization?

Yes - the board uses a JEDEC-standard 2s2p multilayer test board (3" × 3", 1oz internal planes, 2oz outer traces), matching the thermal resistance data (R_θJA = 136°C/W) published in the AP22908 datasheet. Temperature measurements at the IC body or solder balls correlate directly to junction temperature estimates under 1.5A load.