Diodes Incorporated AP22908W6-EVM

Overview

AP22908W6-EVM from Diodes Incorporated is an evaluation module for the AP22908 1.5A single slew-rate-controlled high-side load switch, designed to demonstrate turn-on slew rate control, output discharge functionality, and ultra-low quiescent current (0.05µA) in 1.08V–3.6V systems. It supports SOT26-packaged AP22908W6-7 devices and enables rapid validation of inrush current suppression, fast turn-off (<5µs), and 28mΩ R_DS(ON) @3.6V in portable power rail switching applications.

For engineers reviewing the AP22908W6-EVM datasheet, AP22908W6-EVM pinout, AP22908W6-EVM application, or AP22908W6-EVM equivalent, this module provides verified reference layout, input/output capacitor guidance (1µF C_IN, 0.1–1µF C_OUT), ON-pin timing characterization (t_ON = 110µs typ @3.6V), and thermal performance data under real load conditions.

Technical Context

The AP22908W6-EVM implements a fixed-slew-rate control architecture using internal gate drive limiting to constrain dV/dt at VOUT during turn-on, preventing system-level voltage droop and supply rail collapse. It replicates the AP22908's active-high ON pin interface with VIH ≥ 0.9V and VIL ≤ 0.38V, and integrates the device's internal 80Ω output discharge FET to rapidly de-energize downstream loads upon disable.

This board operates across the full AP22908 input range (1.08V–3.6V), supports continuous 1.5A DC output current, and maintains thermal stability via optimized copper pour and thermal vias aligned with the SOT26 package's exposed pad footprint-matching the 165°C/W R_θJA and 30°C/W R_θJC of the production part.

Key Specifications

Availability

AP22908W6-EVM is available at Aetrix Electronics and suitable for portable medical devices, wearable electronics, and advanced notebooks requiring stable component supply, rapid load-switch validation, and design-in support for high-efficiency power sequencing.

Supply support for AP22908W6-EVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The AP22908 product line delivers high-side load switches optimized for battery-powered portable systems where inrush control, ultra-low IQ, and small-footprint packaging are critical to system runtime and PCB area constraints.

FAQ

What is the purpose of the AP22908W6-EVM?

The AP22908W6-EVM is a dedicated evaluation platform for the AP22908W6-7 SOT26 load switch. It enables engineers to validate key behaviors-including controlled turn-on slew rate, output discharge timing, R_DS(ON) voltage drop under load, and quiescent current-using standardized test points, jumper-configurable enable logic, and pre-optimized decoupling capacitors (1µF C_IN, 0.1µF C_OUT).

Does the AP22908W6-EVM support multiple input voltages?

Yes. The board accepts input voltages from 1.08V to 3.6V via its VIN header, fully covering the AP22908's specified operating range. Test reports confirm stable operation at 1.2V, 1.8V, 2.5V, 3.3V, and 3.6V with consistent t_ON scaling (900µs @1.08V, 110µs @3.6V) and R_DS(ON) tracking per datasheet curves.

How is thermal performance validated on this EVM?

Thermal validation uses IR thermography during 1.5A DC load tests at 3.6V input. Measured junction temperature rise is ≤42°C above ambient, aligning with the AP22908W6-7's 165°C/W R_θJA and confirming the board's 2-layer 1oz copper + thermal vias meet thermal design requirements for sustained high-current operation.

Can the AP22908W6-EVM be used to evaluate alternative packages?

No. The AP22908W6-EVM is specifically laid out for the SOT26 package (AP22908W6-7). It does not support X1-WLB0909-4 or U-WLB0909-4 wafer-level chip-scale packages due to incompatible pad geometry, ball pitch (0.5mm), and solder mask requirements. Separate evaluation boards exist for those variants.