Diodes Incorporated AP2301AMP-13

Overview

AP2301AMP-13 from Diodes Incorporated is a single-channel, current-limited high-side power switch optimized for USB bus and hot-swap applications. It features 70 mΩ on-resistance at 5 V, 2.5 A accurate current limiting, reverse current blocking, and integrated output discharge. Designed for use in laptop USB ports and docking stations, it delivers fast 2 µs short-circuit response and built-in 7 ms deglitching on the FLG pin.

For engineers reviewing the AP2301AMP-13 datasheet, AP2301AMP-13 pinout, AP2301AMP-13 application, or AP2301AMP-13 equivalent, key selection criteria include active-low enable logic, thermal shutdown at 140°C, UVLO threshold of 2.0 V (with 50 mV hysteresis), and SO-8EP package compatibility with enhanced thermal performance via exposed pad grounding.

Technical Context

The AP2301AMP-13 implements a P-channel MOSFET high-side switch with integrated current-sense FET for over-current detection-eliminating external sense resistors. Its internal discharge path uses an N-MOS transistor activated only when EN is de-asserted, enabling controlled capacitor discharge without external components.

Thermal protection operates at 140°C junction temperature with 20°C hysteresis, cycling the output until fault removal. The FLG pin provides open-drain fault reporting with 7 ms blanking time to suppress false triggers during capacitive load turn-off transients.

Key Specifications

Pinout & Package

AP2301AMP-13 is supplied in MSOP-8EP (exposed pad) package, where the exposed pad must be externally connected to GND for thermal management and is not used as primary electrical ground conduction path.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side load switch applications.

Compared with TPS22965DSGR and RT9711CGQW, AP2301AMP-13 uniquely combines active-low enable, integrated discharge, 70 mΩ on-resistance, and 7 ms deglitched FLG-making it optimal for USB-compliant hot-swap systems requiring zero external components for safe, reliable power control.

Availability

AP2301AMP-13 is available at Aetrix Electronics and suitable for USB 3.0 port protection, laptop docking station power switching, and industrial USB hub power management requiring stable component supply, long-term lifecycle support, and RoHS-compliant green packaging.

Supply support for AP2301AMP-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.

The AP2301A/AP2311A family targets USB-compliant hot-swap and high-side power distribution, emphasizing integration of protection, control, and diagnostics in compact surface-mount packages for space-constrained consumer and computing platforms.

FAQ

What is the purpose of the exposed pad on the AP2301AMP-13 MSOP-8EP package?

The exposed pad serves as a thermal interface-not a primary electrical ground path. It must be soldered to a PCB copper area connected to GND to reduce thermal resistance (θ_JA = 92°C/W). Using it as sole ground conduction risks voltage drop and instability in high-current paths.

Can AP2301AMP-13 drive a 2.2 A continuous load at 85°C ambient?

Yes-its 2.5 A current limit remains functional across -40°C to +85°C. At 85°C ambient and 5 V input, R_DS(ON) rises to ≤105 mΩ, resulting in ~470 mW conduction loss. With proper PCB thermal design (θ_JA = 92°C/W), junction temperature stays below 150°C maximum rating.

How does the FLG pin behave during normal startup with a 120 µF output capacitor?

FLG remains high during startup because the 7 ms deglitch timer prevents assertion during initial inrush. Only sustained over-current (>7 ms duration) or thermal fault triggers FLG low-ensuring no false alarms during legitimate capacitive load charging.

Is reverse current blocking active when the device is disabled but IN remains powered?

Yes-reverse current blocking is inherent to the P-MOS high-side architecture and remains fully functional regardless of EN state. When disabled, the channel is off and leakage is limited to ≤0.01 µA at V_OUT = 5 V and V_IN = 0 V, preventing battery drain in dual-power systems.