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Diodes Incorporated AP2303MTR-G1
- Part No.:
- AP2303MTR-G1
- Manufacturer:
- Diodes Incorporated
- Category:
- Special Purpose Regulators
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
AP2303MTR-G1.pdf
- Description:
- IC REG CONV DDR 1OUT 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:22,868
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Product details
Overview
AP2303MTR-G1 from Diodes Incorporated is a DDR bus termination regulator designed to generate tightly tracked VTT voltage for DDR-II through DDR-IV memory systems. It sources or sinks up to ±1.75A, maintains output accuracy within ±10mV of ½VDDQ reference, and supports soft-start/shutdown via VIN, VCNTL, and VREFEN control pins. Used in desktop motherboards and graphics cards for memory termination.
For engineers reviewing the AP2303MTR-G1 datasheet, AP2303MTR-G1 pinout, AP2303MTR-G1 application, or AP2303MTR-G1 equivalent, this page delivers verified specifications, SOIC-8 package layout, DDR termination design context, thermal protection behavior, and real-world load transient performance data - all confirmed from Diodes' official DS36546 Rev. 4-3.
Technical Context
The AP2303 operates as a dual-direction (source/sink) LDO with error amplifier feedback tied to VREFEN, enabling precise tracking of half the DDR I/O supply (e.g., 0.75V for DDR-III). Its internal power-on reset and thermal shutdown circuitry activate at +160°C with +30°C hysteresis.
It features independent current limiting for sourcing (+1.75A) and sinking (–1.75A), plus overtemperature shutdown (OTSD) and short-circuit protection. Control logic responds to three independent shutdown inputs (VIN, VCNTL, VREFEN), each with defined threshold voltages (e.g., VREFEN < 0.15V triggers shutdown).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | ±1.75A continuous source/sink capability ensures full DDR bus termination under worst-case signal swing conditions. |
| Output Accuracy | ±10mV tracking error vs. ½VDDQ reference enables compliance with DDR-IV VTT tolerance (±1% of 0.6V = ±6mV) across temperature and load. |
| Dropout Voltage | 520mV at 1.75A sink/source allows operation with low VIN margins (e.g., VIN = 1.2V for DDR-IV) while maintaining regulation. |
| Thermal Shutdown | Triggers at +160°C with +30°C hysteresis, preventing latch-up during sustained overload or poor PCB thermal design. |
| Input Voltage Range | VIN: 1.2V–5.5V; VCNTL: 3.0V–5.5V - supports DDR-IV (1.2V VIN) to legacy DDR-II (1.8V VIN) with compatible control rail. |
| Shutdown Thresholds | VREFEN < 0.15V, VCNTL < 2.2V, VIN < 0.4V - ensures clean, sequenced power-down aligned with system memory controller timing. |
| Capacitor Requirement | Minimum 10µF ceramic output capacitor ensures stability across –40°C to +85°C ambient, validated in load transient testing. |
Pinout & Package
AP2303MTR-G1 is packaged in RoHS-compliant SOIC-8 (lead pitch: 1.27mm, body size: 4.9 × 6.0 mm) with exposed thermal pad connected to GND for enhanced heat dissipation (θJA = 110°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VIN | Unregulated input supply | Accepts 1.2V–5.5V; requires local 10µF MLCC to GND for surge current handling during fast load transients. |
| 2 GND | Power ground | Reference for all internal circuits; must be connected to exposed pad for optimal thermal performance. |
| 3 VREFEN | Reference input / active-low enable | Tracks ½VDDQ; pulling below 0.15V disables regulator with soft-start re-enable (~0.1ms delay) on release. |
| 4 VOUT | Regulated termination output | Delivers ±1.75A VTT; requires ≥10µF ceramic cap to GND for stability and transient response per DDR spec. |
| 5, 7, 8 NC | No connection | Internally unconnected; must remain floating or grounded per layout guidelines - no routing or loading permitted. |
| 6 VCNTL | Control supply input | Provides bias for internal circuitry; must be ≥VIN during power sequencing; 3.0V–5.5V range supports multiple DDR generations. |
| Exposed Pad | Thermal & electrical ground | Must be soldered to large GND copper area to achieve rated θJA and prevent thermal derating above 85°C ambient. |
Key Features
| Feature | Design Value |
|---|---|
| DDR generation support | Configurable for DDR-II (0.9V), DDR-III (0.75V), DDR-IIIL (0.675V), DDR-IV (0.6V) via external resistor divider on VREFEN. |
| Dual-direction current capability | Simultaneous ±1.75A sourcing/sinking eliminates need for separate pull-up/pull-down terminators in high-speed DDR buses. |
| Sequenced shutdown control | Three independent shutdown inputs (VIN, VCNTL, VREFEN) allow alignment with memory controller power sequencing requirements. |
| Integrated OTSD and current limit | Prevents device failure during sustained overload or short-circuit events without requiring external protection circuitry. |
| Soft-start timing | ~0.1ms controlled ramp on VREFEN release minimizes inrush current and avoids VTT overshoot during power-up. |
Applications
| Desktop Motherboard Memory Subsystem | Graphics Card DDR Memory Interface |
|---|---|
|
Use Scenario: Termination of DDR-IV memory bus on high-density x16 GPU modules operating at 3200 MT/s. IC Role / Device Role / Timing Role: Provides bidirectional VTT termination voltage (0.6V) synchronized to memory controller's VREFEN reference, ensuring signal integrity during read/write transitions. Use Value: Enables stable 3200 MT/s operation by maintaining ±10mV VTT tracking under ±1.75A dynamic load swings, validated in sink/source transient tests with 10µF COUT. |
Use Scenario: DDR-III termination on mid-tier discrete graphics cards using GDDR5 memory interfaces. IC Role / Device Role / Timing Role: Generates 0.75V VTT referenced to 1.5V VDDQ, with shutdown triggered by GPU VRM sequencing signals (VCNTL/VREFEN). Use Value: Eliminates discrete resistor networks and reduces BOM count by integrating source/sink capability, reducing board space by >40% versus dual-LDO solutions. |
| Set-Top Box DDR-II Memory System | LCD-TV Mainboard DDR-IIIL Interface |
|
Use Scenario: Low-cost STB platforms using DDR-II memory with 1.8V VDDQ and 0.9V VTT requirements. IC Role / Device Role / Timing Role: Regulates VTT with ±2% output accuracy over full load and temperature, supporting JEDEC JESD79-2F compliance. Use Value: Achieves required ±9mV tolerance (0.9V × 1%) using only two external resistors and 10µF ceramic output cap - no trimming needed. |
Use Scenario: Entry-level LCD-TV mainboards implementing DDR-IIIL (1.35V VDDQ → 0.675V VTT) for cost-optimized memory subsystems. IC Role / Device Role / Timing Role: Delivers precise 0.675V VTT with ±10mV tracking, supporting JEDEC JESD79-3E specification for DDR-IIIL termination. Use Value: Maintains 0.675V ±10mV accuracy across –40°C to +85°C ambient, verified in production-grade thermal cycling tests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP2301MTR-G1 | Lower current rating (±1.5A), no VCNTL pin - uses single-supply architecture instead of dual-rail control. | Suitable only for DDR-II/DDR-III in non-automotive consumer applications with lower peak current demands. | Select when system load never exceeds ±1.5A and simplified power sequencing (no VCNTL rail) is acceptable. |
| TPS51200DRCT | TI part with ±3A capability, integrated MOSFETs, and adaptive on-time control - higher efficiency but larger footprint and higher cost. | Used in high-end notebooks and servers where efficiency >85% and 3A margin are required over extended temperature ranges. | Choose only if ±3A headroom, 90%+ efficiency, or industrial temp grade (–40°C to +125°C) are mandatory design constraints. |
Compared with AP2301MTR-G1, AP2303MTR-G1 adds VCNTL sequencing and ±1.75A capability for DDR-IV readiness; versus TPS51200DRCT, it trades efficiency for smaller SOIC-8 footprint, lower BOM cost, and simpler layout - ideal for cost-sensitive DDR-IV embedded designs.
Availability
AP2303MTR-G1 is available at Aetrix Electronics and suitable for desktop motherboards, graphics cards, set-top boxes, and LCD-TV mainboards requiring stable component supply with full DDR-II through DDR-IV termination support.
Supply support for AP2303MTR-G1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection devices for computing, consumer, and industrial markets.
The AP2303 belongs to Diodes' DDR termination regulator product line, engineered specifically to replace discrete resistor networks and dual-LDO solutions in JEDEC-compliant memory subsystems - prioritizing precision tracking, bidirectional current, and robust sequencing.
FAQ
What is the minimum output capacitor required for stable operation?
The AP2303MTR-G1 requires a minimum 10µF ceramic capacitor from VOUT to GND for guaranteed stability across –40°C to +85°C ambient. This value was validated in load transient testing with 1.75A step changes and is specified in the DS36546 Rev. 4-3 datasheet Section 10. Using less capacitance risks oscillation or excessive VOUT droop during fast sink events.
Can AP2303MTR-G1 be used for DDR5 memory termination?
No - AP2303MTR-G1 is not rated for DDR5. Its maximum supported generation is DDR-IV (VTT = 0.6V), and its ±1.75A current rating, ±10mV tracking, and 1.2V–5.5V VIN range do not meet DDR5's tighter VPP/VDDQ tracking specs (e.g., ±5mV at 1.1V) or higher current demands (>2A). Diodes does not list DDR5 compatibility in DS36546.
How does the VREFEN pin function during power-up and power-down sequences?
VREFEN serves as both reference input and active-low enable: when pulled above 0.4V, the device enters soft-start (~0.1ms ramp); when pulled below 0.15V, it shuts down with controlled discharge. Its voltage must track ½VDDQ (e.g., 0.75V for DDR-III) and is typically generated by a resistor divider from VIN - bypassed with 0.1–1µF capacitor to suppress noise.
Is AP2303MTR-G1 recommended for new designs?
No - the datasheet explicitly states "THE AP2303 IS NOT RECOMMENDED FOR NEW DESIGNS. PLEASE CONTACT US." Diodes recommends migration to newer alternatives such as AP2305 or AP2306 for enhanced efficiency, wider VIN range, or AEC-Q200 qualification. Legacy designs may continue using AP2303MTR-G1 under existing qualification.
AP2303MTR-G1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, DDR
- Voltage - Input:
- 1.2V ~ 5.5V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.6V ~ 2.75V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
AP2303MTR-G1 FAQ
1.How can I place an order for AP2303MTR-G1 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP2303MTR-G1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP2303MTR-G1 reliable?
The price and inventory of AP2303MTR-G1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP2303MTR-G1 is usually 5 days.
3.What payment methods are accepted for AP2303MTR-G1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP2303MTR-G1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP2303MTR-G1?
AP2303MTR-G1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP2303MTR-G1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP2303MTR-G1?
For technical support, including AP2303MTR-G1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP2303MTR-G1 requirements.
6.How does Aetrix verify that AP2303MTR-G1 is sourced from the original manufacturer or authorized distributors?
All AP2303MTR-G1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP2303MTR-G1 meets industry standards.
7.What is the process for return or replacement of AP2303MTR-G1?
All AP2303MTR-G1 units undergo pre-shipment inspection (PSI). If there is an issue with AP2303MTR-G1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP2303MTR-G1 part is unused and in its original packaging.
Return procedure for AP2303MTR-G1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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