My Inquiry
My Account
Diodes Incorporated AP2311AM8-13
- Part No.:
- AP2311AM8-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
AP2311AM8-13.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,505
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP2311AM8-13 from Diodes Incorporated is a single-channel, active-high enable, high-side power switch optimized for USB bus and hot-swap applications. It delivers 2.5A accurate current limiting, 70mΩ typical RDS(ON), fast 2µs short-circuit response, reverse current blocking, and integrated output discharge - all in an MSOP-8 package. It supports 2.7V–5.5V input voltage and operates from –40°C to +85°C ambient.
For engineers reviewing the AP2311AM8-13 datasheet, AP2311AM8-13 pinout, AP2311AM8-13 application, or AP2311AM8-13 equivalent, key selection criteria include enable polarity (active-high), thermal shutdown threshold (140°C), FLG blanking time (7ms), and compatibility with heavy capacitive loads in USB port protection and dual-purpose HDMI/MHL charging interfaces.
Technical Context
The AP2311AM8-13 integrates a P-channel MOSFET high-side switch with current-sense FET-based over-current detection and N-channel discharge transistor. Its UVLO circuit activates at 2.0V (typ) with 50mV hysteresis, ensuring reliable turn-on only after stable rail establishment.
Thermal protection uses die-temperature sensing with 140°C trip and 20°C hysteresis, enabling auto-recovery cycling during sustained overload. The open-drain FLG output reports faults with built-in 7ms deglitching, eliminating false triggers from inrush or transient capacitive discharge.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Current Limit | 2.5A typical - clamps output current precisely to prevent damage during overload without external components. |
| RDS(ON) | 70mΩ @ 5V, 25°C - minimizes conduction loss and self-heating in compact MSOP-8 footprint. |
| Short-Circuit Response | 2µs - enables rapid current limiting before energy dissipation causes thermal stress. |
| Enable Polarity | Active-high - simplifies interface with standard logic-level microcontrollers and USB host controllers. |
| Input Voltage Range | 2.7V–5.5V - covers full USB 2.0/3.0 VBUS range and accommodates brown-out margin. |
| Discharge Resistance | 105Ω - provides controlled, safe discharge of output capacitance when disabled (e.g., hot-unplug). |
| FLG Blanking Time | 7ms - suppresses false fault reporting during capacitive load turn-on transients. |
Pinout & Package
AP2311AM8-13 is housed in a thermally enhanced MSOP-8 package (3.0mm × 3.0mm × 1.0mm), featuring an exposed pad for improved thermal dissipation. Pin 1 is GND; pins 2 and 3 are tied IN inputs; pin 4 is active-high EN; pin 5 is open-drain FLG; pins 6 and 7 are tied OUT outputs; pin 8 is NC (recommended tied to OUT).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 1) | Power ground reference | Primary return path for internal current sense and thermal monitoring; must connect to PCB ground plane. |
| IN (Pins 2, 3) | Input voltage supply | Dual-pinned for low-inductance connection to 0.1µF ceramic bypass capacitor near device. |
| EN (Pin 4) | Enable control input | Active-high logic input; asserts switch when ≥2V; disables discharge function when deasserted. |
| FLG (Pin 5) | Fault reporting output | Open-drain, active-low signal with 7ms deglitch; indicates over-current or over-temperature events. |
| OUT (Pins 6, 7) | Switched output | Dual-pinned to reduce trace inductance; connects directly to load or downstream USB port VBUS line. |
| NC (Pin 8) | No internal connection | Not bonded; recommended externally tied to OUT for EMI reduction and mechanical stability. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated output discharge | 105Ω resistive path discharges output capacitance safely on disable - eliminates need for external bleed resistor in USB hot-swap designs. |
| Reverse current blocking | Prevents backflow from loaded output to input rail - critical for shared-bus systems like dual-purpose HDMI/MHL ports. |
| Built-in soft-start | 0.6ms typical rise time limits inrush current into large output capacitors - avoids input rail collapse and false UVLO triggering. |
| Thermal shutdown with hysteresis | 140°C trip / 120°C recovery - enables self-protecting cyclic operation during sustained short-circuit, preserving system uptime. |
| UVLO with hysteresis | 2.0V turn-on / 1.95V turn-off - ensures clean, bounce-free switching during power ramp-up and brown-out conditions. |
Applications
| USB 2.0/3.0 Port Protection | HDMI/MHL Dual-Purpose Charging Port |
|---|---|
Use Scenario: Protecting downstream USB peripherals from over-current, short-circuit, and hot-plug in-lab test equipment and docking stations. IC Role / Device Role / Timing Role: High-side power switch controlling VBUS delivery with real-time current limiting and fault flagging. Use Value: Eliminates need for external polyfuse and discrete discharge circuitry while meeting USB compliance for <2µs fault response. | Use Scenario: Enabling simultaneous video streaming and battery charging via shared HDMI/MHL physical port on set-top boxes and HDTVs. IC Role / Device Role / Timing Role: Active-high controlled power gate that isolates peripheral battery from host during disconnect, with reverse current blocking. Use Value: Prevents uncontrolled discharge of peripheral battery through host when port is inactive - extends battery life and meets MHL power management requirements. |
| Laptop ExpressCard Slot Power Control | Industrial USB Hub with Hot-Swap Support |
Use Scenario: Managing power to ExpressCard expansion slots in ruggedized laptops where card insertion must not disrupt main system rails. IC Role / Device Role / Timing Role: Current-limited, thermally protected high-side switch with fast 2µs fault detection and FLG reporting to EC firmware. Use Value: Enables OS-level driver awareness of slot faults and graceful enumeration failure handling without motherboard-level reset. | Use Scenario: Providing individually protected downstream ports in DIN-rail mounted industrial USB hubs used in factory automation. IC Role / Device Role / Timing Role: Independent per-port power switch with isolated fault reporting and robust 70mΩ RDS(ON) for low thermal rise in confined enclosures. Use Value: Supports continuous operation under partial port failure - one shorted port does not disable others or trigger system-wide shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side power switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP2301AM8-13 | Active-low enable; identical RDS(ON), current limit, and package | Requires inverted control logic; unsuitable where MCU GPIO is limited or pull-up constrained | Select only if system-level enable signal is naturally active-low or inverters are already present. |
| TCK112G,LF | 2.7A current limit; 65mΩ RDS(ON); 1.8V–5.5V input; no integrated discharge | Lacks output discharge function - requires external resistor/capacitor network for same functionality | Choose when lower RDS(ON) is prioritized and board space allows external discharge components. |
Compared with AP2301AM8-13, AP2311AM8-13 offers direct MCU GPIO compatibility without level-shifting; compared with TCK112G,LF, it trades marginal RDS(ON) improvement for integrated discharge and simpler BOM - reducing design risk in USB-compliant hot-swap systems.
Availability
AP2311AM8-13 is available at Aetrix Electronics and suitable for USB port protection, HDMI/MHL dual-purpose charging interfaces, and industrial USB hub designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for AP2311AM8-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, industrial, and computing markets.
The AP23xxA family targets USB-compliant hot-swap and dual-purpose port applications, emphasizing integrated protection, minimal external components, and thermal resilience in space-constrained surface-mount packages.
FAQ
What is the maximum continuous load current supported by AP2311AM8-13?
The AP2311AM8-13 supports a maximum continuous load current of 2.0A per its Recommended Operating Conditions, with a typical current limit threshold of 2.5A. Actual sustained current depends on PCB thermal design: at 25°C ambient with MSOP-8 on 2oz copper, 2.0A yields ~50°C junction rise. Derating is required above 85°C ambient or with reduced copper area.
Does AP2311AM8-13 require external components for basic operation?
No external components are required for core switching functionality. A 0.1µF ceramic capacitor between IN and GND is mandatory for stability. For heavy capacitive loads (>100µF), a 120µF–470µF bulk output capacitor is recommended to manage inrush; no external discharge resistor or fault-filtering RC network is needed due to integrated 7ms FLG deglitch and 105Ω discharge path.
How does the FLG pin behave during thermal shutdown?
During thermal shutdown, the FLG pin asserts low after the 7ms deglitch timeout and remains low until both over-temperature and over-current conditions are fully cleared. It does not pulse or toggle during thermal cycling - it stays asserted continuously while the die temperature exceeds 140°C, providing unambiguous fault latching for host controller polling or interrupt-driven diagnostics.
Can AP2311AM8-13 be used in 3.3V-only systems?
Yes. The AP2311AM8-13 operates across 2.7V–5.5V input, making it fully compatible with 3.3V-only systems. At VIN = 3.3V, RDS(ON) rises to 90mΩ (typ), still enabling 2.0A continuous current with acceptable power loss (≈0.36W). EN logic thresholds scale with VIN, so 3.3V systems meet VIH ≥2V and VIL ≤0.8V requirements without level shifting.
AP2311AM8-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2A
- Rds On (Typ):
- 70mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Slew Rate Controlled, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
AP2311AM8-13 FAQ
1.How can I place an order for AP2311AM8-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP2311AM8-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP2311AM8-13 reliable?
The price and inventory of AP2311AM8-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP2311AM8-13 is usually 5 days.
3.What payment methods are accepted for AP2311AM8-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP2311AM8-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP2311AM8-13?
AP2311AM8-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP2311AM8-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP2311AM8-13?
For technical support, including AP2311AM8-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP2311AM8-13 requirements.
6.How does Aetrix verify that AP2311AM8-13 is sourced from the original manufacturer or authorized distributors?
All AP2311AM8-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP2311AM8-13 meets industry standards.
7.What is the process for return or replacement of AP2311AM8-13?
All AP2311AM8-13 units undergo pre-shipment inspection (PSI). If there is an issue with AP2311AM8-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP2311AM8-13 part is unused and in its original packaging.
Return procedure for AP2311AM8-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP2311AM8-13 Tags
-
TPS22919DCKR
Texas Instruments
-
MIC2091-1YM5-TR
Microchip Technology
-
MIC2090-1YM5-TR
Microchip Technology
-
TPS22995RZFR
Texas Instruments
-
TPS22975DSGR
Texas Instruments
-
SIP32510DT-T1-GE3
Vishay Siliconix
-
ULN2003D1013TR
STMicroelectronics
-
MIC2005A-1YM5-TR
Microchip Technology
-
MIC2005A-1YM6-TR
Microchip Technology
-
TPS22916BYFPR
Texas Instruments
-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
