Diodes Incorporated AP2401B34DNTR-G1

Overview

AP2401B34DNTR-G1 from BCD Semiconductor is a dual-channel CMOS low-dropout (LDO) voltage regulator with fixed 2.8V and 3.3V outputs, fabricated in a DFN-1.8×2-6 package. It delivers up to 200mA per channel, features independent enable controls (CE1/CE2), ±2% output voltage accuracy, 30µV_RMS noise (10Hz–100kHz), and 70dB PSRR at 1kHz-optimized for battery-powered portable electronics requiring clean, sequenced dual-rail power.

For engineers reviewing the AP2401B34DNTR-G1 datasheet, AP2401B34DNTR-G1 pinout, AP2401B34DNTR-G1 application, or AP2401B34DNTR-G1 equivalent, key selection criteria include channel-specific dropout voltage (e.g., 45mV typ. at 30mA for 3.3V channel), independent shutdown capability, thermal resistance (θ_JC = 20°C/W), compatibility with low-ESR ceramic capacitors, and operation across –40°C to +85°C ambient.

Technical Context

The AP2401B34DNTR-G1 integrates two independent CMOS-based LDO regulators sharing a common voltage reference and ground, each with dedicated error amplifier, current-limit circuit (300mA limit), and logic-controlled enable input. Its architecture enables simultaneous or staggered power-up/down of 2.8V and 3.3V rails without cross-talk-induced output disturbance.

Each channel operates with ultra-low quiescent current (25µA typ.) and standby current (0.1µA typ.), and maintains regulation down to VIN = VOUT + 35mV (3.3V channel, 30mA load). The DFN-1.8×2-6 package includes an exposed pad thermally connected to GND for enhanced thermal dissipation.

Key Specifications

Pinout & Package

AP2401B34DNTR-G1 is housed in a 6-pin DFN-1.8×2-6 package with an exposed thermal pad (pin 7, not electrically connected) that must be soldered to a GND copper pour for optimal thermal performance (θ_JC = 20°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel LDO regulator applications.

Compared with AP2401B34DNTR-G1, AP7312-2833DRT-7 offers superior dropout and longevity as a designated successor, while XC6216D2833MR-G trades enable flexibility for footprint reduction-making AP2401B34DNTR-G1 optimal where independent sequencing and legacy design continuity are required.

Availability

AP2401B34DNTR-G1 is available at Aetrix Electronics and suitable for mobile handheld devices, wireless communication modules, portable imaging systems, and industrial sensor nodes requiring stable component supply across extended production cycles.

Supply support for AP2401B34DNTR-G1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

BCD Semiconductor Manufacturing Limited is a China-based fabless analog IC provider specializing in power management, LED drivers, and interface solutions for consumer and industrial markets.

The AP2401 series belongs to BCD's high-efficiency, low-noise LDO portfolio designed specifically for dual-rail battery-powered applications where size, quiescent current, and output accuracy are critical constraints.

FAQ

What are the exact output voltages of AP2401B34DNTR-G1?

The AP2401B34DNTR-G1 provides fixed 2.8V on VOUT1 (pin 2) and fixed 3.3V on VOUT2 (pin 3), as confirmed by its ordering code "B34" (B = active-high enable, 3 = 2.8V channel 1, 4 = 3.3V channel 2) and electrical characteristics tables showing VOUT = 2.8V ±2% and 3.3V ±2% at 30mA load and 25°C.

Can AP2401B34DNTR-G1 operate with a 2.9V input supplying the 3.3V output?

No. At 30mA load, the typical dropout voltage for the 3.3V channel is 45mV; minimum functional VIN is therefore 3.345V. With 2.9V input, the 3.3V channel will be unregulated and drop out. The 2.8V channel remains functional down to VIN ≈ 2.845V, making it viable under the same condition.

Is the exposed pad on the DFN-1.8×2-6 package electrically connected?

No-the exposed pad (EP) is a thermal pad only, not an electrical terminal. Per datasheet Note 1, it must be soldered to a GND copper pour to achieve θ_JC = 20°C/W; leaving it floating degrades thermal performance and risks junction overheating at full 200mA load.

How does the CE1/CE2 logic interface behave during power-up?

CE1 and CE2 are active-high with VIH(min) = 1.3V and VIL(max) = 0.25V. If left floating, internal leakage may cause undefined states; best practice is to tie unused enables to GND via 100kΩ resistors or drive them actively. Both channels remain off until their respective CE pin exceeds 1.3V.