Diodes Incorporated AP2501S-13
- Part No.:
- AP2501S-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
AP2501S-13.pdf
- Description:
- IC PWR SWITCH P-CHANNEL 1:1 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:2,921
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP2501S-13 from Diodes Incorporated is a single-channel, current-limited high-side power switch optimized for USB 2.0 hot-swap applications, featuring 70 mΩ typical RDS(ON), 3.7 A typical current limit, and integrated output discharge. It operates from 2.7 V to 5.5 V input, delivers up to 2.5 A continuous load current, and includes reverse current blocking, over-current, over-temperature, short-circuit, and UVLO protection - deployed in LCD TV power rails and USB hub port control.
For engineers reviewing the AP2501S-13 datasheet, AP2501S-13 pinout, AP2501S-13 application, or AP2501S-13 equivalent, key selection criteria include active-low enable logic, SO-8 package thermal performance (θJA = 96 °C/W), 2 µs short-circuit response time, and 7 ms FLG deglitch timing - all critical for robust USB port power management in consumer electronics.
Technical Context
The AP2501S-13 integrates a P-channel MOSFET high-side switch with internal current-sense FET architecture, enabling accurate 3.7 A current limiting without external sense resistors. Its UVLO threshold is 2.0 V (rising) with 50 mV hysteresis, and thermal shutdown activates at +140 °C with +20 °C hysteresis.
It implements soft-start via built-in slew-rate control (0.6 ms typical tR) and uses an N-channel discharge transistor activated only when disabled, providing 100 Ω typical RDIS for controlled VOUT discharge. The open-drain FLG pin reports faults after 7 ms deglitching, eliminating false triggers during capacitive inrush.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports full USB 2.0 bus voltage range with margin for ripple and drop. |
| Continuous Load Current | 2.5 A - maximum sustained output current before thermal derating applies. |
| RDS(ON) (Typ) | 70 mΩ at VIN = 5 V, TA = +25°C - enables <175 mW conduction loss at 2.5 A, reducing thermal stress in SO-8. |
| Current Limit (Typ) | 3.7 A - clamps fault current to protect downstream circuitry during short circuits. |
| Short-Circuit Response | 2 µs - fast detection and current limiting prevents damage during transient shorts. |
| FLG Blanking Time | 7 ms (typ) - suppresses false fault reporting during output capacitor inrush or load transients. |
| Output Discharge RDIS | 100 Ω - provides controlled VOUT discharge path when disabled, preventing floating rail issues. |
Pinout & Package
AP2501S-13 is supplied in SO-8 package with exposed pad (not electrically connected to GND; requires external thermal connection). Pin functions are validated per Diodes DS35577 Rev. 7–2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 GND | Ground reference | Primary return path for power and signal; must be low-impedance connection to PCB ground plane. |
| 2,3 IN | Power input | Dual pins tied externally; accepts 2.7–5.5 V supply; requires ≥0.1 µF ceramic bypass capacitor adjacent to pins. |
| 4 EN | Enable control | Active-low logic input; drives internal driver to turn on/off high-side P-MOS switch. |
| 5 FLG | Fault reporting | Open-drain output asserted low after 7 ms deglitch upon over-current or over-temperature event. |
| 6,7 OUT | Switched output | Dual pins tied externally; delivers regulated current-limited power to load; includes reverse current blocking. |
| 8 NC | No connect | Internally unconnected; recommended to tie externally to OUT for mechanical stability and EMI reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Output Discharge | 100 Ω discharge path activated only when disabled - eliminates need for external bleed resistor and ensures safe VOUT ramp-down. |
| Fast Short-Circuit Protection | 2 µs response time - limits energy dissipation during hard shorts, preserving MOSFET integrity. |
| UVLO with Hysteresis | 2.0 V turn-on / 1.95 V turn-off - prevents erratic switching near brown-out thresholds in portable USB systems. |
| Reverse Current Blocking | Enabled by P-MOS topology - blocks backfeed from VOUT to VIN when disabled, protecting upstream supplies. |
| Thermal Shutdown Recovery | +140°C trip / +120°C release - autonomous cycling prevents latch-up while maintaining system awareness via FLG. |
Applications
| USB Hub Port Power Control | LCD TV Backlight Supply Switching |
|---|---|
|
Use Scenario: Individual USB 2.0 port on a 4-port hub requiring independent over-current protection and hot-plug compliance. IC Role / Device Role: High-side power switch managing VBUS delivery with current limiting, fault flagging, and automatic discharge on disconnect. Use Value: Eliminates need for discrete fuse + MOSFET + discharge resistor; meets USB-IF current-limit tolerance (±15%) and short-circuit robustness requirements. |
Use Scenario: Backlight LED driver input rail switching in 32-inch LCD TV, where load capacitance exceeds 100 µF and inrush must be controlled. IC Role / Device Role: Hot-swap controller isolating backlight supply from main 5 V rail during firmware-initiated dimming or fault recovery. Use Value: 0.6 ms controlled rise time prevents input rail droop; 70 mΩ RDS(ON) minimizes power loss at 2.5 A backlight peak current. |
| Set-Top Box USB Peripheral Port | Desktop Docking Station Power Management |
|
Use Scenario: Front-panel USB port on cable set-top box supporting flash drives and keyboards, subject to ESD and accidental shorts. IC Role / Device Role: Protected power delivery node with ESD-hardened I/O (2 kV HBM), reverse current blocking, and FLG-driven firmware fault logging. Use Value: Integrated 2 kV HBM/200 V MM ESD protection avoids external TVS diodes; FLG signal enables host MCU to log over-current events without polling. |
Use Scenario: Power distribution to USB-A, HDMI, and Ethernet ports on a laptop docking station with shared 5 V input rail. IC Role / Device Role: Independent channel switch per port, enabling selective power cycling and thermal-aware load shedding. Use Value: SO-8 thermal resistance (96 °C/W) allows parallel operation of multiple AP2501S-13 units on same PCB without forced air; NC pin tied to OUT improves layout symmetry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side current-limited power switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK107AG,215 (Toshiba) | Active-high EN, 50 mΩ RDS(ON), no integrated discharge, 1.8–6 V input range | Lacks output discharge function; requires external resistor for VOUT bleed; better suited for always-on auxiliary rails | Select when discharge is unnecessary and lower RDS(ON) is prioritized over USB-compliant hot-swap behavior. |
| TPS22965DRLR (TI) | Active-high EN, 42 mΩ RDS(ON), 4.5 A current limit, no UVLO, -40°C to +105°C rating | Higher temperature rating but no UVLO or integrated discharge; FLG lacks deglitch; requires external RC filter for noise immunity | Choose for industrial ambient environments >+85°C where UVLO is managed upstream and discharge is handled externally. |
Compared with TCK107AG and TPS22965, the AP2501S-13 uniquely combines active-low enable, integrated discharge, 7 ms FLG deglitch, and USB-optimized 2.7–5.5 V operation - making it the only option among the three qualified for USB 2.0-compliant hot-swap without design compromises.
Availability
AP2501S-13 is available at Aetrix Electronics and suitable for USB hub port control, LCD TV backlight switching, and set-top box peripheral power management requiring stable component supply across consumer electronics production cycles.
Supply support for AP2501S-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for high-volume consumer and industrial markets.
The AP2501S-13 belongs to Diodes' AP25xx family of USB-compliant high-side power switches, designed specifically to replace fuses and discrete MOSFETs in hot-swap applications demanding integrated protection and compact footprint.
FAQ
What is the purpose of the NC pin on AP2501S-13?
The NC (No Connect) pin (Pin 8) has no internal connection and serves no electrical function. Diodes recommends tying it externally to the OUT net to improve mechanical stability during reflow and reduce potential EMI coupling through floating metal. It must not be connected to GND or left floating in production layouts.
Does AP2501S-13 require an external pull-up resistor on the FLG pin?
Yes - the FLG pin is an open-drain output and requires an external pull-up resistor (typically 10 kΩ to VCC or microcontroller I/O rail) to generate a valid logic-high level when no fault is present. Without this resistor, FLG remains undefined during normal operation and cannot interface reliably with monitoring circuitry.
Can AP2501S-13 be used with a 3.3 V input supply?
Yes - AP2501S-13 supports input voltages from 2.7 V to 5.5 V, including 3.3 V nominal rails. At 3.3 V, RDS(ON) increases to 90 mΩ (typ), resulting in ~560 mW conduction loss at 2.5 A; thermal design must verify junction temperature remains below +150°C using θJA = 96 °C/W for SO-8.
How does the output discharge function behave during power-up?
The discharge function activates only when EN is de-asserted (low) or when VIN falls below UVLO threshold (~2.0 V). During power-up with EN held high, discharge is inactive - the output rises via controlled soft-start (0.6 ms tR). Discharge is never active during normal enabled operation, ensuring load retention.
AP2501S-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2.5A
- Rds On (Typ):
- 70mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
AP2501S-13 FAQ
1.How can I place an order for AP2501S-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP2501S-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP2501S-13 reliable?
The price and inventory of AP2501S-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP2501S-13 is usually 5 days.
3.What payment methods are accepted for AP2501S-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP2501S-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP2501S-13?
AP2501S-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP2501S-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP2501S-13?
For technical support, including AP2501S-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP2501S-13 requirements.
6.How does Aetrix verify that AP2501S-13 is sourced from the original manufacturer or authorized distributors?
All AP2501S-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP2501S-13 meets industry standards.
7.What is the process for return or replacement of AP2501S-13?
All AP2501S-13 units undergo pre-shipment inspection (PSI). If there is an issue with AP2501S-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP2501S-13 part is unused and in its original packaging.
Return procedure for AP2501S-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP2501S-13 Tags

-
TPS22919DCKR
Texas Instruments

-
MIC2091-1YM5-TR
Microchip Technology

-
MIC2090-1YM5-TR
Microchip Technology

-
TPS22995RZFR
Texas Instruments

-
TPS22975DSGR
Texas Instruments

-
SIP32510DT-T1-GE3
Vishay Siliconix

-
ULN2003D1013TR
STMicroelectronics

-
MIC2005A-1YM5-TR
Microchip Technology

-
MIC2005A-1YM6-TR
Microchip Technology

-
TPS22916BYFPR
Texas Instruments

-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

