Diodes Incorporated AP2511MP-13
- Part No.:
- AP2511MP-13
- Manufacturer:
- Diodes Incorporated
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
AP2511MP-13.pdf
- Description:
- IC PWR SWITCH P-CHAN 1:1 8MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:55,591
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP2511MP-13 from Diodes Incorporated is a single-channel, current-limited high-side power switch optimized for USB and hot-swap applications. It features active-high enable, 3.7A typical current limiting, 70mΩ typical RDS(ON) at 5V, 2µs short-circuit response time, and integrated output discharge. It operates across 2.7V–5.5V input and delivers up to 2.5A continuous load current in MSOP-8EP package with exposed thermal pad.
For engineers reviewing the AP2511MP-13 datasheet, AP2511MP-13 pinout, AP2511MP-13 application, or AP2511MP-13 equivalent, this device supports robust over-current, over-temperature, reverse-current, and UVLO protection - critical for USB port power management, embedded system hot-swap, and capacitive-load switching where controlled rise time and fault reporting are required.
Technical Context
The AP2511MP-13 integrates a P-channel MOSFET high-side switch with precision current-sense FET architecture enabling accurate 3.7A current limiting without external sensing resistors. Its internal deglitch circuit applies 7ms blanking to the open-drain FLG output, suppressing false fault reports during transient inrush or capacitive discharge events.
It implements soft-start via built-in charge control, achieving 0.6ms typical output rise time, and combines thermal shutdown at +140°C with +20°C hysteresis. The device also provides reverse-current blocking and active output discharge when disabled - eliminating residual VOUT without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Current Limit (Typ) | 3.7A - clamps output current precisely during overload or short-circuit, preventing damage to upstream supply and downstream loads |
| RDS(ON) (Typ @ 5V) | 70mΩ - minimizes conduction loss and self-heating at 2.5A continuous, enabling compact thermal design in MSOP-8EP |
| Short-Circuit Response | 2µs - detects and limits fault current before energy dissipation causes thermal runaway or voltage collapse |
| Output Rise Time (Typ) | 0.6ms - controls inrush into heavy capacitive loads (e.g., 120µF USB ports), reducing input rail droop and EMI |
| FLG Blanking Time (Typ) | 7ms - suppresses false fault assertions during startup or load transients, eliminating need for external RC filtering |
| Input Voltage Range | 2.7V–5.5V - supports full USB 2.0/3.0 bus voltage range and wide-input industrial 3.3V/5V systems |
| Operating Temp Range | −40°C to +85°C - validated for sustained operation in laptops, set-top boxes, and industrial embedded enclosures |
Pinout & Package
AP2511MP-13 is packaged in MSOP-8EP (8-pin mini small outline package with exposed thermal pad), offering enhanced thermal performance (θJA = 92°C/W) versus standard MSOP-8. The exposed pad must be soldered to PCB ground plane for optimal junction temperature control and reliability under 2.5A load.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground Reference | Primary return path for power and logic; connects to PCB ground plane and exposed pad for thermal conduction |
| IN | Power Input | Accepts 2.7V–5.5V supply; requires ≥0.1µF ceramic bypass capacitor placed adjacent to pin |
| EN | Enable Control | Active-high digital input; enables switch when pulled ≥2.0V; leakage <1µA ensures low-power disable state |
| FLG | Fault Reporting | Open-drain output asserted low after 7ms deglitch upon over-current or over-temperature; RON = 20–40Ω |
| OUT | Switched Output | Delivers regulated current to load; all OUT pins internally tied - must be externally connected together |
| NC | No Connect | Internally unconnected; recommended to tie externally to OUT for mechanical stability and noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Output Discharge | Activates automatically on disable, discharging output capacitance through 100Ω internal path - eliminates floating VOUT without external FET or resistor |
| Reverse Current Blocking | Prevents backflow from VOUT to VIN when disabled; reverse leakage <1µA at 5V - essential for multi-rail USB host isolation |
| UVLO with Hysteresis | Turns on only above 2.0V (rising), turns off below 1.95V (falling); prevents erratic switching near brown-out thresholds in portable systems |
| Thermal Protection | Shuts down at +140°C junction temperature with +20°C hysteresis - enables safe auto-recovery during intermittent overload without latch-up |
| ESD Robustness | 2kV HBM / 200V MM rating - withstands handling and board-level ESD events common in manufacturing and field service environments |
Applications
| USB 3.0 Port Power Switching | Laptop Docking Station Load Control |
|---|---|
Use Scenario: Managing power delivery to USB 3.0 downstream ports with 120µF bulk capacitance and hot-plug capability. IC Role / Device Role / Timing Role: High-side power switch providing current-limited, soft-started, and fault-protected VBUS enable. Use Value: Prevents host controller reset due to inrush, blocks reverse current during suspend, and reports faults via FLG to system microcontroller. |
Use Scenario: Enabling/disabling auxiliary 5V rails to HDMI, Ethernet, and USB peripherals in laptop docking stations. IC Role / Device Role / Timing Role: Single-channel load switch with precise current limit and thermal recovery for multi-function expansion interfaces. Use Value: Enables clean power sequencing, avoids bus contention during hot-insertion, and sustains 2.5A per rail without external current sense or thermal monitoring. |
| Set-Top Box USB Hub Management | Industrial Embedded USB Host Interface |
Use Scenario: Power gating USB peripherals (e.g., Wi-Fi dongles, storage drives) in residential gateways and STBs with strict thermal envelopes. IC Role / Device Role / Timing Role: Hot-swap power controller with integrated discharge and UVLO for reliable peripheral enumeration and removal. Use Value: Eliminates need for discrete discharge FET and RC timing networks, reducing BOM count and PCB area while meeting IEC 60950-1 safety certification. |
Use Scenario: Isolating USB host power in DIN-rail mounted controllers where ambient temperature exceeds +70°C and long-term reliability is critical. IC Role / Device Role / Timing Role: Robust high-side switch with −40°C to +85°C operation, reverse-current blocking, and fault-flag reporting for remote diagnostics. Use Value: Maintains stable 2.5A delivery under thermal stress, prevents backfeed into shared 5V bus, and enables predictive maintenance via FLG logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side current-limited power switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TCK107AG,314 (Toshiba) | Lower 2.2A current limit; 100mΩ RDS(ON); no integrated discharge; 5-pin SOT-23 package | Suitable for space-constrained, lower-current USB ports but lacks output discharge and thermal hysteresis | Select when footprint and cost are prioritized over discharge functionality and thermal recovery behavior |
| TPS22965DSGR (TI) | 2.8A current limit; 44mΩ RDS(ON); active-low enable; no UVLO; 6-pin WSON package | Better conduction efficiency but requires external UVLO and discharge circuitry for full USB compliance | Select when lowest RDS(ON) is critical and system-level UVLO/discharge can be implemented externally |
Compared with TCK107AG,314 and TPS22965DSGR, the AP2511MP-13 uniquely integrates discharge, UVLO, 7ms FLG deglitch, and thermal hysteresis in a single MSOP-8EP package - reducing design complexity for USB-compliant hot-swap systems requiring minimal external components and guaranteed fault resilience.
Availability
AP2511MP-13 is available at Aetrix Electronics and suitable for USB 3.0 port power management, laptop docking station load control, and industrial embedded USB host interface applications requiring stable component supply, long lifecycle support, and RoHS-compliant green packaging.
Supply support for AP2511MP-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, computing, and industrial markets.
The AP25xx family targets USB-compliant hot-swap and high-side load switching, emphasizing integration of protection features (discharge, UVLO, thermal hysteresis, FLG deglitch) to simplify system-level power design and reduce bill-of-materials.
FAQ
What is the purpose of the NC pin on AP2511MP-13?
The NC (No Connect) pin is internally unconnected and serves no electrical function. Diodes Incorporated recommends tying it externally to the OUT net for mechanical stability, improved thermal coupling, and reduced noise susceptibility - especially important in high-density layouts with fast-switching loads.
Does AP2511MP-13 require an external pull-up on the FLG pin?
Yes - FLG is an open-drain output and requires an external pull-up resistor (typically 4.7kΩ to 5V or VCC) to generate a valid logic-high level when no fault is present. The internal FLG FET has 20–40Ω on-resistance, ensuring strong low-state drive for reliable fault signaling to microcontrollers or PMICs.
How does the output discharge function behave during power-up?
The discharge function activates only when EN is de-asserted (low) or when VIN falls below UVLO threshold (~2.0V). During normal power-up with EN high, discharge is inactive - ensuring controlled soft-start without premature VOUT collapse. Discharge engages fully within 0.6ms after disable, sinking current through a ~100Ω internal path.
Can AP2511MP-13 be used in dual-purpose HDMI/MHL ports?
No - Diodes Incorporated explicitly advises against using AP2511MP-13 in dual-purpose ports (e.g., HDMI/MHL) where the output may be subjected to constant external voltage while the switch is disabled. The active discharge function would continuously sink current from the MHL link, overstressing the internal discharge transistor and violating safe operating area limits.
AP2511MP-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- P-Channel
- Interface:
- On/Off
- Voltage - Load:
- 2.7V ~ 5.5V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 2.5A
- Rds On (Typ):
- 70mOhm
- Input Type:
- Non-Inverting
- Features:
- Load Discharge, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP-EP
AP2511MP-13 FAQ
1.How can I place an order for AP2511MP-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP2511MP-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP2511MP-13 reliable?
The price and inventory of AP2511MP-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP2511MP-13 is usually 5 days.
3.What payment methods are accepted for AP2511MP-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP2511MP-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP2511MP-13?
AP2511MP-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP2511MP-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP2511MP-13?
For technical support, including AP2511MP-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP2511MP-13 requirements.
6.How does Aetrix verify that AP2511MP-13 is sourced from the original manufacturer or authorized distributors?
All AP2511MP-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP2511MP-13 meets industry standards.
7.What is the process for return or replacement of AP2511MP-13?
All AP2511MP-13 units undergo pre-shipment inspection (PSI). If there is an issue with AP2511MP-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP2511MP-13 part is unused and in its original packaging.
Return procedure for AP2511MP-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP2511MP-13 Tags

-
TPS22919DCKR
Texas Instruments

-
MIC2091-1YM5-TR
Microchip Technology

-
MIC2090-1YM5-TR
Microchip Technology

-
TPS22995RZFR
Texas Instruments

-
TPS22975DSGR
Texas Instruments

-
SIP32510DT-T1-GE3
Vishay Siliconix

-
ULN2003D1013TR
STMicroelectronics

-
MIC2005A-1YM5-TR
Microchip Technology

-
MIC2005A-1YM6-TR
Microchip Technology

-
TPS22916BYFPR
Texas Instruments

-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

