Diodes Incorporated AP2552AFDC-7

Overview

AP2552AFDC-7 from Diodes Incorporated is a single-channel, precision adjustable current-limited high-side power switch in U-DFN2020-6 (Type C) package, featuring active-low enable, 75mA–2.36A programmable current limit (±6% accuracy at 1.632A), 2µs short-circuit response, and integrated reverse-current blocking, over-temperature, UVLO, and fault reporting. It is designed for USB-compliant hot-swap power delivery in laptops and docking stations.

For engineers reviewing the AP2552AFDC-7 datasheet, AP2552AFDC-7 pinout, AP2552AFDC-7 application, or AP2552AFDC-7 equivalent, key selection considerations include its latch-off behavior under over-current, ILIM resistor programming range (10kΩ–210kΩ), thermal shutdown threshold (+140°C under current limit), and FAULT signal blanking time (7.5ms typical).

Technical Context

The AP2552AFDC-7 implements a precision current-sense FET architecture with internal deglitch timing (7ms on FAULT) to suppress false over-current triggers. Its gate driver incorporates slew-rate control to limit dI/dt during turn-on, achieving 1.1ms typical rise time with 1µF load capacitance.

It integrates reverse-voltage protection via a comparator that trips at 95–190mV differential (VOUT–VIN), triggering MOSFET turn-off within 4.75ms and limiting reverse current to 0.72A at 200mV. Thermal shutdown activates at +140°C under sustained current-limit conditions, with +20°C hysteresis.

Key Specifications

Pinout & Package

U-DFN2020-6 (Type C) package: 2.0mm × 2.0mm, 0.5mm pitch, exposed thermal pad (non-electrical, must connect to GND for thermal performance).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side current-limited power switch applications.

Compared with AP22652FDC-7 and TPS22915BYFPR, the AP2552AFDC-7 uniquely combines latch-off behavior, programmable ±6% current limit, and integrated reverse-current limiting-making it optimal for USB-compliant systems where safety-critical fault isolation is required without external components.

Availability

AP2552AFDC-7 is available at Aetrix Electronics and suitable for USB power delivery hubs, laptop docking stations, and residential gateways requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant "Green" packaging.

Supply support for AP2552AFDC-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, industrial, and computing markets.

The AP2552/AP2552A series belongs to Diodes' precision power switch product line, engineered specifically for USB-compliant hot-swap applications demanding accurate current limiting, fast fault response, and integrated reverse-current protection.

FAQ

What is the function of the ILIM pin, and how is current limit set?

The ILIM pin sinks a current proportional to the desired current-limit threshold. A resistor (RLIM) is connected between ILIM and GND to program the limit from 75mA to 2365mA. For example, a 15kΩ resistor sets 1.632A (±6% typical). Layout best practice requires short, low-parasitic traces to maintain accuracy across temperature and process variation.

How does the latch-off behavior differ from constant-current mode?

In AP2552AFDC-7 (A-version), an over-current event triggers current limiting, then after 7.5ms deglitch time, the device latches OFF-output remains disabled until EN is toggled or VIN is cycled. In contrast, non-A versions (e.g., AP2552) maintain constant-current mode indefinitely unless thermal shutdown occurs.

Can AP2552AFDC-7 be used in automotive applications?

AP2552AFDC-7 is not AEC-Q100 qualified and is intended for commercial/industrial use only. Diodes Incorporated explicitly states that automotive-grade variants require separate qualification (PPAP, IATF 16949 manufacturing), and this part lacks those certifications per their product definitions page.

What is the purpose of the exposed thermal pad, and how should it be connected?

The exposed pad is thermally conductive but electrically isolated-no internal silicon connection. It must be soldered to a dedicated GND copper pour (≥100mm² recommended) to dissipate heat and maintain junction temperature below +125°C at 2.1A. It must not serve as the primary GND conduction path for signal return currents.