Diodes Incorporated AP2602FNTR-G1

Overview

AP2602FNTR-G1 from Diodes Incorporated is a resistor-programmable dual-sensor remote temperature switch IC with eight independent NTC-based threshold points, four open-drain active-low overtemperature outputs per sensor pair, and selectable internal/external trigger voltage configuration. It operates from 2.7V to 5.5V, supports -40°C to +125°C ambient range, and delivers guaranteed output validity down to VCC = 0.8V. Used in μP thermal monitoring for high-speed computers and fan control systems.

For engineers reviewing the AP2602FNTR-G1 datasheet, AP2602FNTR-G1 pinout, AP2602FNTR-G1 application, or AP2602FNTR-G1 equivalent, key selection criteria include its 8-channel thermistor-programmable thresholds, dual-sensor wire-or output logic, internal hysteresis (when using internal trigger), QFN-3×3-16 thermal pad grounding requirement, and obsolete status requiring cross-reference validation.

Technical Context

The AP2602 integrates two independent temperature sensing channels, each with four comparator inputs (TMSNS1–TMSNS4 and TMSNS5–TMSNS8) tied to external NTC thermistors and precision resistors. Each channel produces two wire-or outputs (e.g., OT12 = OT1 ∨ OT2), enabling grouped overtemperature detection across multiple thermal zones.

Trigger mode is selected via SEL pin: internal reference (VSEL = VCC) provides fixed VTH/VCC = 0.25 ±1% with built-in hysteresis; external mode (VSEL = GND) accepts VTRIG input (0.5V to 0.4×VCC) with ±15mV offset tolerance against TMSNSX. Deglitch logic ensures noise-immune output transitions.

Key Specifications

Pinout & Package

AP2602FNTR-G1 uses a 16-pin QFN-3×3-16 package with exposed thermal pad (recommended to be connected to GND). Pin 1 is marked by a dot; the thermal pad improves power dissipation and junction-to-board thermal transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar remote temperature switch applications.

Compared with MAX6577HESA+ and LM95235CIMMX/NOPB, the AP2602FNTR-G1 uniquely delivers eight resistor-programmable thresholds with dual-sensor wire-or outputs in a single QFN package-offering hardware autonomy, minimal GPIO usage, and deterministic response time unattainable with I²C sensors or single-threshold switches.

Availability

AP2602FNTR-G1 is available at Aetrix Electronics and suitable for μP thermal monitoring, fan speed control, and automotive cabin climate control requiring stable component supply despite its obsolete status.

Supply support for AP2602FNTR-G1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and thermal solutions for industrial, computing, and automotive markets.

The AP2602 belongs to Diodes' temperature monitoring product line, designed specifically for hardware-based, resistor-configurable thermal protection in space-constrained, high-reliability systems where firmware-independent response is mandatory.

FAQ

Is the AP2602FNTR-G1 still in production?

No-the AP2602FNTR-G1 is officially obsolete and discontinued per Diodes Incorporated's documentation (DS41387 Rev. 2–4). Aetrix Electronics maintains limited legacy stock with full traceability, but new design-ins should evaluate alternatives like the MAX6577HESA+ or LM95235CIMMX/NOPB based on functional requirements.

How is hysteresis implemented in the AP2602FNTR-G1?

Hysteresis is built into the comparator circuitry only when SEL = VCC (internal trigger mode), providing automatic ~2°C typical hysteresis to prevent output chatter near trip points. No hysteresis is present in external VTRIG mode, requiring external RC filtering if noise immunity is needed.

Can the AP2602FNTR-G1 drive a MOSFET gate directly?

Yes-the OTXY outputs are open-drain with 3mA minimum sink current at 0.3V, sufficient to pull down the gate of small-signal MOSFETs (e.g., 2N7002) when paired with a 10kΩ pull-up to VCC. For higher-capacitance gates or faster switching, an external buffer is recommended.

What is the purpose of the exposed thermal pad on the QFN package?

The exposed thermal pad on the AP2602FNTR-G1's QFN-3×3-16 package must be soldered to a GND plane to achieve the specified θJA = 68°C/W. Omitting this connection degrades thermal performance significantly, risking junction overheating above 85°C ambient and premature device failure.