Diodes Incorporated AP33771C-EVB

Overview

AP33771C-EVB from Diodes Incorporated is a USB Type-C® PD 3.1 evaluation board designed to validate sink-side power negotiation between a battery-powered device (TCD) and a USB-C PD charger (PDC). It implements automatic cable voltage drop compensation, supports legacy USB-A-to-C charging, and enables configurable voltage (5–28 V) and current (Auto/1–5 A) requests via resistor-based VSEL/ISEL inputs. The board integrates dual NMOS power switches, moisture detection on DP/DN, and LED-driven status feedback for real-time system monitoring during PD handshake.

For engineers reviewing the AP33771C-EVB datasheet, AP33771C-EVB pinout, AP33771C-EVB application, or AP33771C-EVB equivalent, this evaluation board provides hands-on validation of USB PD 3.1 sink controller behavior-including Extended Power Range (EPR) priority, PDO matching logic, dead-battery wake-up, and OVP/UVP/OCP protection activation-under real-world source capability mismatches and CC flip conditions.

Technical Context

The AP33771C-EVB hosts the AP33771CFBZ-13-FA02 sink controller IC, which executes full USB PD 3.1 compliance including EPR, AVS, and PPS PDO negotiation. It uses external 5.1 kΩ Rd resistors on CC1/CC2 to establish UFP sink identity and relies on resistor ladders (J5/J6 jumpers) to encode requested voltage and current profiles.

Power path control is managed through two DMN3009SFG NMOS FETs (Q1/Q2), enabling VBUS-to-VOUT switching with built-in protections: overvoltage (OVP), undervoltage (UVP), and overcurrent (OCP). Moisture detection is implemented by measuring impedance between DP and DN during plug insertion, triggering fault shutdown if abnormal.

Key Specifications

Availability

AP33771C-EVB is available at Aetrix Electronics and suitable for USB PD 3.1 sink validation, USB-C power negotiation testing, and EPR-capable charger interoperability verification requiring stable component supply and documented reference design fidelity.

Supply support for AP33771C-EVB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors, analog ICs, and mixed-signal solutions, serving automotive, industrial, computing, and consumer markets with high-reliability components.

The AP33771C-EVB belongs to Diodes' USB Power Delivery evaluation platform family, engineered specifically to accelerate development of USB-C powered devices compliant with PD 3.1, EPR, and legacy charging modes.

FAQ

What is the purpose of the J5 and J6 jumpers on the AP33771C-EVB?

J5 and J6 are 8-position header jumpers that select resistor values tied to the ISEL and VSEL pins of the AP33771C IC. J6 sets target input voltage (5–28 V) using 1% tolerance resistors from 100 kΩ to 5.1 kΩ; J5 sets target input current (Auto/1–5 A) using the same resistor ladder. These define the power profile requested during PD negotiation.

How does the AP33771C-EVB indicate a moisture detection event?

When abnormal impedance is detected between DP and DN during USB-C plug insertion, the AP33771C triggers MOISTURE mode: the LED pin outputs a 2-second flicker pattern and VOUT is disabled. This prevents unsafe power delivery in humid or contaminated environments and is confirmed in Section 3.4 of the User Guide.

Does the AP33771C-EVB include internal Rd resistors for CC line termination?

No. As stated in Section 6.1 of the User Guide, the AP33771C IC has no internal Rd resistor; the EVB requires external 5.1 kΩ resistors from CC1 and CC2 to GND (R4 and R5 on schematic) to establish proper sink identity. Omitting these prevents PD negotiation initiation and causes CC direction misrecognition.

Can the AP33771C-EVB be used for ESD testing?

No. Per Section 6.2 of the User Guide, the AP33771C-EVB is designed for functional evaluation only and lacks onboard ESD protection components. Diodes explicitly warns against using it for ESD testing; end-product designs must integrate appropriate TVS diodes or layout-level ESD mitigation before deployment.