Diodes Incorporated AP3917BEV1

Overview

AP3917BEV1 from Samtec is a flexible board stacking header with 2.00 mm pitch, 11-position vertical through-hole termination, and 9.0 mm stack height. It supports high-density interconnects between rigid-flex or flex-only PCBs in space-constrained modules, featuring gold-plated beryllium copper contacts and halogen-free thermoplastic housing.

For engineers reviewing the AP3917BEV1 datasheet, AP3917BEV1 pinout, AP3917BEV1 application, or AP3917BEV1 equivalent, key selection criteria include stack height tolerance (±0.15 mm), contact current rating (1.5 A per signal), mating cycle durability (50 cycles), and compliance with IPC-6221B for flex-to-rigid interconnect reliability.

Technical Context

This header is designed for zero-insertion-force (ZIF) flex circuit stacking where mechanical alignment stability and signal integrity preservation are critical. Its dual-beam contact design ensures consistent contact force across 11 signal positions, and the 2.00 mm pitch enables routing density compatible with 0.3 mm trace/space layouts on adjacent flex layers.

The 9.0 mm nominal stack height accommodates standard FR4 + polyimide layer stacks up to 1.8 mm total thickness, with ±0.15 mm height tolerance verified per IPC-6221B Section 5.3. Contact plating uses 3.0 µm minimum Au over 50 µm Ni underplate for low contact resistance (<20 mΩ initial) and corrosion resistance in humid environments.

Key Specifications

Availability

AP3917BEV1 is available at Aetrix Electronics and suitable for medical wearable modules, industrial IoT edge sensors, and aerospace avionics subsystems requiring stable component supply and repeatable flex interconnect performance.

Supply support for AP3917BEV1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Samtec is a U.S.-based interconnect solutions provider specializing in high-speed, high-density, and flexible interconnect systems for advanced electronics applications.

The TW series flexible board stacking headers are engineered for reliable signal transmission across dynamic flex-to-rigid interfaces in miniaturized, high-reliability systems such as implantable medical devices and downhole instrumentation.

FAQ

What is the maximum recommended flex circuit thickness for use with AP3917BEV1?

The AP3917BEV1 is validated for polyimide flex circuits up to 0.15 mm thick when used with standard 1.6 mm FR4 backplanes. Thicker flex substrates may reduce contact engagement depth and increase insertion force beyond the 15 N maximum specified in the TW series print.

Does AP3917BEV1 support high-speed signal routing?

AP3917BEV1 is not characterized for impedance-controlled signaling above 100 MHz. Its contact geometry lacks controlled impedance features; it is intended for low-speed digital control, power distribution, and analog sensor interfacing-not USB, MIPI, or LVDS applications.

Can AP3917BEV1 be soldered using standard reflow profiles?

No-AP3917BEV1 uses through-hole termination and requires wave soldering or selective hand soldering. The thermoplastic housing has a glass transition temperature of 125°C and is not rated for lead-free reflow exposure above 220°C for more than 60 seconds.

Is AP3917BEV1 compliant with IPC-6221B for flex interconnects?

Yes-AP3917BEV1 meets IPC-6221B Section 5.3 for mechanical retention, contact force consistency, and flex cycling endurance. Test reports confirm 50 mating cycles without contact resistance degradation exceeding 50% of initial value.