Diodes Incorporated AP64502SP-13

Overview

AP64502SP-13 from Diodes Incorporated is a 5A synchronous buck DC-DC converter with 3.8V–40V input range, integrated 45mΩ high-side and 20mΩ low-side MOSFETs, 0.8V ±1% reference, 25µA quiescent current in PFM mode, and SO-8EP package. It delivers regulated output voltage (0.8V to VIN) for industrial power rails, white goods, and network systems requiring EMI-robust, compact step-down conversion.

For engineers reviewing the AP64502SP-13 datasheet, AP64502SP-13 pinout, AP64502SP-13 application, or AP64502SP-13 equivalent, key selection criteria include adjustable 100kHz–2.2MHz switching frequency, Frequency Spread Spectrum (±6% jitter), proprietary ringing-free gate driver, precision enable threshold (1.18V), and integrated cycle-by-cycle current limit with thermal shutdown.

Technical Context

The AP64502 employs fixed-frequency peak current mode control with internal slope compensation to prevent subharmonic oscillation at duty cycles >50%. Its integrated loop compensation eliminates external Type-II/III networks, reducing BOM count while maintaining stability across 0.8V–VIN output configurations.

EMI mitigation combines two hardware-level techniques: a multi-level gate driver that suppresses SW node ringing without degrading edge rates, and Frequency Spread Spectrum (FSS) with ±6% switching frequency jitter to disperse conducted/radiated noise energy across a wider band.

Key Specifications

Pinout & Package

AP64502SP-13 is housed in an SO-8EP (exposed pad) thermally enhanced package with 9 terminals: 8 perimeter pins plus exposed thermal pad electrically tied to GND. The pad must be soldered to a PCB ground plane for thermal performance (θJC = 5°C/W) and EMI suppression.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck converter applications.

Compared with MP2451DT-LF-Z and TPS54560BQPWPRQ1, the AP64502SP-13 delivers higher integration (internal MOSFETs + compensation), superior EMI performance (ringing-free SW + FSS), and optimized thermal design (SO-8EP), making it ideal for space-constrained industrial and consumer applications demanding 5A output with minimal external components.

Availability

AP64502SP-13 is available at Aetrix Electronics and suitable for distributed power bus supplies, white goods control units, and network equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for AP64502SP-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

The AP64502 belongs to Diodes' high-efficiency, EMI-optimized buck converter product line, designed specifically for compact, noise-sensitive applications requiring wide-input operation and robust protection without external compensation.

FAQ

What is the recommended minimum input capacitance for AP64502SP-13?

Diodes recommends ≥20µF total input capacitance (e.g., two 10µF X5R ceramic capacitors) placed within 5mm of VIN and GND pins. This minimizes high-frequency switching noise and prevents voltage droop during 5A load transients. Bulk electrolytic capacitance may be added upstream for low-frequency hold-up, but ceramic capacitors are mandatory for EMI control.

Can AP64502SP-13 operate in forced PWM mode at light loads?

No-the AP64502SP-13 automatically transitions from forced PWM to PFM mode below ~200mA load to minimize quiescent current. It cannot be forced into PWM at light loads. The PFM mode uses zero-cross detection (60mA threshold) and clamps COMP voltage at 950mA peak inductor current, achieving 25µA IQ and 85% efficiency at 5mA.

How is thermal performance affected if the exposed pad is not soldered to GND?

Without soldering the exposed pad to a PCB ground plane, θJA degrades from 45°C/W to >100°C/W, causing junction temperature to exceed 125°C at ≤2A load. This triggers thermal shutdown and risks permanent damage. Diodes mandates full pad soldering with ≥6 thermal vias to inner ground layers per datasheet Section 8.1.

Does AP64502SP-13 support output voltages below 0.8V?

No-the internal reference is fixed at 0.8V ±1%, and the FB pin is designed for resistive divider feedback only. Output voltages below 0.8V are not supported. For sub-0.8V regulation, a different converter with adjustable reference or external error amplifier is required.