Diodes Incorporated AP7176BFN-7

Overview

AP7176BFN-7 from Diodes Incorporated is a 3.0A ultra-low-dropout linear regulator with dual supply inputs (VIN and VCNTL), enable control, and open-drain power-good output. It delivers ±1.5% output voltage accuracy over load, line, and temperature (–40°C to +125°C), supports adjustable VOUT down to 0.8V via external resistor divider, and achieves as low as 300mV dropout at 3A/1.2V output. It is used in FPGA core rail and VTT termination on motherboards and servers.

For engineers reviewing the AP7176BFN-7 datasheet, AP7176BFN-7 pinout, AP7176BFN-7 application, or AP7176BFN-7 equivalent, key selection criteria include its split-power architecture (VIN for power path, VCNTL for bias), 0.3ms soft-start, 90% VREF power-good threshold with 8% hysteresis, and thermal shutdown at +170°C with +50°C hysteresis - all critical for high-reliability sequencing in compute and communications systems.

Technical Context

The AP7176BFN-7 implements a precision 0.8V internal reference with feedback error amplifier driving an nMOS pass element. Its dual-supply design isolates the control circuitry (VCNTL = 3.0–5.5V) from the power path (VIN = 1.2–3.65V), enabling ultra-low dropout and reduced junction-to-case thermal resistance (θJC = 20°C/W in U-DFN3030-10).

Power-on reset monitors both VCNTL (2.5–2.95V rising threshold) and VIN (0.8–1.0V rising threshold) independently; soft-start (0.3–1.2ms) limits inrush current; and PG asserts low after 1–4ms delay when FB falls below 90% VREF, with 10µs debounce to prevent chatter during transients.

Key Specifications

Pinout & Package

AP7176BFN-7 is housed in a 3.0mm × 3.0mm U-DFN3030-10 package with exposed thermal pad (Pin 11), optimized for high-current thermal performance (θJA = 60°C/W, θJC = 20°C/W). The 10-pin layout supports Kelvin sensing and low-inductance grounding.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-dropout, high-current LDO applications.

Compared with TPS7A8300RGRT and RTQ2132BGQW, AP7176BFN-7 uniquely balances dual-supply flexibility, industry-leading thermal performance in U-DFN3030-10, and robust 8% PG hysteresis - making it optimal for FPGA/server applications demanding precise sequencing, high reliability, and board-level thermal management.

Availability

AP7176BFN-7 is available at Aetrix Electronics and suitable for server motherboard VTT rails, FPGA core supplies, notebook CPU I/O domains, and wireless baseband SoC power delivery requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for AP7176BFN-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal ICs, with emphasis on power management, signal integrity, and automotive-grade solutions.

The AP7176B belongs to Diodes' high-current LDO family designed specifically for advanced computing and communications infrastructure, where precise voltage regulation, sequencing control, and thermal resilience are mandatory.

FAQ

What is the minimum recommended output capacitance for AP7176BFN-7 at 3A load?

The datasheet specifies a minimum COUT of 8µF for 3A output current at 25% nominal VOUT deviation, with ESR ≤200mΩ. For optimal transient response and stability across temperature, a 10–22µF X5R/X7R ceramic capacitor placed adjacent to VOUT/GND pins is recommended. Bulk capacitance beyond 100µF may be added in parallel for high-dV/dt loads, but must not compromise phase margin.

Can AP7176BFN-7 operate with VCNTL supplied from a lower voltage than VIN?

Yes - VCNTL (3.0–5.5V) and VIN (1.2–3.65V) are fully independent supplies. VCNTL can be derived from a clean 3.3V or 5V rail regardless of VIN level. This decoupling allows VCNTL to remain active during VIN brownouts, maintaining control logic functionality and enabling graceful shutdown via PG assertion before VOUT collapse.

How does the AP7176BFN-7 handle short-circuit conditions?

Under short-circuit, the device first limits current to 4.2–6.7A (thermal foldback dependent) until FB falls below 0.2V, then reduces limit to 1.1A (typical) to protect both load and regulator. During startup, short-circuit protection is disabled to allow heavy loads to charge output capacitance. Thermal shutdown engages at +170°C, with automatic restart after +50°C cooldown.

Is the exposed pad on AP7176BFN-7 electrically connected, and how should it be routed?

Yes - Pin 11 (GND) and the exposed thermal pad are internally connected to system ground. The pad must be soldered to a solid copper ground plane using ≥4 thermal vias (0.3mm drill, 1mm spacing) to achieve specified θJC = 20°C/W. Do not float the pad or connect it to anything other than GND; improper grounding degrades thermal performance and may cause instability.