Diodes Incorporated AP7312-1833FM-7

Overview

AP7312-1833FM-7 from Diodes Incorporated is a dual-channel, fixed-output low-dropout linear regulator delivering 150mA per channel with independent enable control (EN1/EN2), 1.8V and 3.3V outputs, 60μA typical quiescent current, and 150mV dropout at full load - designed for power rail sequencing in portable battery-powered systems such as Bluetooth headsets and smart handhelds.

For engineers reviewing the AP7312-1833FM-7 datasheet, AP7312-1833FM-7 pinout, AP7312-1833FM-7 application, or AP7312-1833FM-7 equivalent, this device supports fast transient response (150μs start-up), high PSRR (65dB @ 1kHz), and stable operation with 1μF ceramic output capacitors - critical for GSM/TDMA baseband and DSP supply domains requiring rapid load-step immunity and ultra-low standby power.

Technical Context

The AP7312-1833FM-7 integrates two independent LDO channels sharing a common input (IN) and ground (GND), each with dedicated enable inputs (EN1, EN2) and output pins (OUT1 = 1.8V, OUT2 = 3.3V). Its bandgap reference, error amplifier, and thermal shutdown circuitry operate across –40°C to +85°C ambient.

Each channel features current limit (~300mA), short-circuit protection (~60mA), and thermal shutdown at ~165°C with 30°C hysteresis. Dropout voltage remains ≤200mV at 150mA for VOUT ≥2.5V, enabling efficient regulation from 2V–6V input while maintaining ±2% output accuracy over temperature and load.

Key Specifications

Pinout & Package

AP7312-1833FM-7 is housed in a 6-pin DFN2018-6 package (2.0mm × 1.8mm × 0.6mm), featuring an exposed thermal pad for enhanced heat dissipation (θJA = 60°C/W). Pin 4 is GND; Pin 1 is IN; Pins 2 and 3 are EN1 and EN2; Pins 5 and 6 are OUT2 and OUT1 respectively.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output LDO applications.

Compared with AP7312-1833FM-7, the AP7345D-1833FM-7 delivers 42% lower quiescent current and extended thermal robustness without layout change, while the MCP1826S-1833E/DB trades sequencing control for higher current capacity - making the former ideal for migration paths and the latter for cost-sensitive, non-sequenced dual-rail use cases.

Availability

AP7312-1833FM-7 is available at Aetrix Electronics and suitable for Bluetooth headset power management, GSM baseband core supply, wearable sensor hub subsystems, and smart card reader interfaces requiring stable component supply across industrial and consumer production volumes.

Supply support for AP7312-1833FM-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for high-volume electronics markets.

The AP7312 belongs to Diodes' low-quiescent-current LDO portfolio, engineered specifically for battery-constrained portable devices demanding fast transient response, dual-rail flexibility, and robust fault protection in minimal footprint packages.

FAQ

What is the recommended input capacitor for AP7312-1833FM-7?

A minimum 1μF X5R/X7R ceramic capacitor placed between IN and GND is required for stability and noise suppression. The capacitor must be located within 2mm of the IN and GND pins, using wide copper traces. Larger values (e.g., 4.7μF) further improve line transient response without compromising stability.

Can AP7312-1833FM-7 operate with a 1.5V input supply?

No. The absolute minimum input voltage is 2.0V per the datasheet's Recommended Operating Conditions. At 1.5V input, the 3.3V channel cannot regulate - dropout would exceed specification, causing unregulated output and potential system reset. Minimum VIN must be ≥VOUT + dropout (≥3.45V for 3.3V channel).

Is thermal pad connection mandatory for DFN2018-6 package?

Yes. The exposed thermal pad (Pin 4 GND connection) must be soldered to a minimum 25mm² copper pour with ≥3 thermal vias to inner ground planes. Without this, θJA degrades from 60°C/W to >100°C/W, risking thermal shutdown at >80mA load in still-air conditions.

Does AP7312-1833FM-7 require a minimum load current for stability?

No. The device remains stable and regulated at zero load, as confirmed in the Application Note: "Other than external resistor divider, no minimum load is required to keep the device stable." This enables true zero-power standby modes in always-on sensor applications.