Diodes Incorporated AP7315-12FS4-7B

Overview

AP7315-12FS4-7B from Diodes Incorporated is a 150mA low-dropout linear regulator with fixed 1.2V output, ±1% accuracy, 75dB PSRR at 1kHz, 60µVrms output noise (10Hz–100kHz), and 35µA quiescent current. It features enable control, operates from 1.7V to 5.25V input, and targets power-sensitive RF supply rails in portable communication devices.

For engineers reviewing the AP7315-12FS4-7B datasheet, AP7315-12FS4-7B pinout, AP7315-12FS4-7B application, or AP7315-12FS4-7B equivalent, this page delivers verified electrical specs, thermal-aware package layout guidance, EN-controlled shutdown behavior, and real-world load transient performance data for low-noise biasing of RF ICs and camera modules.

Technical Context

The AP7315-12FS4-7B integrates a CMOS-based error amplifier, precision voltage reference, current-limit circuit, and active enable logic-enabling fast turn-on/turn-off transitions with <200µs response to load steps. Its non-discharge architecture maintains output voltage during disable, avoiding unintended discharge of downstream capacitance.

Designed for high-PSRR noise rejection in noisy environments, it achieves 75dB ripple suppression at 1kHz while sustaining stable regulation across –40°C to +85°C ambient, with dropout as low as 0.50V at 150mA for VOUT = 1.2V. The X2-DFN1010-4 package uses an exposed thermal pad tied to GND for enhanced thermal dissipation under continuous 150mA load.

Key Specifications

Pinout & Package

X2-DFN1010-4 (1.0mm × 1.0mm, 0.4mm pitch) with exposed thermal pad. Requires PCB copper area connected to GND for thermal management; pad must not serve as sole GND electrode.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise LDO applications.

Compared with MCP1700-1202E/TO, AP7315-12FS4-7B provides 50% higher current and enable control; versus XC6210B122MR-G, it trades 1.0µVrms noise for superior thermal handling in compact DFN packaging-making it optimal for thermally constrained RF modules.

Availability

AP7315-12FS4-7B is available at Aetrix Electronics and suitable for RF power amplifier bias, camera ISP core rails, and wireless adapter baseband ICs requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for AP7315-12FS4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP7315 series belongs to Diodes' high-PSRR, low-noise LDO product line-designed specifically for noise-sensitive RF, imaging, and portable multimedia subsystems where clean, efficient, and compact voltage regulation is essential.

FAQ

What is the maximum allowable input voltage for AP7315-12FS4-7B?

The absolute maximum input voltage is 6.0V, but recommended operating range is 1.7V to 5.25V. Exceeding 5.25V risks violating safe operating area limits and may trigger internal protection circuits. For 1.2V output, minimum input is 1.7V-ensuring ≥500mV headroom for dropout margin across temperature and load.

Does AP7315-12FS4-7B include output discharge functionality?

No-AP7315-12FS4-7B is the non-discharge variant (indicated by absence of "D" in part number). When disabled via EN pin, VOUT remains floating and retains charge on downstream capacitors. For active discharge, select AP7315D-12FS4-7B, which integrates a 30Ω NMOS discharge path between VOUT and GND.

Can AP7315-12FS4-7B be used with ceramic output capacitors less than 0.47µF?

No-datasheet specifies minimum 0.47µF ceramic capacitor for stability and transient response. Using smaller values risks oscillation or excessive overshoot during 150mA load steps. ESR must remain below 100mΩ; X5R/X7R dielectrics are validated, while Z5U/NP0 require verification per application conditions.

How is thermal performance affected if the X2-DFN1010-4 thermal pad is left unconnected?

Leaving the thermal pad unconnected increases junction-to-ambient thermal resistance by ~40°C/W, causing junction temperature to rise >30°C higher at 150mA load. This risks thermal shutdown or accelerated parametric drift. Diodes recommends connecting the pad to ≥40mm² GND copper area using ≥4 thermal vias for reliable operation at full rated current.