Diodes Incorporated AP7315-23FS4-7B

Overview

AP7315-23FS4-7B from Diodes Incorporated is a 2.3V fixed-output, 150mA low-dropout linear regulator with ±1% output voltage accuracy, 75dB PSRR at 1kHz, and 60µV_rms output noise (10Hz–100kHz), packaged in X2-DFN1010-4. It features enable control, 35µA quiescent current, and operates from 1.7V to 5.25V input, targeting RF supply rails and portable media subsystems.

For engineers reviewing the AP7315-23FS4-7B datasheet, AP7315-23FS4-7B pinout, AP7315-23FS4-7B application, or AP7315-23FS4-7B equivalent, this page delivers verified electrical specs, thermal layout guidance, EN-controlled power sequencing behavior, and validated alternatives for low-noise, space-constrained LDO selection.

Technical Context

The AP7315-23FS4-7B uses a CMOS-based architecture with integrated voltage reference, error amplifier, and current-limit circuitry. Its non-discharge output stage avoids automatic VOUT discharge during shutdown, preserving downstream capacitor charge.

It achieves stable regulation with only 0.47µF ceramic input and output capacitors, supported by low ESR sensitivity and robust load/transient response across –40°C to +85°C ambient. Dropout voltage is 0.34V (typ) at 150mA for 2.3V output.

Key Specifications

Pinout & Package

X2-DFN1010-4 is a 1.0mm × 1.0mm, 0.4mm pitch, 4-pin leadless package with exposed thermal pad. PCB layout requires large copper area under the thermal pad connected to GND for optimal thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with AP7315-23FS4-7B, AP7361-23FS4-7B offers headroom for transient loads without layout change, while MCP1700-2302E/MB trades PSRR and noise performance for extreme quiescent current reduction-making it unsuitable for RF or precision analog use cases.

Availability

AP7315-23FS4-7B is available at Aetrix Electronics and suitable for RF supply, camera sensor I/O, portable media player audio codecs, and wireless adapter baseband cores requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for AP7315-23FS4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP7315 series belongs to Diodes' high-PSRR, low-noise LDO product line, designed specifically for noise-sensitive portable electronics where clean, compact, and efficient local regulation is critical.

FAQ

What is the thermal pad connection requirement for AP7315-23FS4-7B?

The X2-DFN1010-4 package includes an exposed thermal pad that must be connected to a large PCB copper area tied to GND for effective heat dissipation. Do not use the pad solely as the primary GND electrode; instead, use it to enhance thermal conduction while maintaining separate signal GND traces per layout best practices.

Can AP7315-23FS4-7B be used without connecting the EN pin?

Yes - if enable functionality is not needed, tie the EN pin directly to VIN to maintain continuous operation. Leaving EN floating is prohibited, as it may cause erratic regulator behavior or unintended shutdown due to noise coupling.

What capacitor values are mandatory for stable operation?

A minimum 0.47µF ceramic capacitor is required between VIN and GND, and another 0.47µF ceramic capacitor between VOUT and GND. Both must be placed as close as possible to their respective pins to ensure stability, transient response, and PSRR performance across temperature and load conditions.

Does AP7315-23FS4-7B include short-circuit protection?

Yes - it features fold-back current limiting that clamps output current to approximately 55mA when VOUT is shorted to GND. This protects the device from thermal damage during fault conditions and enables safe auto-recovery once the short is removed.