Diodes Incorporated AP7315D-12FS4-7B
- Part No.:
- AP7315D-12FS4-7B
- Manufacturer:
- Diodes Incorporated
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
AP7315D-12FS4-7B.pdf
- Description:
- IC REG LINEAR 1.2V 150MA 4DFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,812
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP7315D-12FS4-7B from Diodes Incorporated is a 150mA low-dropout linear regulator with fixed 1.2V output, ±1% accuracy, 75dB PSRR at 1kHz, 60µVrms output noise (10Hz–100kHz), and 35µA quiescent current - designed for RF supply rails in space-constrained portable devices using the X2-DFN1010-4 package.
For engineers reviewing the AP7315D-12FS4-7B datasheet, AP7315D-12FS4-7B pinout, AP7315D-12FS4-7B application, or AP7315D-12FS4-7B equivalent, key selection criteria include dropout voltage at 150mA (max 0.50V for 1.1V ≤ VOUT < 1.5V), enable threshold compatibility (VEN(H) ≥ 1.3V), thermal pad layout guidance, and discharge functionality versus non-discharge variants.
Technical Context
The AP7315D-12FS4-7B integrates a CMOS-based error amplifier, precision voltage reference, current-limit circuit, and active pull-down transistor for fast output discharge during shutdown. Its architecture supports stable operation with 0.47µF ceramic input/output capacitors and delivers regulated 1.2V from input voltages as low as 1.7V.
Unlike standard AP7315 variants, the "D" suffix denotes built-in auto-discharge functionality: when EN is pulled low, an internal 30Ω N-channel MOSFET connects VOUT to GND, discharging external capacitance within microseconds - critical for sequencing-sensitive systems requiring rapid rail collapse.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.2V ±1% at +25°C; ensures stable core bias for low-voltage RF ICs without external feedback network. |
| Max Output Current | 150mA guaranteed; sufficient for powering single-band RF transceivers or sensor signal chains without thermal derating in DFN1010. |
| PSRR | 75dB at 1kHz; suppresses switching noise from adjacent DC/DC converters feeding noisy power domains. |
| Output Noise | 60µVrms (10Hz–100kHz); preserves SNR in analog front-ends and PLL VCO supply applications. |
| Quiescent Current | 35µA typical; enables >1-year battery life in always-on IoT sensors with periodic wake-up cycles. |
| Dropout Voltage | 0.50V max at 150mA (1.2V output); allows operation from single-cell Li-ion (3.0V min) down to ~1.7V input while maintaining regulation. |
| Enable Threshold | VEN(H) ≥ 1.3V, VEN(L) ≤ 0.5V; compatible with 1.8V/3.3V GPIOs without level-shifting. |
Pinout & Package
X2-DFN1010-4 (1.0mm × 1.0mm, 0.4mm pitch) with exposed thermal pad - requires PCB copper pour connected to GND for optimal thermal performance (θJA ≈ 220°C/W on JEDEC High-K board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 4) | Input power supply | Accepts 1.7V–5.25V; must be decoupled with ≥0.47µF ceramic capacitor placed adjacent to pin. |
| GND (Pin 2) | Ground reference | Primary return path; connects to thermal pad; requires low-impedance plane routing to minimize noise coupling. |
| EN (Pin 3) | Enable control | Active-high logic input; floating state disables regulator; internal pull-down not provided - must be driven. |
| VOUT (Pin 1) | Regulated output | Delivers 1.2V ±1%; includes integrated discharge FET (30Ω) that sinks current to GND when EN = low. |
| Thermal Pad | Thermal dissipation node | Not electrically functional as GND; recommended to connect to large copper area tied to system GND for heat spreading. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Internal 30Ω NMOS pulls VOUT to GND within µs of EN deactivation - eliminates hold-up time in multi-rail power sequencing. |
| Ultra-low noise output | 60µVrms broadband noise enables direct use in VCO, LNA, and ADC reference supplies without additional filtering. |
| High PSRR at low frequency | 75dB rejection at 1kHz suppresses ripple from buck converter switching edges and digital supply coupling. |
| Sub-1V dropout capability | 0.50V max dropout at 150mA allows efficient operation from partially discharged batteries in wearables and trackers. |
| Lead-free & green compliance | Fully RoHS 3 compliant, halogen- and antimony-free (<900ppm Br+Cl, <1000ppm Sb) - meets automotive and medical regulatory requirements. |
Applications
| RF Transceiver Power | Low-Power Sensor Node |
|---|---|
|
Use Scenario: Powers the RF section of Bluetooth LE or Zigbee SoCs in compact IoT edge nodes where EMI sensitivity demands ultra-low noise. IC Role / Device Role / Timing Role: Provides clean 1.2V bias to RF synthesizer and PA driver stages, replacing noisier switching regulators. Use Value: 60µVrms noise and 75dB PSRR prevent reciprocal mixing and phase noise degradation in sub-GHz ISM band receivers. |
Use Scenario: Supplies microcontroller core voltage and analog sensor interface in battery-operated environmental monitors. IC Role / Device Role / Timing Role: Delivers stable 1.2V at 50mA peak load with 35µA quiescent current during sleep mode. Use Value: Enables >3-year operation on CR2032 coin cell by minimizing standby power loss and supporting deep-sleep wake-up integrity. |
| Portable Camera Module | Wearable Biometric Front-End |
|
Use Scenario: Powers image sensor analog supply and ISP core in smartphone front-facing cameras with strict size constraints. IC Role / Device Role / Timing Role: Regulates 1.2V for CIS analog pixel array and column ADC, co-located with sensor die in stacked modules. Use Value: X2-DFN1010-4 footprint (1.0×1.0mm) fits beneath sensor package; 0.50V dropout extends usable battery range during video capture bursts. |
Use Scenario: Supplies optical heart-rate monitor (PPG) analog front-end and ADC in smartwatches with tight thermal budgets. IC Role / Device Role / Timing Role: Delivers low-noise 1.2V to transimpedance amplifier and 16-bit sigma-delta ADC during pulse acquisition. Use Value: Discharge function ensures rapid VOUT collapse between measurement cycles, preventing leakage-induced baseline drift in photodiode bias. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP7315-12FS4-7B | No auto-discharge; VOUT floats after shutdown | Suitable for non-sequenced rails where residual charge is acceptable | Select when sequencing simplicity outweighs need for rapid rail collapse |
| MCP1700T-1202E/TT | 250mA rating, 6µA IQ, but only 60dB PSRR at 1kHz and no discharge FET | Better for ultra-low-power MCU cores; insufficient for RF noise-critical paths | Prefer for battery longevity in always-on logic rails, not RF/analog supplies |
Compared with AP7315-12FS4-7B, the "D" variant adds essential discharge control for sequenced systems, while MCP1700T trades PSRR and noise performance for lower quiescent current - making AP7315D-12FS4-7B optimal for noise-sensitive, sequenced 1.2V analog/RF rails.
Availability
AP7315D-12FS4-7B is available at Aetrix Electronics and suitable for RF transceiver power, portable camera modules, wearable biometric front-ends, and low-power sensor nodes requiring stable component supply across high-mix production runs.
Supply support for AP7315D-12FS4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.
The AP7315 series belongs to Diodes' high-PSRR, low-noise LDO portfolio engineered specifically for noise-sensitive analog and RF subsystems in portable and wireless equipment.
FAQ
What is the purpose of the thermal pad on the X2-DFN1010-4 package?
The thermal pad on AP7315D-12FS4-7B is a mechanical and thermal interface-not an electrical terminal. It must be soldered to a PCB copper pour connected to GND to dissipate heat effectively; leaving it unconnected reduces thermal performance by >40%, risking thermal shutdown under 150mA load at 85°C ambient.
Does the AP7315D-12FS4-7B require an external pull-up on the EN pin?
No external pull-up is required, but the EN pin must never float. It can be tied directly to VIN for always-on operation, or driven by a GPIO with logic-high ≥1.3V and logic-low ≤0.5V. Floating EN causes unpredictable enable/disable behavior due to lack of internal pull-up/down.
How does the auto-discharge feature affect PCB layout?
The internal 30Ω discharge FET activates only when EN = low, sinking VOUT to GND. Layout must avoid placing large capacitance (>10µF) directly on VOUT unless discharge timing is verified - excessive capacitance slows collapse rate and may interfere with downstream power-good signaling.
Can AP7315D-12FS4-7B replace AP7315-12FS4-7B without circuit changes?
Yes, pin-to-pin and functionally compatible - the "D" variant adds discharge capability without altering input/output behavior during regulation. However, if downstream circuitry relies on VOUT remaining high after EN deactivation, the discharge action may require timing analysis or isolation diodes.
AP7315D-12FS4-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.25V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.64V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- 100 µA
- PSRR:
- 75dB (1kHz)
- Control Features:
- -
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1010-4
AP7315D-12FS4-7B FAQ
1.How can I place an order for AP7315D-12FS4-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for AP7315D-12FS4-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP7315D-12FS4-7B reliable?
The price and inventory of AP7315D-12FS4-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP7315D-12FS4-7B is usually 5 days.
3.What payment methods are accepted for AP7315D-12FS4-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP7315D-12FS4-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP7315D-12FS4-7B?
AP7315D-12FS4-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP7315D-12FS4-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP7315D-12FS4-7B?
For technical support, including AP7315D-12FS4-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP7315D-12FS4-7B requirements.
6.How does Aetrix verify that AP7315D-12FS4-7B is sourced from the original manufacturer or authorized distributors?
All AP7315D-12FS4-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP7315D-12FS4-7B meets industry standards.
7.What is the process for return or replacement of AP7315D-12FS4-7B?
All AP7315D-12FS4-7B units undergo pre-shipment inspection (PSI). If there is an issue with AP7315D-12FS4-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP7315D-12FS4-7B part is unused and in its original packaging.
Return procedure for AP7315D-12FS4-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP7315D-12FS4-7B Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

