Diodes Incorporated AP7315D-31FS4-7B
- Part No.:
- AP7315D-31FS4-7B
- Manufacturer:
- Diodes Incorporated
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
AP7315D-31FS4-7B.pdf
- Description:
- IC REG LINEAR 3.1V 150MA 4DFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,940
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP7315D-31FS4-7B from Diodes Incorporated is a 3.1V fixed-output, 150mA low-dropout linear regulator with enable control, ±1% output voltage accuracy, 75dB PSRR at 1kHz, and 60µVrms output noise (10Hz–100kHz). It features CMOS-based architecture, 35µA quiescent current, and operates from 1.7V to 5.25V input - optimized for RF supply rails in portable wireless devices.
For engineers reviewing the AP7315D-31FS4-7B datasheet, AP7315D-31FS4-7B pinout, AP7315D-31FS4-7B application, or AP7315D-31FS4-7B equivalent, key selection criteria include dropout voltage at 150mA (max 290mV for 3.1V output), EN pin logic thresholds (0.5V low / 1.3V high), thermal performance in X2-DFN1010-4, and discharge functionality for fast VOUT decay during shutdown.
Technical Context
The AP7315D variant integrates an internal NMOS pass transistor with auto-discharge capability: when EN is pulled low, a 30Ω on-resistance path actively discharges the output capacitor to GND. Its error amplifier uses a precision bandgap reference and achieves ±1% initial accuracy over temperature (±30ppm/°C drift) and load (0–150mA).
Designed for noise-sensitive analog and RF subsystems, it delivers 75dB ripple rejection at 1kHz and maintains stability with 0.47µF ceramic output capacitors. The regulator's low 60µVrms noise floor and 35µA quiescent current support battery-powered applications requiring extended runtime and clean power delivery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.1V ±1% at 25°C; ensures stable bias for 3.3V-tolerant RF ICs without external feedback network. |
| Max Output Current | 150mA guaranteed; supports moderate-power RF front-end modules and camera sensor interfaces. |
| Dropout Voltage | 290mV max at 150mA (VIN ≥ 3.39V); enables operation from single-cell Li-ion (3.0–4.2V) or 3.3V rail with margin. |
| PSRR | 75dB at 1kHz; suppresses switching noise from adjacent DC/DC converters feeding noisy system rails. |
| Output Noise | 60µVrms (10Hz–100kHz); minimizes phase noise degradation in VCOs and LNAs. |
| Quiescent Current | 35µA typical; extends battery life in always-on sensor or standby communication modes. |
| Enable Thresholds | VEN(H) = 1.3V min, VEN(L) = 0.5V max; compatible with 1.8V/3.3V GPIO without level-shifting. |
Pinout & Package
X2-DFN1010-4 package: 1.0mm × 1.0mm, 0.4mm pitch, thermally enhanced with exposed pad (not electrically connected to GND by default; recommended to tie to GND plane for thermal relief).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 4) | Input power supply | Accepts 1.7–5.25V; requires 0.47µF ceramic decoupling capacitor placed adjacent to pin for transient stability. |
| GND (Pin 2) | Ground reference | Low-impedance return path; must connect directly to PCB ground plane to minimize noise coupling and voltage drop. |
| EN (Pin 3) | Enable control input | Active-high logic; floating state disables regulator; 0.01µA standby leakage preserves battery during shutdown. |
| VOUT (Pin 1) | Regulated output | 3.1V source with integrated discharge FET; drives load and output capacitor; layout must minimize trace inductance. |
| Thermal PAD | Thermal dissipation surface | Non-electrical copper area under package; soldered to GND plane improves θJA by ~30°C/W vs. no pad connection. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | 30Ω NMOS switch between VOUT and GND when disabled - reduces residual output voltage to <100mV within 100µs for safe sequencing. |
| Ultra-low noise output | 60µVrms broadband noise enables direct powering of RF synthesizers without additional filtering. |
| High PSRR at low frequency | 75dB rejection at 1kHz allows co-location with noisy buck converters without dedicated LC filtering. |
| Wide input voltage range | 1.7–5.25V operation supports single-cell Li-ion, USB VBUS, and multi-rail systems without pre-regulation. |
| ±1% output accuracy | Tight tolerance eliminates need for post-production calibration in precision analog signal chains. |
Applications
| RF Power Amplifier Bias | Camera Sensor Core Supply |
|---|---|
|
Use Scenario: Providing clean, stable 3.1V bias to GaAs pHEMT power amplifiers in 4G/5G mobile front-ends. IC Role / Device Role / Timing Role: Low-noise LDO delivering regulated VCC to PA drain while rejecting switching noise from PMIC buck stages. Use Value: 60µVrms noise prevents AM-to-PM distortion; 75dB PSRR maintains EVM <2.5% under dynamic load transients. |
Use Scenario: Powering image sensor analog core (ADC reference, PLL, pixel array) in smartphone rear cameras. IC Role / Device Role / Timing Role: Primary 3.1V supply for sensor's analog domain, synchronized to frame capture timing via EN pin control. Use Value: ±1% accuracy ensures consistent ADC full-scale voltage; auto-discharge clears residual charge before next exposure cycle. |
| Wireless Adapter SoC I/O Rail | Portable Media Player Audio Codec |
|
Use Scenario: Generating 3.1V I/O supply for Wi-Fi/BT combo chips operating in low-power listening mode. IC Role / Device Role / Timing Role: Always-on LDO enabling fast wake-up from deep sleep; EN pin controlled by host processor GPIO. Use Value: 35µA quiescent current extends standby time to >14 days; 150mA headroom supports burst TX/RX current peaks. |
Use Scenario: Supplying DAC/ADC section of audio codec in Bluetooth headphones with Li-po battery input. IC Role / Device Role / Timing Role: Low-noise analog rail decoupled from digital switching noise; shutdown coordinated with playback state. Use Value: 290mV dropout allows full 3.1V output down to 3.39V battery voltage; discharge function prevents pop/click at power-down. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP7315-31FS4-7B | No auto-discharge; VOUT floats high after EN deactivation. | Suitable where output hold time is required (e.g., memory retention), but unsuitable for strict power sequencing. | Select if discharge is unnecessary and cost sensitivity favors non-D variant. |
| MCP1700T-3102E/TT | 250mA output, 6µA IQ, but only 60dB PSRR at 1kHz and no discharge FET. | Better for ultra-low-power MCU peripherals; inadequate for RF noise suppression without added filtering. | Choose only for non-RF, low-IQ applications where 75dB PSRR and fast discharge are not required. |
Compared with AP7315-31FS4-7B, the D-version adds critical discharge control for sequencing-critical systems; versus MCP1700, it trades slightly higher IQ for significantly better noise/PSRR performance essential in RF and high-fidelity analog designs.
Availability
AP7315D-31FS4-7B is available at Aetrix Electronics and suitable for RF power amplifier bias, camera sensor core supply, and wireless adapter SoC I/O rails requiring stable component supply, tight voltage accuracy, and fast shutdown discharge behavior.
Supply support for AP7315D-31FS4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.
The AP7315 series belongs to Diodes' high-PSRR, low-noise LDO product line, engineered specifically for noise-sensitive RF and imaging subsystems in portable electronics where clean, sequenced power delivery is mandatory.
FAQ
What is the purpose of the thermal pad on the X2-DFN1010-4 package?
The thermal pad is a non-electrical copper land beneath the die used solely for heat dissipation. It must be soldered to a large PCB copper area connected to GND (or left floating) - never used as the sole GND connection. Proper thermal pad layout reduces junction-to-ambient thermal resistance by up to 30°C/W, preventing thermal shutdown at 150mA continuous load.
Does AP7315D-31FS4-7B require an external discharge resistor?
No. The "D" suffix denotes integrated auto-discharge functionality: an internal 30Ω NMOS FET connects VOUT to GND when EN is low. This eliminates need for external resistors, reduces BOM count, and ensures consistent 100µs discharge time regardless of output capacitance value - critical for reliable power sequencing.
Can AP7315D-31FS4-7B operate with input voltage below 3.1V?
No. With 3.1V nominal output, minimum input is 3.39V (3.1V + 290mV dropout) to maintain regulation at 150mA. At lighter loads, dropout decreases (e.g., 210mV at 50mA), allowing operation down to ~3.31V. Below that, output drops linearly with input - not suitable for sub-3.3V battery operation without pre-regulation.
How does the EN pin behave during power-up and power-down sequences?
The EN pin has hysteresis-free TTL-compatible thresholds: regulator enables when EN rises above 1.3V and disables when EN falls below 0.5V. During power-up, VIN must stabilize before EN is asserted; during shutdown, pulling EN low immediately activates discharge FET. No external pull-up is required - internal 100nA leakage ensures defined state if left unconnected.
AP7315D-31FS4-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.25V
- Voltage - Output (Min/Fixed):
- 3.1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.29V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- 100 µA
- PSRR:
- 75dB (1kHz)
- Control Features:
- -
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1010-4
AP7315D-31FS4-7B FAQ
1.How can I place an order for AP7315D-31FS4-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for AP7315D-31FS4-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP7315D-31FS4-7B reliable?
The price and inventory of AP7315D-31FS4-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP7315D-31FS4-7B is usually 5 days.
3.What payment methods are accepted for AP7315D-31FS4-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP7315D-31FS4-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP7315D-31FS4-7B?
AP7315D-31FS4-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP7315D-31FS4-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP7315D-31FS4-7B?
For technical support, including AP7315D-31FS4-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP7315D-31FS4-7B requirements.
6.How does Aetrix verify that AP7315D-31FS4-7B is sourced from the original manufacturer or authorized distributors?
All AP7315D-31FS4-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP7315D-31FS4-7B meets industry standards.
7.What is the process for return or replacement of AP7315D-31FS4-7B?
All AP7315D-31FS4-7B units undergo pre-shipment inspection (PSI). If there is an issue with AP7315D-31FS4-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP7315D-31FS4-7B part is unused and in its original packaging.
Return procedure for AP7315D-31FS4-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP7315D-31FS4-7B Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

