Diodes Incorporated AP7340-12FS4-7

Overview

AP7340-12FS4-7 from Diodes Incorporated is a 1.2V fixed-output, 150mA low-dropout linear regulator with ±1% output voltage accuracy, 75dB PSRR at 1kHz, 60µV_rms output noise (10Hz–100kHz), and 35µA quiescent current. It features CMOS-based architecture, enable control, and operates from 1.7V to 5.25V input, targeting RF supply rails and portable media subsystems.

For engineers reviewing the AP7340-12FS4-7 datasheet, AP7340-12FS4-7 pinout, AP7340-12FS4-7 application, or AP7340-12FS4-7 equivalent, key selection criteria include dropout voltage at 150mA (0.38V typ for 1.2V output), thermal performance in X2-DFN1010-4, EN logic thresholds (0.5V max low, 1.3V min high), and stability with 0.47µF ceramic capacitors.

Technical Context

The AP7340-12FS4-7 integrates a precision voltage reference, error amplifier, and current-limit circuit in a CMOS process. Its non-discharge architecture avoids automatic VOUT discharge during shutdown, preserving downstream capacitor charge.

It delivers regulated 1.2V output with line regulation ≤0.1%/V and load regulation ≤1.0%/A across –40°C to +85°C. The EN pin controls operation with <1.0µA leakage and supports direct tie-to-VIN for always-on use.

Key Specifications

Pinout & Package

AP7340-12FS4-7 uses the X2-DFN1010-4 package: 1.0mm × 1.0mm body, 0.4mm height, thermal pad exposed on bottom. PCB layout requires large copper area under thermal pad connected to GND for optimal thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1700-1202E/TO and XC6219B122MR-G, the AP7340-12FS4-7 uniquely balances ultra-low IQ (35µA), RF-grade PSRR (75dB), and 1.7V minimum input - making it optimal for space-constrained, battery-powered RF subsystems requiring dynamic enable control.

Availability

AP7340-12FS4-7 is available at Aetrix Electronics and suitable for RF power amplifier bias, camera sensor core supply, and wireless adapter baseband applications requiring stable component supply, tight voltage accuracy, and low-noise performance.

Supply support for AP7340-12FS4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, industrial, and communications markets.

The AP7340 belongs to Diodes' high-PSRR, low-noise LDO family designed specifically for noise-sensitive RF and imaging subsystems in portable electronics where battery life, board area, and signal purity are critical.

FAQ

What is the maximum allowable input voltage for AP7340-12FS4-7?

The absolute maximum input voltage is 6.0V, but the recommended operating range is 1.7V to 5.25V. Exceeding 5.25V risks permanent damage per Absolute Maximum Ratings. For 1.2V output, minimum dropout requires VIN ≥1.58V at 150mA; typical design margin uses VIN = 2.5V–3.6V to ensure stability across temperature and load.

Does AP7340-12FS4-7 include output discharge functionality?

No - AP7340-12FS4-7 is the non-discharge variant. When EN is pulled low, VOUT remains floating and retains charge on the output capacitor. For active discharge, select the AP7340D-12FS4-7 variant, which integrates an internal NMOS switch between VOUT and GND with 30Ω on-resistance.

Can AP7340-12FS4-7 operate with ceramic capacitors smaller than 0.47µF?

No - the datasheet specifies 0.47µF ceramic capacitors for both CIN and COUT to guarantee stability and transient response. Using smaller values may cause oscillation or excessive overshoot during load steps. ESR must remain below 10mΩ; X5R/X7R dielectrics are validated, while Z5U is not recommended due to capacitance drift.

How does thermal performance scale in the X2-DFN1010-4 package?

In the JEDEC High-K board test condition (2in×2in, 1oz planes), θ_JA is 220°C/W. With proper PCB layout - including a 3mm×3mm thermal pad connected to ≥4 thermal vias to inner ground plane - junction-to-ambient can improve to ~95°C/W. At 150mA and 200mV dropout, power dissipation is 30mW, resulting in <3°C rise above ambient under optimized layout.