Diodes Incorporated AP7340D-28FS4-7

Overview

AP7340D-28FS4-7 from Diodes Incorporated is a 2.8V fixed-output, 150mA low-dropout linear regulator with ±1% output voltage accuracy, 75dB PSRR at 1kHz, and 60µV_RMS output noise (10Hz–100kHz). Built on CMOS process, it features enable control, thermal shutdown, short-circuit protection, and integrated auto-discharge functionality - optimized for RF supply rails in portable wireless communication devices.

For engineers reviewing the AP7340D-28FS4-7 datasheet, AP7340D-28FS4-7 pinout, AP7340D-28FS4-7 application, or AP7340D-28FS4-7 equivalent, key selection criteria include dropout voltage (210mV @150mA), quiescent current (35µA), EN logic thresholds (0.5V_IL/1.3V_IH), and X2-DFN1010-4 thermal pad layout requirements.

Technical Context

The AP7340D integrates a precision voltage reference, error amplifier, current-limit circuit, and NMOS pass transistor with built-in discharge path (EN=low discharges VOUT via 30Ω internal FET). Its CMOS architecture enables ultra-low quiescent current and stable operation with 0.47µF ceramic input/output capacitors.

It delivers regulated 2.8V output across 1.7V–5.25V input range, maintains ±1.5% accuracy over –40°C to +85°C, and achieves 75dB power supply ripple rejection at 1kHz while sustaining 150mA load with <0.27V dropout - critical for battery-powered RF subsystems requiring clean, stable bias.

Key Specifications

Pinout & Package

AP7340D-28FS4-7 uses the X2-DFN1010-4 package (1.0mm × 1.0mm, 0.4mm height) with exposed thermal pad. PCB layout requires direct connection of the thermal pad to GND plane for optimal thermal dissipation (θ_JA = 220°C/W on JEDEC High-K board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise, enable-capable LDO applications.

Compared with MCP1700-2802E/TO and XC6219B282MR-G, AP7340D-28FS4-7 uniquely combines 75dB PSRR, 60µV_RMS noise, and integrated discharge in a 1.0mm² DFN - making it the only option meeting simultaneous RF cleanliness, size, and safe power-down requirements.

Availability

AP7340D-28FS4-7 is available at Aetrix Electronics and suitable for smartphone RF supply, portable camera sensor bias, and wireless adapter core rail applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for AP7340D-28FS4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP7340 series belongs to Diodes' high-PSRR, low-noise LDO product line, engineered specifically for noise-sensitive RF and imaging subsystems in portable electronics where small size and precise regulation are mandatory.

FAQ

What is the minimum input voltage required for AP7340D-28FS4-7 to maintain regulation at 150mA?

The minimum input voltage is 3.01V - calculated as VOUT + dropout = 2.8V + 0.21V (typical dropout @150mA). Below this, output voltage drops below specification. The device remains functional down to 1.7V input but cannot sustain full load current in dropout region.

Does AP7340D-28FS4-7 require an external discharge resistor?

No. Unlike the standard AP7340, the 'D' suffix denotes integrated auto-discharge: when EN is pulled low, a 30Ω internal NMOS FET actively discharges VOUT to GND, eliminating need for external components and reducing PCB area.

Can AP7340D-28FS4-7 operate with ceramic output capacitors smaller than 0.47µF?

Yes - the device is stable with 0.22µF ceramic capacitors per datasheet Figure 11, but 0.47µF is recommended for optimal transient response under 150mA load steps. Smaller values increase peak undershoot during fast load changes.

How does the thermal pad on X2-DFN1010-4 affect reliability in continuous 150mA operation?

Connecting the thermal pad to a ≥25mm² GND copper pour reduces junction-to-ambient thermal resistance by ~60°C/W versus no pad connection. At 150mA and 3.3V input, this prevents junction temperature from exceeding 105°C (derated from 125°C max) in 60°C ambient - ensuring long-term reliability.