Diodes Incorporated AP7341-28FS4-7

Overview

AP7341-28FS4-7 from Diodes Incorporated is a 300mA, 2.8V fixed-output CMOS low-dropout regulator with ±1% output accuracy, 75dB PSRR at 1kHz, 60µV_rms output noise (10Hz–100kHz), and 35µA quiescent current - designed for RF supply rails in compact portable devices.

For engineers reviewing the AP7341-28FS4-7 datasheet, AP7341-28FS4-7 pinout, AP7341-28FS4-7 application, or AP7341-28FS4-7 equivalent, key selection criteria include dropout voltage at 300mA (≤270mV), enable threshold compatibility (V_EN(H) ≥1.3V), thermal performance in X2-DFN1010-4, and stability with 1µF ceramic output capacitance.

Technical Context

The AP7341-28FS4-7 integrates a precision voltage reference, error amplifier, current-limit circuit, and CMOS pass transistor to deliver stable 2.8V output across 1.7V–5.25V input range. Its architecture supports fast load transient response and enables shutdown via logic-level EN pin.

It operates over –40°C to +85°C ambient, maintains ±1.5% output accuracy across temperature, and features built-in short-circuit protection clamping output current to ~55mA during V_OUT-to-GND fault conditions.

Key Specifications

Pinout & Package

Packaged in a 1.0mm × 1.0mm X2-DFN1010-4 with exposed thermal pad, this ultra-compact LDO supports high-density PCB layouts and efficient heat dissipation when the thermal pad is connected to GND plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1700-2802E/TO and XC6206P282MR-G, the AP7341-28FS4-7 uniquely balances 300mA drive capability, 210mV dropout, 75dB PSRR, and 60µV_rms noise - making it optimal for RF and high-fidelity analog supply roles where all four parameters are simultaneously critical.

Availability

AP7341-28FS4-7 is available at Aetrix Electronics and suitable for RF power amplifier biasing, camera module core voltage regulation, wireless adapter baseband supply, and portable media player audio codec powering requiring stable component supply across production lifecycles.

Supply support for AP7341-28FS4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management, signal integrity, and protection solutions for consumer, industrial, and communications markets.

The AP7341 series belongs to Diodes' high-PSRR, low-noise LDO product line, engineered specifically for noise-sensitive analog and RF subsystems in battery-powered portable electronics.

FAQ

What is the minimum input voltage required for AP7341-28FS4-7 to maintain regulation at full 300mA load?

The minimum input voltage is 3.01V, calculated from the maximum dropout voltage of 210mV at 300mA plus the nominal 2.8V output. At 25°C, typical dropout is 200mV, allowing stable operation from 3.0V - critical for single-cell Li-ion systems operating near end-of-discharge.

Does AP7341-28FS4-7 include reverse-current protection or output discharge functionality?

No - the AP7341-28FS4-7 is the non-discharge version (no 'D' suffix). It lacks an internal output discharge FET; when disabled, VOUT remains floating and decays only through external load or leakage. For active discharge, select AP7341D-28FS4-7, which adds a 30Ω on-resistance NMOS between VOUT and GND.

Can AP7341-28FS4-7 operate stably with a 0.47µF output capacitor?

Yes - the device is stable with ceramic capacitors ≥0.47µF and ESR ≤100mΩ. However, 1.0µF is recommended for optimal transient response under 300mA step loads. Lower capacitance increases peak voltage deviation during load transients, potentially affecting RF PA linearity.

How does the thermal pad on the X2-DFN1010-4 package affect PCB layout and thermal performance?

The exposed thermal pad must be soldered to a dedicated GND-connected copper pour ≥25mm² for effective heat dissipation. Without this, junction temperature rise exceeds limits at 300mA; with proper layout, θ_JA improves from 320°C/W to 220°C/W, enabling full-rated current in ambient up to +70°C.