Diodes Incorporated AP7341D-31FS4-7

Overview

AP7341D-31FS4-7 from Diodes Incorporated is a 300mA, 3.1V fixed-output low-dropout linear regulator with ±1% output voltage accuracy, 75dB PSRR at 1kHz, and 60µV_rms output noise (10Hz–100kHz). Built on a CMOS process, it features enable control, low 35µA quiescent current, and thermal protection-designed for powering RF circuitry and precision analog blocks in space-constrained portable devices.

For engineers reviewing the AP7341D-31FS4-7 datasheet, AP7341D-31FS4-7 pinout, AP7341D-31FS4-7 application, or AP7341D-31FS4-7 equivalent, key selection criteria include dropout voltage at 300mA (≤270mV @ V_OUT=3.1V), EN logic thresholds (V_IL ≤0.5V, V_IH ≥1.3V), thermal pad layout requirements, and compatibility with 1µF ceramic input/output capacitors.

Technical Context

The AP7341D-31FS4-7 integrates a precision voltage reference, error amplifier, current-limit circuit, and CMOS pass transistor to deliver stable 3.1V output across 1.7V–5.25V input range. Its architecture supports fast load transient response (<100µs settling) and built-in short-circuit protection clamping output current to ~60mA during V_OUT-to-GND faults.

Enable functionality is implemented via a dedicated CMOS-compatible EN pin (Pin 3) that places the device in shutdown mode when pulled low (I_STANDBY ≤1.0µA), eliminating reverse current flow. The thermal pad beneath the X2-DFN1010-4 package must be connected to GND or left floating per layout guidelines-not used as sole GND electrode.

Key Specifications

Pinout & Package

X2-DFN1010-4 (1.0mm × 1.0mm, 0.4mm height) with exposed thermal pad - optimized for minimal PCB footprint and high-density layouts in smartphones and wearables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1700-3102E/TO and XC6219B312MR-G, the AP7341D-31FS4-7 delivers tighter output accuracy (±1% vs. ±2%), superior PSRR (75dB vs. ≤70dB), and integrated output discharge-critical for power sequencing in multi-rail portable systems.

Availability

AP7341D-31FS4-7 is available at Aetrix Electronics and suitable for RF power amplifier biasing, camera image sensor core supplies, wireless adapter SoC core rails, and portable media player audio DAC supplies requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for AP7341D-31FS4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The AP7341 series belongs to Diodes' high-PSRR, low-noise LDO product line-engineered specifically for noise-sensitive applications in portable communications equipment where small size, low power, and precision regulation are mandatory.

FAQ

What is the maximum allowable input voltage for AP7341D-31FS4-7?

The absolute maximum input voltage is 6.0V, but recommended operating range is 1.7V to 5.25V. Exceeding 5.25V may cause permanent damage or degrade long-term reliability, even if within absolute maximum ratings. Operation above 5.25V voids warranty and violates JEDEC thermal test conditions defined in the datasheet.

Does AP7341D-31FS4-7 require an external discharge resistor?

No. The "D" suffix indicates the discharge version: when EN is low, an internal 30Ω NMOS connects VOUT to GND, actively discharging output capacitance. This eliminates need for external resistors in power sequencing designs, reducing BOM count and PCB area.

Can AP7341D-31FS4-7 operate with only a 0.47µF input capacitor?

Yes - the datasheet specifies a minimum 0.47µF ceramic capacitor between VIN and GND. For optimal stability and transient response, place it within 2mm of the VIN and GND pins using wide, low-inductance traces. Larger values (≥1µF) further improve ripple rejection at high frequencies.

How does thermal performance change if the thermal pad is left unconnected?

Leaving the thermal pad unconnected increases junction-to-ambient thermal resistance by ~60°C/W versus proper GND connection, raising die temperature significantly under 300mA load. This reduces safe operating area and may trigger thermal shutdown prematurely - Diodes recommends connecting the pad to a ≥100mm² copper pour tied to GND.