Diodes Incorporated AP7343-09FS4-7B
- Part No.:
- AP7343-09FS4-7B
- Manufacturer:
- Diodes Incorporated
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
AP7343-09FS4-7B.pdf
- Description:
- IC REG LINEAR 0.9V 300MA 4DFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,289
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP7343-09FS4-7B from Diodes Incorporated is a 300mA, 0.9V fixed-output low-dropout linear regulator with ±1% output voltage accuracy, 75dB PSRR at 1kHz, and 60µVrms output noise (10Hz–100kHz). Built on a CMOS process, it features enable control, thermal shutdown, and short-circuit protection-designed for powering RF circuitry and core logic rails in space-constrained portable devices.
For engineers reviewing the AP7343-09FS4-7B datasheet, AP7343-09FS4-7B pinout, AP7343-09FS4-7B application, or AP7343-09FS4-7B equivalent, key selection criteria include its 0.9V fixed output, 1.7V–5.25V input range, 35µA quiescent current, X2-DFN1010-4 (Type B) package, and high PSRR performance under light-to-moderate load transients.
Technical Context
The AP7343-09FS4-7B integrates a precision voltage reference, error amplifier, current-limit circuit, and NMOS pass transistor in a CMOS-based architecture. Its enable input (EN) provides precise on/off control with defined logic thresholds (VIL ≤ 0.5V, VIH ≥ 1.3V), and internal thermal shutdown activates at +150°C with +20°C hysteresis.
It delivers stable 0.9V output across –40°C to +85°C ambient, with dropout voltage as low as 0.51V at 300mA (X2-DFN1010-4 package). The device exhibits low output impedance and fast load transient response-critical for powering noise-sensitive RF ICs and low-voltage microcontroller cores.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 0.9V ±1% at +25°C; supports core logic and I/O rails requiring tight regulation. |
| Max Output Current | 300mA continuous; sufficient for baseband processors, PMIC sub-rails, and sensor interfaces. |
| Input Voltage Range | 1.7V to 5.25V; compatible with single-cell Li-ion, Li-poly, and multi-cell alkaline/battery-backed systems. |
| PSRR | 75dB at 1kHz; suppresses switching noise from DC/DC converters feeding adjacent power domains. |
| Output Noise | 60µVrms (10Hz–100kHz); enables clean supply for RF transceivers and ADC reference circuits. |
| Quiescent Current | 35µA typical; extends battery life in always-on sensor nodes and standby modes. |
| Dropout Voltage | 0.51V at 300mA (0.9V output); maintains regulation down to 1.41V input-ideal for aging battery operation. |
Pinout & Package
X2-DFN1010-4 (Type B) package: 1.0mm × 1.0mm, 0.4mm pitch, exposed thermal pad (EP) - requires PCB copper area connected to GND for optimal thermal dissipation (RθJA = 237°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIN1 (VOUT) | Regulated power output | Delivers stable 0.9V to load; must be decoupled with ≥1µF ceramic capacitor placed adjacent to pin. |
| PIN2 (GND) | Analog and power ground reference | Primary return path for output current and internal bias; connects to EP for thermal conduction. |
| PIN3 (EN) | Enable control input | Active-high logic interface; drives regulator ON when ≥1.3V, OFF when ≤0.5V-no pull-up required if tied to VIN. |
| PIN4 (VIN) | Unregulated input supply | Accepts 1.7V–5.25V; requires ≥0.47µF ceramic decoupling capacitor placed within 2mm of pin. |
| EP (Exposed Pad) | Thermal and mechanical anchor | Not electrically functional as GND; must be soldered to large PCB copper pour for thermal relief (RθJB = 85.7°C/W). |
Key Features
| Feature | Design Value |
|---|---|
| High PSRR | 75dB at 1kHz ensures minimal coupling of DC/DC ripple into sensitive analog/RF blocks. |
| Ultra-low noise | 60µVrms (10Hz–100kHz) meets stringent requirements for RF front-end and precision ADC supplies. |
| Low quiescent current | 35µA enables >1-year battery life in IoT sensors operating at 10µA average system current. |
| Thermal protection | +150°C shutdown with +20°C hysteresis prevents latch-up during sustained overload or poor PCB heatsinking. |
| Small footprint | X2-DFN1010-4 (1.0mm × 1.0mm) reduces PCB area by 70% vs. SOT25-critical for ultra-thin mobile designs. |
Applications
| Smartphone Baseband Core Supply | Wi-Fi/Bluetooth RF Transceiver Bias |
|---|---|
Use Scenario: Powers ARM Cortex-A/M series application processor core rail in smartphone SoC subsystems. IC Role / Device Role / Timing Role: Primary LDO delivering 0.9V at up to 300mA with <±1% accuracy and fast load transient recovery. Use Value: Maintains CPU stability during burst-mode execution while rejecting noise from shared PMIC switchers. |
Use Scenario: Supplies clean 0.9V bias to Wi-Fi 6/6E and Bluetooth 5.3 RF transceivers in mobile hotspots. IC Role / Device Role / Timing Role: Low-noise post-regulator for PA driver stages and mixer LO paths. Use Value: 60µVrms noise and 75dB PSRR prevent EVM degradation and adjacent-channel leakage in 2.4/5GHz bands. |
| Wearable Sensor Hub Power | Industrial Wireless Node MCU Core |
Use Scenario: Provides regulated 0.9V to ultra-low-power sensor fusion MCU (e.g., Nordic nRF52/nRF53) in hearables. IC Role / Device Role / Timing Role: Always-on LDO with 35µA IQ supporting wake-on-motion and BLE advertising cycles. Use Value: Enables 2-week battery life on CR2032 via minimal quiescent draw and efficient dropout at end-of-life voltage. |
Use Scenario: Powers Cortex-M4/M33 core in LoRaWAN or NB-IoT edge node gateways deployed in remote locations. IC Role / Device Role / Timing Role: Robust 0.9V supply with –40°C to +85°C operation and thermal shutdown for unattended field use. Use Value: Ensures deterministic reset behavior and avoids brown-out resets during temperature cycling or battery sag. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP7343-09W5-7 | SOT25 package (3.0mm × 1.7mm); higher RθJA (179°C/W); same electrical specs. | Less suitable for ultra-dense layouts; better for hand-soldering or legacy board compatibility. | Select when thermal margin allows larger footprint or when SOT25 is preferred for assembly logistics. |
| Torex XC6210B092MR-G | 0.9V fixed, 200mA max, 45µA IQ, 65dB PSRR @ 1kHz, SOT25 package. | Limited current headroom for burst-mode loads; lower PSRR impacts RF supply cleanliness. | Choose only for cost-sensitive, low-current applications where 300mA and 75dB PSRR are not required. |
Compared with AP7343-09W5-7, the FS4 variant offers 30% smaller footprint and superior thermal resistance to board; versus XC6210B092MR-G, it delivers 50% higher output current and 10dB better PSRR-critical for next-gen wireless SoCs.
Availability
AP7343-09FS4-7B is available at Aetrix Electronics and suitable for smartphone baseband supplies, Wi-Fi/Bluetooth RF biasing, wearable sensor hub power, and industrial wireless node MCU core rails requiring stable component supply across automotive-grade temperature ranges and long production lifecycles.
Supply support for AP7343-09FS4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management, signal integrity, and connectivity solutions for consumer, industrial, and automotive markets.
The AP7343 belongs to Diodes' high-PSRR, low-noise LDO family-engineered specifically for noise-sensitive RF and digital core applications in battery-powered portable electronics.
FAQ
What is the minimum input voltage required for stable 0.9V output at 300mA?
The AP7343-09FS4-7B requires VIN ≥ 1.41V to maintain regulation at 300mA (0.51V dropout + 0.9V output). Below this, output voltage sags nonlinearly; operation below 1.7V is outside recommended conditions per datasheet Section 5.
Can the EN pin be left floating during operation?
No-EN must be actively driven high (≥1.3V) or low (≤0.5V). Floating EN causes undefined output state and potential oscillation due to internal comparator sensitivity; tie to VIN if enable functionality is unused.
Is an external discharge FET needed for fast VOUT decay during shutdown?
No-the AP7343-09FS4-7B is the non-discharge variant (per ordering code "7B"). Output discharges only through load; for active discharge, select AP7343D-09FS4-7B, which integrates a 30Ω NMOS between VOUT and GND when disabled.
What is the maximum allowable PCB trace length between CIN and VIN/GND pins?
Input capacitor CIN (≥0.47µF ceramic) must be placed within 2mm of VIN and GND pins. Longer traces increase inductance, degrading high-frequency PSRR and risking instability during fast load transients per Application Note Section 12.
AP7343-09FS4-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.25V
- Voltage - Output (Min/Fixed):
- 0.9V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.8V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- 75dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1010-4
AP7343-09FS4-7B FAQ
1.How can I place an order for AP7343-09FS4-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for AP7343-09FS4-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP7343-09FS4-7B reliable?
The price and inventory of AP7343-09FS4-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP7343-09FS4-7B is usually 5 days.
3.What payment methods are accepted for AP7343-09FS4-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP7343-09FS4-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP7343-09FS4-7B?
AP7343-09FS4-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP7343-09FS4-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP7343-09FS4-7B?
For technical support, including AP7343-09FS4-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP7343-09FS4-7B requirements.
6.How does Aetrix verify that AP7343-09FS4-7B is sourced from the original manufacturer or authorized distributors?
All AP7343-09FS4-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP7343-09FS4-7B meets industry standards.
7.What is the process for return or replacement of AP7343-09FS4-7B?
All AP7343-09FS4-7B units undergo pre-shipment inspection (PSI). If there is an issue with AP7343-09FS4-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP7343-09FS4-7B part is unused and in its original packaging.
Return procedure for AP7343-09FS4-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP7343-09FS4-7B Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

