Diodes Incorporated AP7343D-23FS4-7B
- Part No.:
- AP7343D-23FS4-7B
- Manufacturer:
- Diodes Incorporated
- Package:
- 4-XDFN Exposed Pad
- Datasheet:
-
AP7343D-23FS4-7B.pdf
- Description:
- IC REG LINEAR 2.3V 300MA 4DFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,672
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP7343D-23FS4-7B from Diodes Incorporated is a 300mA, 2.3V fixed-output low-dropout linear regulator with high PSRR (75dB at 1kHz), ultra-low output noise (60µVrms, 10Hz–100kHz), ±1% output voltage accuracy, and enable-controlled shutdown. Fabricated on a CMOS process, it delivers stable power to RF supplies and camera modules in space-constrained portable devices using the X2-DFN1010-4 (Type B) package.
For engineers reviewing the AP7343D-23FS4-7B datasheet, AP7343D-23FS4-7B pinout, AP7343D-23FS4-7B application, or AP7343D-23FS4-7B equivalent, key selection criteria include dropout voltage at 300mA (0.35V typ. for 2.3V VOUT), thermal resistance (θJA = 237°C/W), EN logic thresholds (0.5V max low, 1.3V min high), and built-in discharge functionality enabled by the "D" suffix.
Technical Context
The AP7343D integrates a precision voltage reference, error amplifier, current-limit circuit, and thermal shutdown protection. Its CMOS-based architecture enables low quiescent current (35µA typ.) and fast load transient response without requiring external compensation.
Unlike standard LDOs, the "D" variant includes an internal N-channel MOSFET (RON ≈ 30Ω) between VOUT and GND for active output discharge during shutdown - critical for systems requiring rapid rail collapse and sequencing compliance. The device operates across 1.7V–5.25V input and guarantees 300mA output up to +85°C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 2.3V ±1% - ensures stable bias for 2.3V-tolerant RF ICs and image sensors without external feedback. |
| Max Output Current | 300mA - supports moderate-power analog blocks (e.g., RF transceivers, ADC drivers) without thermal derating in X2-DFN1010-4. |
| PSRR | 75dB at 1kHz - suppresses switching noise from adjacent DC/DC converters feeding shared input rails. |
| Output Noise | 60µVrms (10Hz–100kHz) - minimizes phase noise in local oscillator supplies and analog front-end references. |
| Dropout Voltage | 0.35V typ. at 300mA (2.3V VOUT) - enables operation from 2.65V input, compatible with single-cell Li-ion (2.7–4.2V) and 3.3V buck outputs. |
| Quiescent Current | 35µA typ. - extends battery life in always-on sensor nodes and standby modes of portable media players. |
| Enable Thresholds | VEN(H) ≥1.3V, VEN(L) ≤0.5V - interfaces directly with 1.8V/3.3V GPIO without level-shifting. |
Pinout & Package
X2-DFN1010-4 (Type B) package: 1.0mm × 1.0mm, 0.4mm pitch, exposed pad (EP) for thermal enhancement. Not electrically connected - must be soldered to GND plane for optimal thermal dissipation (θJB = 85.7°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIN1 (Top View) | VOUT | Regulated 2.3V power output - connect to load with low-inductance path; place 1µF ceramic capacitor within 2mm. |
| PIN2 (Top View) | GND | Analog/digital ground reference - tie directly to PCB ground plane; share with EP for thermal conduction. |
| PIN3 (Top View) | EN | Active-high enable - drive with clean digital signal; floating state disables regulator (ISTANDBY = 0.01µA). |
| PIN4 (Top View) | VIN | Input supply (1.7–5.25V) - decouple with 0.47µF ceramic capacitor placed adjacent to PIN4 and GND. |
| EP (Bottom) | Thermal Pad | Non-electrical thermal interface - solder to ≥4mm² GND copper area; improves θJA by >30% vs. no pad connection. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated discharge FET | 30Ω on-resistance enables <100µs VOUT collapse after EN deactivation - eliminates need for external bleed resistor in power sequencing. |
| High PSRR at 1kHz | 75dB attenuation maintains clean 2.3V rail despite 200mVpp ripple on shared 3.3V input from buck converter. |
| Low-noise regulation | 60µVrms broadband noise avoids SNR degradation in 12-bit+ camera sensor analog chains and RF synthesizer VCO supplies. |
| Ultra-low IQ | 35µA quiescent current allows >1-year battery life in coin-cell-powered IoT sensors operating at 10µA average load. |
| ±1% VOUT accuracy | Tight tolerance eliminates post-regulation trimming for 2.3V FPGA I/O banks and memory interface termination voltages. |
Applications
| RF Power Amplifier Bias | CMOS Image Sensor Core Supply |
|---|---|
|
Use Scenario: Providing clean, sequenced bias to GaAs pHEMT PA stages in 4G/5G mobile front-ends. IC Role / Device Role / Timing Role: Low-noise, enable-synchronized LDO delivering 2.3V at up to 250mA with sub-100µs turn-on/off timing. Use Value: Discharge FET ensures rapid PA disable to meet 3GPP TX/RX isolation requirements; 75dB PSRR rejects PA-switching-induced supply noise. |
Use Scenario: Powering analog core and PLL circuits of high-resolution rolling-shutter CMOS image sensors. IC Role / Device Role / Timing Role: Fixed 2.3V LDO with 60µVrms noise and ±1% accuracy supplying sensor pixel array and timing generator. Use Value: Ultra-low noise preserves dynamic range (>70dB SNR); tight VOUT tolerance prevents image gain drift across temperature. |
| Portable Media Player Audio Codec | Wireless Adapter Baseband IC |
|
Use Scenario: Generating low-noise AVDD for stereo DAC/ADC in Bluetooth headphones and portable speakers. IC Role / Device Role / Timing Role: Enable-controlled 2.3V supply enabling zero-power standby mode and fast wake-up (<50µs). Use Value: 35µA IQ extends playback time; discharge FET prevents pop/click during power cycling. |
Use Scenario: Regulating 2.3V supply for Wi-Fi/BT baseband SoCs with burst-mode processing and deep-sleep states. IC Role / Device Role / Timing Role: High-PSRR LDO supporting 300mA peak current during packet transmission while maintaining stability under 100mA load steps. Use Value: Fast load transient response (<50µs settling) prevents brown-out during MAC-layer bursts; 237°C/W θJA sustains full load in compact 2-layer PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCP1700-2302E/TO | 250mA max output, no discharge FET, higher dropout (0.6V @ 250mA), SOT23-5 package | Lacks active discharge; requires external resistor for VOUT collapse; larger footprint | Select when discharge is unnecessary and cost sensitivity outweighs size/noise requirements. |
| Torex XC6219B232MR-G | 300mA, 2.3V, no discharge, 65dB PSRR, 40µVrms noise, SOT25 package | No discharge function; lower PSRR reduces noise rejection in noisy DC/DC environments | Prefer where board space permits SOT25 and system-level discharge is handled externally. |
Compared with MCP1700-2302E/TO and XC6219B232MR-G, the AP7343D-23FS4-7B uniquely combines discharge capability, 75dB PSRR, and 1.0mm² footprint - making it optimal for miniaturized RF and imaging subsystems demanding strict power sequencing and noise control.
Availability
AP7343D-23FS4-7B is available at Aetrix Electronics and suitable for RF power amplifiers, CMOS image sensors, portable audio codecs, and wireless adapter baseband ICs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for AP7343D-23FS4-7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.
The AP7343 series targets portable and battery-powered systems needing ultra-low-noise, high-PSRR, and enable-controlled LDOs - with variants optimized for space-constrained layouts and stringent sequencing requirements.
FAQ
What is the purpose of the exposed pad (EP) on the X2-DFN1010-4 package?
The exposed pad is a thermal interface, not an electrical terminal. It must be soldered to a PCB ground plane covering ≥4mm² to achieve the specified θJA = 237°C/W. Leaving it unconnected raises junction temperature by >25°C at 300mA, risking thermal shutdown.
Does the "D" in AP7343D-23FS4-7B indicate a different output voltage or a functional variant?
The "D" denotes the discharge variant: it integrates a 30Ω N-channel FET between VOUT and GND that activates when EN is low, discharging the output capacitor in <100µs. Output voltage remains fixed at 2.3V - identical to non-D versions.
Can AP7343D-23FS4-7B operate with only a 0.47µF input capacitor?
Yes - the datasheet specifies a minimum 0.47µF ceramic capacitor between VIN and GND. For optimal transient immunity, place it within 1mm of PIN4 and GND. Larger values (≥1µF) further reduce input impedance but are not required for stability.
How does the AP7343D's PSRR performance change with load current?
PSRR remains ≥75dB at 1kHz from 1mA to 150mA load; it degrades to ~65dB at 300mA due to increased error amplifier loading. For noise-sensitive loads, maintain IOUT ≤150mA or add a second-stage RC filter if full 300mA is required.
AP7343D-23FS4-7B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 4-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.25V
- Voltage - Output (Min/Fixed):
- 2.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.34V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 60 µA
- Current - Supply (Max):
- -
- PSRR:
- 75dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1010-4
AP7343D-23FS4-7B FAQ
1.How can I place an order for AP7343D-23FS4-7B through Aetrix?
Please submit a Request for Quotation (RFQ) for AP7343D-23FS4-7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP7343D-23FS4-7B reliable?
The price and inventory of AP7343D-23FS4-7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP7343D-23FS4-7B is usually 5 days.
3.What payment methods are accepted for AP7343D-23FS4-7B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP7343D-23FS4-7B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP7343D-23FS4-7B?
AP7343D-23FS4-7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP7343D-23FS4-7B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP7343D-23FS4-7B?
For technical support, including AP7343D-23FS4-7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP7343D-23FS4-7B requirements.
6.How does Aetrix verify that AP7343D-23FS4-7B is sourced from the original manufacturer or authorized distributors?
All AP7343D-23FS4-7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP7343D-23FS4-7B meets industry standards.
7.What is the process for return or replacement of AP7343D-23FS4-7B?
All AP7343D-23FS4-7B units undergo pre-shipment inspection (PSI). If there is an issue with AP7343D-23FS4-7B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP7343D-23FS4-7B part is unused and in its original packaging.
Return procedure for AP7343D-23FS4-7B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP7343D-23FS4-7B Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

