Diodes Incorporated AP7346D-3018FS6-7
- Part No.:
- AP7346D-3018FS6-7
- Manufacturer:
- Diodes Incorporated
- Package:
- 6-XFDFN Exposed Pad
- Datasheet:
-
AP7346D-3018FS6-7.pdf
- Description:
- IC REG LIN 1.8V/3V X2DFN1212-6
- Quantity:
- Payment:

- Shipping:

Inventory:4,920
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AP7346D-3018FS6-7 from Diodes Incorporated is a dual-channel, high-accuracy current-limiting LDO regulator in X2-DFN1212-6 package, delivering fixed 3.0V and 1.8V outputs with ±1% voltage accuracy, 157mA ±25mA current limit per channel, and 75dB PSRR at 1kHz. It supports low-power portable applications including RF supplies and camera modules where tight regulation, low noise (60µVrms), and independent enable control are critical.
For engineers reviewing the AP7346D-3018FS6-7 datasheet, AP7346D-3018FS6-7 pinout, AP7346D-3018FS6-7 application, or AP7346D-3018FS6-7 equivalent, key selection considerations include dual-output voltage pairing, independent EN1/EN2 control logic, thermal-pad-aware PCB layout, and compatibility with 0.47µF ceramic output capacitors for transient stability.
Technical Context
The AP7346D-3018FS6-7 integrates two independent CMOS-based LDO regulators sharing a single VIN input but featuring separate EN1/EN2 enable inputs and VOUT1/VOUT2 outputs. Each channel includes internal voltage reference, error amplifier, fold-back current limiting (132–182mA), and auto-discharge circuitry via integrated 50Ω N-channel FETs.
It operates across 1.7V–5.25V input range with dropout as low as 0.22V at 3.0V output (120mA load), achieves 60µVrms output noise (10Hz–100kHz), and maintains ±1.5% total output accuracy over −40°C to +85°C ambient - enabled by low 35µA quiescent current in single-channel active mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltages | Fixed 3.0V (Channel 1) and 1.8V (Channel 2); eliminates external feedback resistors and simplifies power rail generation for mixed-voltage SoCs. |
| VOUT Accuracy | ±1% at +25°C, ±1.5% over −40°C to +85°C; ensures stable core and I/O rail compliance for precision analog and digital subsystems. |
| Current Limit | 157mA ±25mA per channel with fold-back protection; limits fault current during short-circuit while preserving thermal margin in compact layouts. |
| PSRR | 75dB at 1kHz; suppresses switching noise from upstream DC/DC converters feeding RF or sensor signal chains. |
| Output Noise | 60µVrms (10Hz–100kHz); minimizes jitter and SNR degradation in ADCs, PLLs, and high-resolution imaging sensors. |
| Quiescent Current | 35µA (one channel active, no load); extends battery life in always-on subsystems such as fingerprint sensors or wake-on-event circuits. |
| Dropout Voltage | 0.22V max at 3.0V/120mA; enables operation from single-cell Li-ion (3.0V min) or regulated 3.3V rails with headroom margin. |
Pinout & Package
X2-DFN1212-6 package: 1.2mm × 1.2mm footprint, 0.4mm height, thermally enhanced with exposed pad (non-functional GND tie recommended).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | VOUT1 | Regulated 3.0V output; requires local 0.47µF ceramic capacitor placed adjacent to pin and GND for stability and transient response. |
| 2 | VOUT2 | Regulated 1.8V output; independently decoupled; supports low-noise digital core supply without cross-regulation coupling. |
| 3 | GND | Analog/digital ground reference; must connect to low-impedance PCB ground plane; thermal pad should be tied to GND copper area for heat dissipation. |
| 4 | EN2 | Active-high enable for Channel 2 (1.8V); logic threshold 1.3V min; floating prohibited - tie to VIN or MCU GPIO for controlled sequencing. |
| 5 | VIN | Shared 1.7–5.25V input; requires ≥0.47µF ceramic capacitor between VIN and GND, placed within 2mm of pin to suppress supply glitches. |
| 6 | EN1 | Active-high enable for Channel 1 (3.0V); independent control allows staggered power-up of RF and baseband subsystems. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent enable inputs | EN1 and EN2 allow asynchronous start-up/shutdown of 3.0V and 1.8V rails - essential for power sequencing in multi-rail SoC designs. |
| Built-in auto-discharge | 50Ω on-chip N-channel FET per output rapidly discharges VOUT when disabled, preventing hold-up voltage that could delay system reset. |
| Low-noise, high-PSRR regulation | 60µVrms noise + 75dB PSRR at 1kHz enables clean supply for RF transceivers and high-speed serial interfaces without additional filtering. |
| Wide input range & low IQ | 1.7–5.25V operation with 35µA quiescent current supports direct connection to Li-ion, USB, or buck converter outputs in space-constrained wearables. |
| Thermally optimized DFN package | X2-DFN1212-6's 1.2×1.2mm footprint and exposed thermal pad reduce board area by >50% vs. SOT-23-6 while enabling 600mW power dissipation. |
Applications
| Fingerprint Modules | Smartphone Camera Systems |
|---|---|
|
Use Scenario: Powering capacitive fingerprint sensor ASIC and its analog front-end under battery-limited conditions. IC Role / Device Role / Timing Role: Dual LDO supplying 3.0V for sensor bias and 1.8V for digital interface logic with independent enable sequencing. Use Value: 35µA quiescent current extends standby time; ±1% accuracy ensures consistent sensor sensitivity; low noise prevents false touch detection. |
Use Scenario: Providing clean, sequenced power to image sensor (1.8V) and ISP core (3.0V) in mobile camera modules. IC Role / Device Role / Timing Role: Dual-output LDO with independent EN pins enabling precise power-up order to avoid latch-up or initialization failure. Use Value: 60µVrms output noise preserves image SNR; 75dB PSRR rejects noise from nearby RF power amplifiers and display drivers. |
| RF Front-End Supplies | Portable Media Players |
|
Use Scenario: Delivering stable 3.0V and 1.8V to RF transceiver ICs (e.g., Bluetooth/Wi-Fi SoCs) in compact wireless adapters. IC Role / Device Role / Timing Role: Low-dropout regulator handling dynamic load steps up to 130mA while maintaining <30mV load regulation error. Use Value: 0.22V dropout at 3.0V/120mA allows operation from single-cell Li-ion down to 3.22V; fast load transient response prevents RF desense. |
Use Scenario: Powering audio codec (1.8V), NAND flash interface (3.0V), and display driver in battery-powered media players. IC Role / Device Role / Timing Role: Dual fixed-output LDO replacing discrete regulators to reduce BOM count and PCB area in ultra-thin form factors. Use Value: X2-DFN1212-6 package saves >0.8mm² vs. SOT-23; RoHS/halogen-free construction meets global environmental compliance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AP7345D-3018FS6-7 | Successor device; identical pinout, same 3.0V/1.8V outputs, improved 130mA guaranteed current limit (vs. 157mA ±25mA), lower 25µA IQ. | Recommended for new designs; supports tighter current tolerance and longer battery life in always-on sensor nodes. | Select AP7345D if designing for production beyond Q3 2024; AP7346 remains viable for legacy design refresh or cost-sensitive replacements. |
| MCP1826S-3002E/DB | Microchip dual LDO; 3.0V/1.8V outputs, but only 100mA per channel, no auto-discharge, larger SOT-23-6 package, higher 90µA IQ. | Suitable for non-critical, low-transient applications where board space and noise are less constrained. | Choose only if AP7346D-3018FS6-7 is unavailable and thermal/noise specs are relaxed; verify EN logic compatibility (active-low vs. active-high). |
Compared with AP7345D-3018FS6-7, this part offers broader current limit tolerance and slightly higher IQ but retains identical pinout and layout - making it suitable for drop-in replacement in existing AP7346 designs; versus MCP1826S, it delivers superior noise, PSRR, and thermal performance in half the footprint.
Availability
AP7346D-3018FS6-7 is available at Aetrix Electronics and suitable for fingerprint modules, smartphone camera systems, and RF front-end supplies requiring stable component supply with full traceability and long-term continuity support.
Supply support for AP7346D-3018FS6-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.
The AP7346 belongs to Diodes' high-accuracy dual-LDO product line, engineered specifically for space-constrained portable electronics requiring independent, low-noise, and sequenced dual-rail power delivery.
FAQ
Is AP7346D-3018FS6-7 pin-compatible with AP7345D-3018FS6-7?
Yes - both use identical X2-DFN1212-6 packaging and share identical pin assignments (VOUT1, VOUT2, GND, EN2, VIN, EN1). The AP7345D is a direct functional upgrade with tighter current limit specification and lower quiescent current, requiring no PCB redesign.
What is the role of the thermal pad on the AP7346D-3018FS6-7 package?
The exposed thermal pad is not an electrical terminal but a mechanical thermal path. It must be soldered to a large copper area connected to GND for optimal heat dissipation; using it solely as a GND electrode is discouraged per datasheet guidance due to potential thermal-electrical coupling effects.
Can EN1 and EN2 be tied together for simultaneous enable?
Yes - EN1 and EN2 may be connected to a common control signal, provided the driving source meets the 1.3V minimum high-level threshold and can sink/source ≤1.0µA leakage. However, independent control is recommended for power sequencing in multi-rail systems to prevent backfeed or initialization conflicts.
Does AP7346D-3018FS6-7 require external capacitors, and what values are validated?
Yes - a minimum 0.47µF ceramic capacitor is required on both VIN–GND and each VOUT–GND node. The datasheet validates stability with 0.47µF X7R ceramics (≤100mΩ ESR) placed within 2mm of respective pins; larger bulk capacitors may be added for high-dV/dt loads but are not required for basic operation.
AP7346D-3018FS6-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 2
- Voltage - Input (Max):
- 5.25V
- Voltage - Output (Min/Fixed):
- 1.8V, 3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.39V @ 120mA, 0.29V @ 120mA
- Current - Output:
- 130mA, 130mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- -
- PSRR:
- 75dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1212-6
AP7346D-3018FS6-7 FAQ
1.How can I place an order for AP7346D-3018FS6-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for AP7346D-3018FS6-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AP7346D-3018FS6-7 reliable?
The price and inventory of AP7346D-3018FS6-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AP7346D-3018FS6-7 is usually 5 days.
3.What payment methods are accepted for AP7346D-3018FS6-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AP7346D-3018FS6-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AP7346D-3018FS6-7?
AP7346D-3018FS6-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AP7346D-3018FS6-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AP7346D-3018FS6-7?
For technical support, including AP7346D-3018FS6-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AP7346D-3018FS6-7 requirements.
6.How does Aetrix verify that AP7346D-3018FS6-7 is sourced from the original manufacturer or authorized distributors?
All AP7346D-3018FS6-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AP7346D-3018FS6-7 meets industry standards.
7.What is the process for return or replacement of AP7346D-3018FS6-7?
All AP7346D-3018FS6-7 units undergo pre-shipment inspection (PSI). If there is an issue with AP7346D-3018FS6-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AP7346D-3018FS6-7 part is unused and in its original packaging.
Return procedure for AP7346D-3018FS6-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AP7346D-3018FS6-7 Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

