Diodes Incorporated AP7350-12CF4-7

Overview

AP7350-12CF4-7 from Diodes Incorporated is a 1.2V fixed-output, 150mA ultra-low quiescent current LDO regulator in a 0.64mm × 0.64mm X2-WLB0606-4 wafer-level chip-scale package. It delivers ±1% output voltage accuracy across -40°C to +85°C, features 0.25µA typical quiescent current, and integrates an enable pin for power sequencing control - optimized for wearable electronics and IoT sensor modules where battery life and board space are critical.

For engineers reviewing the AP7350-12CF4-7 datasheet, AP7350-12CF4-7 pinout, AP7350-12CF4-7 application, or AP7350-12CF4-7 equivalent, key selection criteria include dropout voltage at 150mA (0.60V max at 1.2V output), EN logic thresholds (0.4V low / 1.0V high), thermal resistance (267°C/W), and compatibility with 0.1µF ceramic input/output capacitors.

Technical Context

The AP7350-12CF4-7 implements a PMOS pass transistor architecture with internal voltage reference and error amplifier, enabling stable regulation down to 2.0V input while maintaining ultra-low ground current. Its enable input controls NMOS-driven shutdown, achieving 0.02µA standby current when EN is low.

Designed for minimal external components, it operates without output discharge circuitry (non-D variant), requires no external compensation, and remains stable with 0.1µF X5R/X7R ceramic capacitors on both input and output - supporting fast load transient response (<10µs recovery) under 1–150mA step loads.

Key Specifications

Pinout & Package

AP7350-12CF4-7 uses the X2-WLB0606-4 wafer-level chip-scale package (0.64mm × 0.64mm, 0.35mm height), featuring SnAgCu solder balls and JEDEC-compliant moisture sensitivity level 1 handling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1700-1202E/TO and XC6206P122MR-G, AP7350-12CF4-7 uniquely combines wafer-level miniaturization, sub-µA quiescent current, 150mA drive, and integrated enable - making it the only viable option for next-generation compact, battery-optimized edge sensing platforms.

Availability

AP7350-12CF4-7 is available at Aetrix Electronics and suitable for wearable electronics, IoT sensor modules, and wireless communication devices requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for AP7350-12CF4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The AP7350 series belongs to Diodes' ultra-low IQ LDO portfolio, engineered specifically for energy-harvesting and battery-powered edge devices where micropower operation and minimal PCB real estate are non-negotiable design requirements.

FAQ

What is the minimum input voltage required for AP7350-12CF4-7 to regulate 1.2V output at 150mA?

The minimum input voltage is determined by dropout: at 150mA, maximum dropout is 0.60V, so VIN must be ≥1.8V. However, the absolute minimum specified VIN is 2.0V per datasheet - this accounts for process variation, temperature drift, and safety margin. Operating below 2.0V risks loss of regulation or increased output error.

Can AP7350-12CF4-7 be used without an input capacitor?

No. A minimum 0.1µF ceramic capacitor between VIN and GND is mandatory per datasheet. Omitting it causes instability, input voltage sag during load transients, and potential oscillation due to insufficient high-frequency decoupling. The capacitor must be placed within 1mm of the VIN and GND pins using short, wide traces.

Does AP7350-12CF4-7 include output discharge functionality?

No. AP7350-12CF4-7 is the non-discharge variant (as indicated by absence of "D" in part number). When EN is pulled low, VOUT floats and discharges only through the load. For active output discharge, select AP7350D-12CF4-7, which integrates a 35Ω internal pull-down FET between VOUT and GND during shutdown.

Is the X2-WLB0606-4 package compatible with standard reflow soldering processes?

Yes. The X2-WLB0606-4 package is qualified for lead-free reflow per JEDEC J-STD-020, with moisture sensitivity level 1 (unlimited floor life at ≤30°C/60% RH). Recommended peak reflow temperature is 260°C for ≤30 seconds; solder profile must avoid thermal shock to prevent delamination of the silicon die from the substrate.