Diodes Incorporated AP7361C-10E-13

Overview

AP7361C-10E-13 from Diodes Incorporated is a 1A fixed-output (1.0V) ultra-low dropout linear regulator with enable, designed for precision voltage regulation in space-constrained power rails. It delivers ±1% output accuracy, 360mV dropout at 1A (for 3.3V variant; 1.0V variant exhibits ~710mV at 300mA), 60µA quiescent current, and integrates thermal shutdown, fold-back short-circuit protection (400mA), and current limiting (1.5A). It is used in LCD-TV power domains requiring stable low-voltage biasing.

For engineers reviewing the AP7361C-10E-13 datasheet, AP7361C-10E-13 pinout, AP7361C-10E-13 application, or AP7361C-10E-13 equivalent, key selection criteria include dropout performance at 1.0V output, EN pin logic thresholds (VIH = 1.0V min), SO-8EP thermal resistance (100°C/W), stability with ≥2.2µF MLCC output capacitors, and compatibility with 2.2–6.0V input sources.

Technical Context

The AP7361C-10E-13 implements a PMOS pass element architecture enabling ultra-low dropout and high PSRR (75dB @ 1kHz). Its internal 0.8V bandgap reference and error amplifier regulate output via feedback to the ADJ/NC pin - unused in fixed 1.0V configuration but retained as no-connect in SO-8EP package.

Enable control is active-high with VIH ≥1.0V and VIL ≤0.3V; EN leakage is ±0.1µA. Thermal shutdown triggers at ~150°C with 20°C hysteresis, and current limit engages at 1.1–1.5A depending on VIN–VOUT differential, providing robust fault protection without external components.

Key Specifications

Pinout & Package

AP7361C-10E-13 is packaged in SO-8EP (exposed pad), a thermally enhanced 8-pin surface-mount package with integrated heat slug. The exposed pad must be soldered to a PCB thermal plane for effective junction-to-ambient heat dissipation (θJA = 100°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO applications.

Compared with MCP1703T-1002E/MB and XC6210B102MR-G, AP7361C-10E-13 uniquely combines 1A capability, SO-8EP thermal performance, and integrated EN control - making it the only viable option for high-current, thermally demanding 1.0V applications in consumer and industrial displays.

Availability

AP7361C-10E-13 is available at Aetrix Electronics and suitable for LCD-TV panel biasing, set-top box core logic regulation, and smart home appliance MCU power delivery requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for AP7361C-10E-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal devices, with manufacturing certified to IATF16949:2016 and products compliant with AEC-Q100/101/200 standards.

The AP7361C belongs to Diodes' high-performance LDO portfolio targeting low-noise, low-dropout power management in consumer, industrial, and automotive infotainment systems - emphasizing thermal robustness, PSRR, and compact packaging.

FAQ

What is the minimum input voltage required for AP7361C-10E-13 to maintain 1.0V output at 1A?

The minimum input voltage is determined by dropout: at 1A, typical dropout for 1.0V output is ~840mV (per datasheet Table 2, "VDROPOUT" row for 1.0V≤VOUT<1.1V, IOUT=1A). Therefore, VIN(min) = 1.0V + 0.84V = 1.84V. However, the absolute minimum specified input is 2.2V - so reliable 1A operation requires VIN ≥2.2V, with margin for line regulation and temperature drift.

Can AP7361C-10E-13 be used without connecting the EN pin?

Yes - the EN pin has an internal 3.0MΩ pull-down resistor, so leaving it unconnected defaults the device to OFF state. To ensure guaranteed turn-on, EN must be actively driven to ≥1.0V (VIH min). For always-on operation, tie EN directly to IN; do not leave floating in noise-prone environments due to potential false triggering.

Is the SO-8EP package's exposed pad required to be connected to GND?

Yes - the exposed pad is internally connected to GND and serves as the primary thermal and electrical ground path. It must be soldered to a dedicated PCB copper pour tied to the main GND plane using ≥4 thermal vias (0.3mm diameter, spaced ≤1mm apart) to achieve the rated θJA = 100°C/W and prevent thermal shutdown under full load.

Does AP7361C-10E-13 require an output capacitor, and what type is recommended?

Yes - a minimum 2.2µF ceramic capacitor (X5R/X7R) is required between OUT and GND for stability. Larger values (e.g., 4.7µF–10µF) improve load transient response and reduce output ripple. Tantalum or aluminum electrolytic capacitors are not recommended due to higher ESR, which may degrade stability and transient performance.