Diodes Incorporated AP7361C-10SPR-13

Overview

AP7361C-10SPR-13 from Diodes Incorporated is a 1A fixed-output (1.0V) ultra-low dropout linear regulator with enable, designed for precision voltage regulation in space-constrained and battery-sensitive systems. It delivers ±1% output accuracy, 360mV dropout at 1A (for 3.3V variant; 1.0V variant dropout is 710mV typ. at 300mA), 60µA quiescent current, and integrates thermal shutdown, fold-back short-circuit protection (400mA), and current limit (1.5A). It is used in LCD-TV power rails, set-top-box core logic supplies, and home appliance microcontroller domains.

For engineers reviewing the AP7361C-10SPR-13 datasheet, AP7361C-10SPR-13 pinout, AP7361C-10SPR-13 application, or AP7361C-10SPR-13 equivalent, key selection criteria include its SO-8EPR package thermal performance (θJA = 100°C/W), EN pin logic thresholds (VIH = 1.0V min), stability with ≥2.2µF MLCC output capacitors, and fixed 1.0V output configuration requiring no external feedback resistors.

Technical Context

The AP7361C-10SPR-13 implements a PMOS pass transistor architecture enabling ultra-low dropout operation and high PSRR (75dB @ 1kHz). Its internal 0.8V bandgap reference and error amplifier regulate output via closed-loop feedback - in fixed-mode variants like this one, the ADJ/NC pin is unused and internally tied to the reference node.

Enable control is implemented as a logic-level input (VIH ≥ 1.0V, VIL ≤ 0.3V) driving an internal gate driver; the EN pin exhibits 3.0MΩ internal pull-down resistance and sub-0.1µA leakage. Thermal shutdown activates at ~150°C with 20°C hysteresis, and current limiting engages at 1.1–1.5A with fold-back behavior reducing short-circuit current to ~400mA.

Key Specifications

Pinout & Package

AP7361C-10SPR-13 is packaged in SO-8EPR - an exposed-pad SOIC variant with enhanced thermal dissipation (θJA = 100°C/W), 8 pins, and lead-free matte tin plating compliant with MIL-STD-202 Method 208.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO regulator applications.

Compared with MCP1700-1002E/MB and XC6210B102MR-G, AP7361C-10SPR-13 uniquely balances 1A capability, 60µA IQ, EN control, and SO-8EPR thermal robustness - making it optimal for industrial and consumer electronics demanding both performance and reliability under variable load conditions.

Availability

AP7361C-10SPR-13 is available at Aetrix Electronics and suitable for LCD-TV power management, set-top-box core logic, and home appliance MCU supply requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for AP7361C-10SPR-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal components, with design centers across Asia, Europe, and the US, and manufacturing in ISO/TS 16949-certified facilities.

The AP7361C belongs to Diodes' high-performance LDO regulator product line, engineered for low-noise, low-dropout power delivery in consumer, industrial, and computing applications where precision voltage regulation and thermal resilience are critical.

FAQ

What is the minimum input voltage required for AP7361C-10SPR-13 to maintain 1.0V output at 1A?

The minimum input voltage is determined by dropout: at 1A, typical dropout for 1.0V output is 840mV (per datasheet Table 2, "VDROPOUT" row for IOUT=1A, 1.0V≤VOUT<1.1V). Thus, VIN(min) = 1.0V + 0.84V = 1.84V. However, the absolute minimum specified VIN is 2.2V - so reliable 1A operation requires VIN ≥ 2.2V per recommended conditions.

Can AP7361C-10SPR-13 be used without connecting the EN pin?

Yes, but only if the application requires the regulator to remain permanently enabled. In that case, the EN pin must be tied directly to the IN pin (not left floating), as specified in the Application Information section. Leaving EN unconnected risks undefined behavior due to leakage paths and may cause erratic turn-on/turn-off.

Is the SO-8EPR package of AP7361C-10SPR-13 thermally compatible with standard SO-8 footprints?

No - SO-8EPR includes an exposed thermal pad on the underside that is electrically and thermally connected to GND. It requires a dedicated PCB footprint with solder mask defined for the pad, thermal vias to inner ground planes, and stencil aperture matching. Using a standard SO-8 land pattern will result in poor thermal performance and potential solder joint voiding.

Does AP7361C-10SPR-13 require an external output capacitor, and what type is recommended?

Yes - a minimum 2.2µF ceramic capacitor (X5R or X7R dielectric) is required between OUT and GND for stability, as confirmed in the Electrical Characteristics and Application Information sections. Tantalum or aluminum electrolytic capacitors are not recommended due to ESR sensitivity; MLCCs ensure fast transient response and guaranteed phase margin across temperature and voltage.