Diodes Incorporated AP7361C-12ER-13

Overview

AP7361C-12ER-13 from Diodes Incorporated is a 1A, fixed-output (1.2V), ultra-low dropout linear regulator with enable functionality in SOT223R package. It delivers ±1% output voltage accuracy, 360mV dropout at 1A (for 3.3V variant; 1.2V variant dropout is 600mV typ at 300mA), and 60µA typical quiescent current. Designed for power rail regulation in space-constrained portable electronics, it integrates thermal shutdown, fold-back short-circuit protection (400mA), and current limiting (1.5A).

For engineers reviewing the AP7361C-12ER-13 datasheet, AP7361C-12ER-13 pinout, AP7361C-12ER-13 application, or AP7361C-12ER-13 equivalent, key selection criteria include its 1.2V fixed output, SOT223R thermal pad layout, EN pin logic thresholds (VIH = 1.0V min), stability with ≥2.2µF MLCC output capacitors, and junction temperature limit of +150°C.

Technical Context

The AP7361C-12ER-13 implements a PMOS pass transistor architecture enabling ultra-low dropout operation and high PSRR (75dB @ 1kHz). Its internal 0.8V band-gap reference feeds an error amplifier that regulates output via adjustable feedback (not used in fixed 1.2V version) or factory-trimmed resistor network.

Enable control is implemented with a dedicated EN pin requiring ≥1.0V to activate; internal 3.0MΩ pull-down ensures default-off behavior. Protection circuitry includes fold-back current limiting (triggering at ~400mA during short-circuit) and thermal shutdown with 20°C hysteresis (trip at +150°C, resume at +130°C).

Key Specifications

Pinout & Package

SOT223R package features exposed thermal pad on bottom side for enhanced heat dissipation; pin 1 = GND, pin 2 = OUT, pin 3 = IN. Requires minimum 2.2µF ceramic output capacitor between OUT and GND, placed adjacent to pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO regulator applications.

Compared with MCP1703T-1202E/MB and TLS850B2TE/V33, the AP7361C-12ER-13 uniquely balances 1A capability, 60µA IQ, EN control, and SOT223R thermal performance - making it optimal for cost-sensitive, medium-current portable and industrial embedded designs requiring fast enable/disable cycling.

Availability

AP7361C-12ER-13 is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC I/O modules, smart home hub controllers, and automotive body control units requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for AP7361C-12ER-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP7361C belongs to Diodes' high-performance LDO regulator family, engineered for low-noise, low-quiescent-current power delivery in battery-operated and thermally constrained embedded systems.

FAQ

What is the minimum input voltage required for stable 1.2V output at 1A load?

The AP7361C-12ER-13 requires VIN ≥ VOUT + V_DROPOUT. At 1A, the dropout for 1.2V output is not explicitly specified in the datasheet; however, based on the 1.1–1.2V bin (600mV typ at 300mA), worst-case dropout at 1A is estimated ≤780mV. Thus, minimum VIN is 1.2V + 0.78V = 1.98V - but the recommended operating minimum is 2.2V per datasheet specifications to ensure margin and stability.

Can the EN pin be left unconnected, or must it be tied high?

The EN pin must not be left floating. It has an internal 3.0MΩ pull-down resistor, so leaving it open defaults the device to OFF. To ensure reliable operation, tie EN directly to IN (for always-on) or drive it actively with a logic signal meeting VIH ≥1.0V and VIL ≤0.3V. Floating EN risks erratic enable behavior due to noise coupling.

Is the SOT223R package thermally superior to standard SOT223 for this device?

Yes. The SOT223R pinout (GND–OUT–IN) positions the thermal pad directly under the die, improving thermal resistance versus standard SOT223 (IN–GND–OUT), which places the pad offset. θ_JA for SOT223R is identical to SOT223 (110°C/W), but the reversed pinout enables more direct thermal path routing in PCB layout - especially beneficial for 1A continuous operation near thermal limits.

Does the ±1% output voltage accuracy include line, load, and temperature variation?

Yes. The ±1% specification applies under recommended operating conditions: IOUT = 100mA, TA = +25°C, and VIN = VOUT +1V. It encompasses initial tolerance, line regulation (≤0.2%/V), load regulation (≤±1.5%), and temperature coefficient (±100ppm/°C over –40°C to +85°C), resulting in total output variation within ±1% across full operating range.