Diodes Incorporated AP7361C-FGE-7

Overview

AP7361C-FGE-7 from Diodes Incorporated is a 1A adjustable/fixed-output ultra-low dropout linear regulator with enable, designed for point-of-load regulation in space-constrained systems. It delivers ±1% output voltage accuracy, 360mV dropout at 1A (3.3V), 60µA quiescent current, and integrates thermal shutdown, fold-back short-circuit protection (400mA), and current limit (1.5A). It powers core logic rails in LCD-TVs, set-top boxes, and home appliances.

For engineers reviewing the AP7361C-FGE-7 datasheet, AP7361C-FGE-7 pinout, AP7361C-FGE-7 application, or AP7361C-FGE-7 equivalent, key selection criteria include dropout performance at 1A load, EN pin logic thresholds (VIH = 1.0V, VIL = 0.3V), stability with ≥2.2µF MLCC output capacitors, and thermal resistance (θJA = 70°C/W) in the U-DFN3030-8 package.

Technical Context

The AP7361C-FGE-7 uses a PMOS pass element enabling ultra-low dropout operation and supports both fixed-output (1.0–3.3V) and adjustable (0.8–5.0V) configurations via external resistor divider. Its internal 0.8V band-gap reference ensures precise feedback control across temperature.

It implements active high-enable logic with 3.0MΩ internal pull-down, fold-back current limiting that reduces short-circuit current to 400mA, and thermal shutdown at 150°C with 20°C hysteresis. PSRR reaches 75dB at 1kHz, supporting noise-sensitive analog and digital loads.

Key Specifications

Pinout & Package

AP7361C-FGE-7 is housed in a 3.0mm × 3.0mm × 0.55mm U-DFN3030-8 (Type E) package with wettable flank leads and an exposed thermal pad (Pin 4) for enhanced heat dissipation. The package has 8 terminals, with Pin 4 serving as the thermal pad connected internally to GND.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-dropout linear regulator applications.

Compared with MCP1703T-3302E/MB and TLS850F3BVT, AP7361C-FGE-7 uniquely balances 1A output, ultra-low dropout, enable control, and compact U-DFN3030-8 packaging - making it optimal for high-density consumer electronics where thermal performance and dynamic power management are critical.

Availability

AP7361C-FGE-7 is available at Aetrix Electronics and suitable for LCD-TV power rails, set-top box audio subsystems, and smart appliance MCU core supplies requiring stable component supply, long-term lifecycle support, and RoHS-compliant green packaging.

Supply support for AP7361C-FGE-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP7361C belongs to Diodes' high-performance LDO portfolio targeting space-constrained, battery-sensitive, and noise-critical consumer electronics - emphasizing ultra-low dropout, low IQ, and robust protection features.

FAQ

What is the minimum output capacitor required for stability with AP7361C-FGE-7?

The AP7361C-FGE-7 is stable with a minimum 2.2µF ceramic output capacitor (X5R/X7R) placed within 2mm of the OUT and GND pins. Larger values improve load transient response but are not required for basic stability. Tantalum or aluminum electrolytic capacitors are not recommended due to ESR sensitivity.

Can AP7361C-FGE-7 be used in adjustable-output mode?

Yes - AP7361C-FGE-7 supports adjustable output from 0.8V to 5.0V using an external resistor divider connected between OUT, ADJ, and GND. The internal 0.8V reference sets VOUT = 0.8V × (1 + R1/R2), with R2 ≤ 80kΩ to maintain reference stability.

Does AP7361C-FGE-7 require a minimum load current?

No - AP7361C-FGE-7 remains stable and regulated with zero load current. Unlike some older LDOs, it does not require a minimum load for loop stability, simplifying design for standby and sleep modes in battery-powered devices.

How is thermal performance managed in the U-DFN3030-8 package?

The U-DFN3030-8 package uses an exposed thermal pad (Pin 4) connected to GND. Reliable thermal performance requires soldering this pad to a dedicated PCB ground plane with ≥4 thermal vias (0.3mm diameter, spaced ≤1mm apart) to inner-layer copper pours, achieving the rated θJA of 70°C/W.