Diodes Incorporated AP7361EA-25ER-13

Overview

AP7361EA-25ER-13 from Diodes Incorporated is a 1A fixed-output (3.3V) ultra-low dropout linear regulator in SOT223R package with enable control, ±1% output accuracy, 360mV dropout at 1A, and 68µA quiescent current-designed for stable power delivery in LCD TVs, set-top boxes, and battery-powered audio/video equipment.

For engineers reviewing the AP7361EA-25ER-13 datasheet, AP7361EA-25ER-13 pinout, AP7361EA-25ER-13 application, or AP7361EA-25ER-13 equivalent, key selection factors include dropout voltage at full load, EN logic thresholds, thermal shutdown behavior, PSRR at 1kHz, and compatibility with 2.2µF MLCC output capacitors.

Technical Context

The AP7361EA-25ER-13 integrates a PMOS pass element with internal 0.8V bandgap reference and error amplifier to regulate fixed 3.3V output. Its foldback short-circuit protection limits current to 400mA during fault conditions, while thermal shutdown activates at ~150°C with 20°C hysteresis.

Enable functionality operates with VIH ≥ 1.0V and VIL ≤ 0.3V, supporting direct GPIO interfacing. The device achieves 75dB PSRR at 1kHz and maintains stability with ≥2.2µF ceramic output capacitance across –40°C to +85°C ambient range.

Key Specifications

Pinout & Package

SOT223R package: thermally enhanced 4-pin variant with exposed pad connected to GND for improved heat dissipation (θJA = 110°C/W, θJC = 21.8°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO regulator applications.

Compared with MCP1703T-3302E/MB and TLS850F3BXTMA1, the AP7361EA-25ER-13 uniquely balances 1A capability, ultra-low dropout, enable control, and industrial temperature range in a compact SOT223R package-making it optimal for mid-power consumer electronics where thermal headroom and sequencing flexibility matter.

Availability

AP7361EA-25ER-13 is available at Aetrix Electronics and suitable for LCD TV power management, set-top box core logic, and portable audio amplifier subsystems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for AP7361EA-25ER-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP7361EA belongs to Diodes' high-performance LDO family targeting consumer, computing, and industrial power rails where low dropout, low IQ, and robust protection are mandatory.

FAQ

What is the minimum input voltage required for AP7361EA-25ER-13 to regulate 3.3V output at 1A?

The minimum input voltage is 3.66V-calculated as 3.3V + 360mV typical dropout. At lower inputs, regulation fails and VOUT drops proportionally. Absolute minimum VIN is 2.2V per datasheet, but that only supports sub-100mA loads at 3.3V due to increasing dropout.

Can AP7361EA-25ER-13 operate without an external output capacitor?

No. A minimum 2.2µF ceramic capacitor is required on the OUT pin for stability and transient response. Omitting it causes oscillation and potential damage. The device is optimized for MLCCs but also supports E-cap, tan-cap, or solid polymer types ≥2.2µF.

How does the EN pin behave during power-up when left unconnected?

An unconnected EN pin is not valid-its leakage current (±0.1µA) and internal 3.0MΩ pull-down resistor mean it may float near threshold, causing erratic turn-on. Per datasheet, EN must be tied to IN (for always-on) or actively driven to ensure deterministic startup behavior.

Is the SOT223R package thermally superior to standard SOT223 for AP7361EA-25ER-13?

Yes. The SOT223R variant includes an exposed thermal pad that reduces θJA by ~15°C/W versus standard SOT223 (110°C/W vs. 125°C/W typical). When soldered to ≥1cm² copper area connected to GND, it improves power handling by up to 18% at +85°C ambient.