Diodes Incorporated AP7365-33YG-13

Overview

AP7365-33YG-13 from Diodes Incorporated is a fixed-output 3.3V, 600mA low-dropout linear regulator in SOT89 package with 35μA quiescent current, 300mV dropout at full load, and integrated enable control. It delivers stable power to FPGA I/O rails and DSP core supplies in battery-powered notebooks and servers under fast transient load changes.

For engineers reviewing the AP7365-33YG-13 datasheet, AP7365-33YG-13 pinout, AP7365-33YG-13 application, or AP7365-33YG-13 equivalent, key selection criteria include dropout voltage at 600mA, PSRR at 1kHz, thermal shutdown threshold, EN logic thresholds, and stability with 1μF ceramic output capacitor.

Technical Context

The AP7365-33YG-13 implements a PMOS pass transistor architecture enabling low dropout (300mV @ 600mA) and ultra-low quiescent current (35μA typ). Its internal 0.8V bandgap reference and error amplifier regulate output precisely across -40°C to +85°C ambient.

It integrates active current limiting (1.4A typ), short-circuit protection (240mA clamp), and thermal shutdown (145°C trip, 15°C hysteresis). The EN pin accepts 1.4V logic-high threshold and supports direct tie-to-IN for always-on operation.

Key Specifications

Pinout & Package

SOT89-3 (Y Package) with exposed thermal pad on pin 3 (IN), providing 133°C/W junction-to-ambient thermal resistance when mounted per recommended PCB layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with AP7365-33YG-13, AP7361-33SG-7 trades current capacity for smaller footprint, while AP2210-33W5-7 sacrifices protection and efficiency for lower unit cost-neither matches the 600mA/35μA/thermal-shutdown combination in SOT89.

Availability

AP7365-33YG-13 is available at Aetrix Electronics and suitable for portable computing, FPGA power management, server BMC subsystems, and wireless modem designs requiring stable component supply with guaranteed long-term sourcing.

Supply support for AP7365-33YG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP7365 series targets battery-powered and thermally constrained systems needing high-efficiency, fast-response LDOs with integrated protection-designed specifically for FPGA, DSP, and mobile processor power rails.

FAQ

What is the minimum input voltage required for AP7365-33YG-13 to maintain regulation at 600mA?

The device requires VIN ≥ 3.6V to sustain 3.3V output at 600mA, based on its 300mV dropout specification at that load. Below 3.6V, output voltage drops linearly with input; operation below 2.0V is outside recommended conditions and may cause instability or shutdown.

Can AP7365-33YG-13 operate without an output capacitor?

No. A minimum 1μF ceramic capacitor is mandatory between OUT and GND for stability, as confirmed in the datasheet's Application Information section. Omitting it risks oscillation, excessive overshoot/undershoot during load transients, and potential thermal shutdown due to instability-induced power dissipation.

Is the EN pin internally pulled up or down?

The EN pin has no internal pull-up or pull-down resistor. It must be actively driven: ≥1.4V for enable, ≤0.4V for disable. If unused, tie directly to IN to ensure permanent enable-floating EN causes undefined behavior and possible erratic output toggling.

How does thermal performance differ between SOT89 and U-DFN2020-6 packages?

SOT89 (Y package) offers 133°C/W θJA, while U-DFN2020-6 (SN package) provides 132°C/W-nearly identical thermal resistance. However, SOT89's larger tab area improves heat spreading on standard FR-4 boards, whereas U-DFN2020-6 requires optimized thermal vias under the pad for equivalent performance.