Microchip Technology AT17F080-30BJC

Overview

AT17F080-30BJC from Microchip Technology (formerly Atmel) is an 8-Mbit in-system programmable serial configuration PROM designed to store FPGA bitstreams for SRAM-based FPGAs including Xilinx Virtex®, Spartan®, XC4000™, and Altera FLEX® devices. It delivers 33 MHz serial download speed, supports 5V-tolerant I/O pins, operates at 3.3V ±10%, and features cascading capability via CEO/CE daisy-chain for multi-device configurations.

For engineers reviewing the AT17F080-30BJC datasheet, AT17F080-30BJC pinout, AT17F080-30BJC application, or AT17F080-30BJC equivalent, key selection criteria include industrial temperature range (-40°C to +85°C), 44-lead PLCC package compatibility, page-selectable memory partitioning, ISP via 2-wire bus, and low-power standby current ≤1 mA.

Technical Context

The AT17F080-30BJC implements a serial-access flash memory architecture with integrated control logic for FPGA master-serial mode boot loading. Its internal address counter, page-select decoder (PAGESEL[1:0]), and partitioned memory map enable four independent 2-Mbit configuration pages when PAGE_EN is asserted high.

It uses dual-mode operation: SER_EN = 1 enables FPGA configuration mode with CLK-driven serial readout and CEO-controlled daisy-chaining; SER_EN = 0 activates 2-wire ISP programming using A2 as chip-select and internal charge-pump voltage generation - eliminating need for external programming voltages.

Key Specifications

Pinout & Package

AT17F080-30BJC is housed in a 44-lead Plastic Leaded Chip Carrier (PLCC) package (JEDEC MS-018, Variation AC), measuring 17.4 mm × 17.4 mm × 3.9 mm with 1.27 mm lead pitch and J-bend terminations. This package provides robust thermal performance (θJA = 50°C/W) and mechanical reliability for through-hole or surface-mount assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration memory applications.

Compared with XC18V08PC44C, AT17F080-30BJC offers broader FPGA vendor compatibility, 5 V-tolerant I/O, and in-system programmability; compared with AT17F080-30TQI, it provides superior thermal dissipation and mechanical mounting stability in industrial enclosures.

Availability

AT17F080-30BJC is available at Aetrix Electronics and suitable for FPGA configuration, industrial control systems, and reconfigurable computing applications requiring stable component supply, long-term lifecycle assurance, and industrial temperature qualification.

Supply support for AT17F080-30BJC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology acquired Atmel in 2016 and maintains full product support, documentation, and manufacturing continuity for the AT17F series.

The AT17F series was originally developed by Atmel to provide cost-effective, pin-compatible configuration memory for SRAM-based FPGAs across multiple vendors, emphasizing ease of integration, industrial reliability, and field-upgradability.

FAQ

What is the primary function of the AT17F080-30BJC in an FPGA-based system?

The AT17F080-30BJC serves as a dedicated serial configuration PROM that stores and delivers the bitstream required to initialize SRAM-based FPGAs such as Xilinx Virtex® and Spartan® families. During power-up or reset, it streams configuration data synchronously to the FPGA's DIN pin under control of the FPGA's CCLK signal. The AT17F080-30BJC handles address sequencing, output enable timing, and daisy-chain coordination via its CEO pin - eliminating need for external controllers. Its 8-Mbit capacity supports complex FPGA designs with minimal footprint.

Can the AT17F080-30BJC be reprogrammed in the field without removing it from the PCB?

Yes, the AT17F080-30BJC supports in-system programming (ISP) via its 2-wire serial interface when SER_EN is pulled low. In this mode, the device accepts new configuration data using standard I²C-compatible protocol with A2 serving as device address select. Programming occurs at 3.3 V only - internal charge pumps generate required high voltages, so no external VPP supply is needed. This capability enables firmware updates, bitstream patches, or hardware variant changes directly in deployed systems, making AT17F080-30BJC ideal for remote or maintenance-sensitive applications.

How does the page-select feature of the AT17F080-30BJC improve system flexibility?

The AT17F080-30BJC's PAGE_EN and PAGESEL[1:0] pins divide its 8-Mbit memory into four independent 2-Mbit pages. When PAGE_EN is high, users can dynamically select any page using PAGESEL0/PAGESEL1 to load different FPGA configurations - for example, test firmware, production firmware, safety-critical backup, or hardware variant-specific logic. This eliminates need for multiple PROMs or external multiplexing logic. The AT17F080-30BJC retains page selection state across power cycles, enabling persistent configuration mode selection without host processor intervention.

Is the AT17F080-30BJC compatible with both Xilinx and Altera FPGAs?

Yes, the AT17F080-30BJC is explicitly validated for interoperability with Xilinx XC3000™, XC4000™, XC5200™, Spartan®, and Virtex® FPGAs, as well as Altera FLEX® and APEX™ devices. Its timing parameters (e.g., TOE = 50 ns, TCAC = 30 ns) meet or exceed requirements for master-serial configuration interfaces across these families. The AT17F080-30BJC's 5 V-tolerant I/O pins simplify connection to older 5 V FPGA configuration controllers, while its 3.3 V core operation aligns with modern FPGA I/O standards - ensuring seamless integration without level-shifting circuitry.

What packaging and thermal characteristics define the AT17F080-30BJC variant?

The AT17F080-30BJC uses a 44-lead Plastic Leaded Chip Carrier (PLCC) package (JEDEC MS-018, Variation AC), with body dimensions of 17.4 mm × 17.4 mm × 3.9 mm and 1.27 mm lead pitch. Its thermal resistance is characterized as θJA = 50°C/W, enabling reliable operation at full speed in industrial ambient temperatures up to +85°C without forced airflow. The PLCC package provides strong mechanical retention for through-hole mounting and excellent solder-joint reliability in thermally cycled environments - a key advantage over TQFP alternatives in ruggedized equipment.