Microchip Technology AT18F002-30XU
- Part No.:
- AT18F002-30XU
- Manufacturer:
- Microchip Technology
- Category:
- Configuration PROMs for FPGAs
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT18F002-30XU.pdf
- Description:
- IC FLASH CONFIG 2MBIT 20-TSSOP
- Quantity:
- Payment:

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Product details
Overview
AT18F002-30XU from Atmel is a 2-Mbit JTAG In-System Programmable (ISP) configuration PROM designed to store and serially load bitstream data into FPGAs including Xilinx Virtex-II, Spartan-3, and Virtex-II Pro families. It operates with 3.3V internal supply (VCCINT), supports 1.8V/2.5V/3.3V I/O (VCCO), delivers up to 33 MHz configuration clock speed, and features IEEE 1532 ISP and IEEE 1149.1 boundary-scan testability in a 20-lead TSSOP package.
For engineers reviewing the AT18F002-30XU datasheet, AT18F002-30XU pinout, AT18F002-30XU application, or AT18F002-30XU equivalent, key selection criteria include JTAG ISP compatibility, cascading CEO support for multi-FPGA systems, low-power standby current (<1 mA), open-collector DATA output with 20 kΩ pull-up, and functional equivalence to Xilinx XCFxxS series PROMs for Spartan/Virtex configuration.
Technical Context
The AT18F002-30XU implements a serial flash-based configuration memory architecture with dedicated download interface logic that directly drives FPGA configuration pins (CLK, RESET/OE, CE, CF). Its internal address counter and tri-state control logic enable master-serial and slave-serial FPGA boot modes without external controllers.
JTAG compliance includes full IEEE 1532 programming algorithm support and IEEE 1149.1 boundary-scan testing via TCK/TMS/TDI/TDO pins, with automatic power-on TAP reset and BSDL-defined scan cells on all I/Os. The device uses a low-power CMOS FLASH process and supports daisy-chained configuration via CEO-to-CE interconnection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 2,097,152 × 1-bit (2 Mbit) - provides sufficient storage for mid-complexity FPGA bitstreams (e.g., XC2V250, XC3S400) |
| VCCINT Supply | 3.0–3.6 V (typ. 3.3 V) - powers internal logic and enables stable operation across industrial temperature range (−40°C to +85°C) |
| VCCO Range | 1.7–3.6 V - supports mixed-voltage FPGA I/O interfaces including 1.8V, 2.5V, and 3.3V domains |
| Configuration Clock | Up to 33 MHz - enables fast FPGA startup time; minimum clock period 30 ns |
| Standby Current | <1 mA at 3.6 V - reduces system power during FPGA idle or reconfiguration hold states |
| Endurance | 100,000 write cycles - supports field firmware updates and design iteration without premature wear-out |
| Package | 20-lead TSSOP (20A2, 4.4 × 6.5 mm, 0.65 mm pitch) - surface-mount compatible with standard PCB assembly processes |
Pinout & Package
AT18F002-30XU is housed in a RoHS-compliant 20-lead Thin Shrink Small Outline Package (TSSOP), designated 20A2 per JEDEC MO-153 AC. The package features 0.65 mm lead pitch, 4.4 mm width, and 6.5 mm length, optimized for high-density FPGA carrier boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DATA (Pin 1) | Open-collector bi-directional data bus | Drives FPGA configuration data with internal 20 kΩ pull-up; requires external pull-up if used as input during JTAG programming |
| CLK (Pin 3) | Configuration clock input | Synchronizes bitstream readout; internal 20 kΩ pull-up ensures defined state when unconnected |
| RESET/OE (Pin 8) | Active-Low reset / Active-High output enable | Resets internal address counter on low pulse; enables DATA driver when high and CE is low |
| CE (Pin 10) | Chip enable input | Active-low control of address counter and output driver; high state forces low-power standby mode (<1 mA) |
| CF (Pin 7) | Configuration pulse output | Open-drain signal pulsed low by JTAG CONFIG instruction to trigger FPGA reconfiguration without power cycle |
| CEO (Pin 13) | Cascade enable output | Goes low when final bit is clocked out; used to chain multiple AT18F devices in daisy-chain topology |
| TMS/TCK/TDI/TDO (Pins 5/6/4/17) | JTAG test access port | Support IEEE 1149.1 boundary-scan and IEEE 1532 ISP; TMS/TDI have 50 kΩ internal pull-ups to VCCJ |
| VCCINT (Pin 18) | Internal logic supply | +3.3 V supply for core logic; must be decoupled locally to ensure stable configuration timing |
| VCCO (Pin 19) | I/O driver supply | Configurable 1.8/2.5/3.3 V supply for DATA, CLK, RESET/OE, CE, CF, CEO outputs |
| VCCJ (Pin 20) | JTAG I/O supply | Independent 1.8/2.5/3.3 V supply for TMS/TCK/TDI/TDO; enables mixed-voltage JTAG debugging |
| GND (Pin 11) | Power ground reference | Common return path for VCCINT, VCCO, and VCCJ; must be connected to low-impedance system ground plane |
| NC (Pins 2,9,12,14,15,16) | No-connect terminals | Not bonded internally; may be left floating or tied to GND for mechanical stability (not electrically required) |
Key Features
| Feature | Design Value |
|---|---|
| JTAG In-System Programming (IEEE 1532) | Enables field firmware updates without device removal; eliminates socket handling and supports ATE SVF-based programming |
| Cascadable CEO output | Allows daisy-chaining multiple AT18F devices to configure larger FPGAs or multi-FPGA systems using single JTAG chain |
| Multi-voltage I/O support (1.8V/2.5V/3.3V) | Matches diverse FPGA I/O voltage requirements without level-shifting circuitry; VCCO and VCCJ are independently configurable |
| CF pin for JTAG-triggered reconfiguration | Permits FPGA re-initialization via JTAG CONFIG command without power cycling - critical for hot-swap and remote update scenarios |
| Low-power standby mode (<1 mA) | Reduces system-level quiescent power when FPGA is not being configured; CE-high state disables internal logic and output drivers |
Applications
| Industrial FPGA Configuration | Xilinx Spartan-3 Boot System |
|---|---|
Use Scenario: Configuring Xilinx XC3S400 FPGA in an industrial motor control PLC where firmware updates occur in-field via JTAG. IC Role / Device Role / Timing Role: Serial configuration PROM providing bitstream to FPGA upon power-up or JTAG-initiated reload; synchronized by 33 MHz CLK. Use Value: Enables zero-downtime FPGA reconfiguration using AT18F002-30XU's CEO-cascading and CF-triggered reload - eliminating need for system reset or power interruption. | Use Scenario: Booting Spartan-3 XC3S50 in a compact embedded vision module with strict power budget and space constraints. IC Role / Device Role / Timing Role: Primary configuration memory interfacing directly to FPGA's master serial pins (DIN, CCLK, PROG_B, INIT_B). Use Value: AT18F002-30XU's 20-lead TSSOP footprint and 1.8V VCCO support reduce board area and simplify power delivery versus discrete level-shifters. |
| Virtex-II Pro FPGA Initialization | Multi-FPGA JTAG Test Infrastructure |
Use Scenario: Loading configuration for XC2VP2 in a high-reliability aerospace avionics subsystem requiring radiation-tolerant boot integrity. IC Role / Device Role / Timing Role: JTAG-configurable PROM delivering verified bitstream under IEEE 1149.1 boundary-scan test supervision. Use Value: AT18F002-30XU's built-in BSDL-compliant boundary-scan cells allow in-system verification of configuration interface wiring prior to FPGA activation. | Use Scenario: Supporting production test of FPGA-based communication cards using automated JTAG test equipment. IC Role / Device Role / Timing Role: ISP target device within JTAG chain; provides programmable configuration storage while enabling parallel boundary-scan diagnostics. Use Value: AT18F002-30XU's IEEE 1532 compliance and SVF file generation allow seamless integration into ATE platforms without custom programming algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XCF02S | Pin-compatible 2-Mbit PROM; identical 20-pin TSSOP footprint and JTAG interface but lacks CEO cascade output and CF reconfiguration pulse | Designed exclusively for Xilinx FPGAs; no Atmel AT40KAL family support | Select XCF02S only when targeting Xilinx-only designs and cascading is unnecessary |
| Microchip (Atmel) AT17F002 | Same density and TSSOP package; differs in JTAG implementation (IEEE 1149.1 only, no IEEE 1532 ISP) and missing CF/CEO functionality | Limited to legacy Atmel FPGA families; not validated for Xilinx Virtex/Spartan compatibility | Choose AT17F002 only for brownfield Atmel AT40KAL designs where JTAG programming simplicity outweighs cascade needs |
Compared with XCF02S and AT17F002, AT18F002-30XU uniquely combines Xilinx FPGA compatibility, CEO daisy-chaining, CF-triggered reconfiguration, and IEEE 1532 ISP - making it the only option supporting both multi-FPGA scalability and field-upgradable bitstream loading without hardware changes.
Availability
AT18F002-30XU is available at Aetrix Electronics and suitable for industrial automation, embedded vision, aerospace avionics, and communications infrastructure requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for AT18F002-30XU includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Atmel Corporation (now part of Microchip Technology) is a semiconductor manufacturer specializing in microcontrollers, nonvolatile memory, and programmable logic devices for industrial, automotive, and consumer applications.
The AT18F series was developed specifically to provide cost-effective, JTAG-programmable configuration memory for SRAM-based FPGAs - addressing the need for field-upgradable, cascaded, and low-power boot solutions in space-constrained systems.
FAQ
What is the maximum configuration clock frequency supported by AT18F002-30XU?
The AT18F002-30XU supports a maximum configuration clock frequency of 33 MHz, corresponding to a minimum clock period of 30 ns. This timing is validated across the industrial temperature range (−40°C to +85°C) and enables fast FPGA initialization. The device meets all AC timing parameters including TCAC (CLK to Data Delay ≤15 ns) and TOH (Data Hold ≥15 ns) under these conditions. AT18F002-30XU achieves this performance using a low-power CMOS FLASH process with optimized internal address counter logic.
Does AT18F002-30XU support cascading with other configuration PROMs?
Yes, AT18F002-30XU supports hardware cascading via its CEO (Chip Enable Output) pin (Pin 13), which goes low when the internal address counter reaches its maximum value. In a daisy-chain configuration, the CEO of one AT18F002-30XU must connect to the CE input of the next device. This allows sequential configuration of multiple FPGAs or higher-density FPGAs using a single JTAG chain. The AC timing parameter TOCK (CLK to CEO Delay ≤20 ns) ensures deterministic handoff between devices.
Can AT18F002-30XU configure both Xilinx and Atmel FPGAs?
Yes, AT18F002-30XU is functionally compatible with Xilinx Spartan-3, Virtex-II, Virtex-II Pro, and Virtex-4 FPGAs as documented in Table 4-1 of the datasheet, and also supports Atmel AT40KAL series FPGAs. Its pin compatibility with Xilinx XCFxxS PROMs and native support for Xilinx master/slave serial configuration protocols enable drop-in replacement in existing Xilinx designs. For Atmel FPGAs, it maintains backward compatibility with the AT17 series while adding IEEE 1532 ISP and CEO cascade features.
What are the supply voltage requirements for AT18F002-30XU?
AT18F002-30XU requires three independent supply rails: VCCINT (3.0–3.6 V, typ. 3.3 V) for internal logic, VCCO (1.7–3.6 V) for I/O drivers (supporting 1.8V/2.5V/3.3V FPGA interfaces), and VCCJ (1.7–3.6 V) for JTAG I/O drivers. Each rail must be decoupled with local 0.1 µF ceramic capacitors. The device draws ≤10 mA active current per supply and <1 mA in CE-high standby mode, as specified in DC Characteristics Table 11.
Is AT18F002-30XU RoHS compliant and what package does it use?
Yes, AT18F002-30XU is RoHS compliant, halide-free, and lead-free, meeting green packaging requirements. It is supplied exclusively in a 20-lead TSSOP package (designated 20A2 per JEDEC MO-153 AC), measuring 4.4 mm × 6.5 mm with 0.65 mm lead pitch. The package includes exposed pad thermal considerations and conforms to moisture sensitivity level (MSL) 3 per J-STD-020, requiring bake before reflow if exposed beyond floor life.
AT18F002-30XU Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Verified
- Programmable Type:
- FLASH
- Memory Size:
- 2Mb
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
AT18F002-30XU FAQ
1.How can I place an order for AT18F002-30XU through Aetrix?
Please submit a Request for Quotation (RFQ) for AT18F002-30XU on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT18F002-30XU reliable?
The price and inventory of AT18F002-30XU are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT18F002-30XU is usually 5 days.
3.What payment methods are accepted for AT18F002-30XU?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT18F002-30XU transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT18F002-30XU?
AT18F002-30XU orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT18F002-30XU order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT18F002-30XU?
For technical support, including AT18F002-30XU datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT18F002-30XU requirements.
6.How does Aetrix verify that AT18F002-30XU is sourced from the original manufacturer or authorized distributors?
All AT18F002-30XU products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT18F002-30XU meets industry standards.
7.What is the process for return or replacement of AT18F002-30XU?
All AT18F002-30XU units undergo pre-shipment inspection (PSI). If there is an issue with AT18F002-30XU, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT18F002-30XU part is unused and in its original packaging.
Return procedure for AT18F002-30XU:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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