Renesas AT25DF011-XMHNGU-B
- Part No.:
- AT25DF011-XMHNGU-B
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
AT25DF011-XMHNGU-B.pdf
- Description:
- IC FLASH 1MBIT SPI 104MHZ 8TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
AT25DF011-XMHNGU-B from Renesas Electronics is a 1-Mbit SPI serial Flash memory IC designed for code shadowing and embedded data storage in low-voltage systems. It operates from 1.65 V to 3.6 V, supports SPI Modes 0/3 and Dual-Output Read, delivers 104 MHz max clock rate with 6 ns clock-to-output delay, and features flexible erase granularity (256-byte page, 4-kByte/32-kByte blocks) for mixed code+data applications in industrial controllers and IoT edge nodes.
For engineers reviewing the AT25DF011-XMHNGU-B datasheet, AT25DF011-XMHNGU-B pinout, AT25DF011-XMHNGU-B application, or AT25DF011-XMHNGU-B equivalent, key selection criteria include dual-read throughput, ultra-low deep power-down current (200 nA), OTP security register usage, sector protection via WP pin, and compatibility with 1.65–3.6 V host interfaces requiring JEDEC-standard ID read capability.
Technical Context
The AT25DF011-XMHNGU-B implements a dedicated SPI interface with hardware-controlled write protection (WP pin) and HOLD suspend functionality, enabling robust command sequencing without host intervention during critical operations. Its dual-output read mode uses both SI and SO pins as outputs synchronized to SCK falling edges, doubling effective data throughput versus standard read.
Internally, it integrates a 128-byte OTP security register-64 bytes factory-programmed with unique device ID and 64 bytes user-programmable-for secure serialization and key storage. Erase architecture supports concurrent code and data partitioning via uniform 4-kByte and 32-kByte blocks plus fine-grained 256-byte pages, minimizing wasted space in firmware update and logging scenarios.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Mbit (131,072 × 8-bit) - sufficient for boot code, firmware images, and configuration data in space-constrained microcontrollers. |
| Supply Voltage | 1.65 V to 3.6 V - enables direct interfacing with 1.8 V and 3.3 V logic domains without level shifters. |
| Max Clock Frequency | 104 MHz - supports high-speed read access for real-time code execution from external flash. |
| Read Latency | 6 ns clock-to-output (tV) - minimizes wait states when shadowing code into RAM or executing XIP-like flows. |
| Erase Granularity | 256-byte page / 4-kByte block / 32-kByte block - allows precise firmware patching and log rotation without erasing unrelated sectors. |
| Power-Down Current | 200 nA ultra-deep power-down (typical) - extends battery life in always-on sensor nodes and wearable devices. |
| Endurance & Retention | 100,000 P/E cycles at -40°C to +85°C; 20-year data retention - meets industrial lifecycle requirements for field-upgradable systems. |
Pinout & Package
AT25DF011-XMHNGU-B is packaged in an 8-lead SOIC (150-mil) with standard pinout compatible with JEDEC MS-012. All pins are electrically validated per datasheet Rev. J.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS | Chip Select | Active-low enable signal; must transition high-to-low to initiate commands and low-to-high to terminate operations. |
| SCK | Serial Clock | Master-generated clock; rising edge latches input (SI), falling edge clocks output (SO/SI in dual-read mode). |
| SI (I/O0) | Serial Input / Dual-Read Output | Input for commands/addresses/data; becomes bidirectional I/O0 during Dual-Output Read (3Bh opcode) to deliver LSB data stream. |
| SO (I/O1) | Serial Output / Dual-Read Output | Primary output for standard reads; remains I/O1 during Dual-Output Read to deliver MSB data stream alongside I/O0. |
| WP | Write Protect | Hardware lock control; low state enables status register writes and sector protection; internally pulled high. |
| HOLD | Communication Suspend | Pauses ongoing SPI transfers without deselecting device; requires CS asserted and SCK low to activate; internally pulled high. |
| VCC | Power Supply | Single 1.65–3.6 V supply; powers all internal logic and memory array; no auxiliary voltage required. |
| GND | Ground Reference | System ground return path; must be low-impedance connection to minimize noise coupling into SPI signals. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Output Read Mode | Enables 2-bit-per-cycle data transfer using SI and SO simultaneously, increasing effective read bandwidth by 100% over standard SPI read (03h/0Bh). |
| Flexible Erase Architecture | Supports 256-byte page, 4-kByte block, 32-kByte block, and full-chip erase - reduces wasted space in mixed code+data storage partitions. |
| OTP Security Register | 128-byte one-time programmable area: 64 bytes factory-assigned unique ID + 64 bytes user-writable for ESN, keys, or calibration data. |
| Hardware Write Protection | WP pin directly controls sector locking; prevents accidental program/erase when pulled low, independent of software status register settings. |
| Ultra-Low Power Modes | 200 nA ultra-deep power-down and 5 µA deep power-down allow energy harvesting and battery-powered operation for >10 years. |
Applications
| Industrial PLC Firmware Storage | Medical Sensor Data Logging |
|---|---|
Use Scenario: Storing firmware updates and configuration parameters in programmable logic controllers operating in harsh environments with wide temperature swings. IC Role / Device Role / Timing Role: Nonvolatile code storage with fast random-access read and atomic page-level updates to support fail-safe firmware rollback. Use Value: 100,000 P/E cycles and 20-year retention ensure reliable operation across 15+ year product lifecycles without field replacement. | Use Scenario: Capturing time-stamped physiological measurements in portable diagnostic devices powered by coin-cell batteries. IC Role / Device Role / Timing Role: Low-power data buffer with sector-protected logging regions and hardware WP to prevent corruption during brown-out events. Use Value: 200 nA ultra-deep power-down current extends battery life to >5 years in intermittent-sampling modes. |
| Automotive Infotainment Boot Memory | Smart Home Gateway Configuration |
Use Scenario: Holding bootloader and OS kernel images in automotive head units requiring AEC-Q100-compliant components. IC Role / Device Role / Timing Role: SPI-connected boot memory supporting XIP-capable read modes and fast resume from deep power-down after ignition-on. Use Value: 6 ns tV latency and 104 MHz clock enable sub-100 ms boot times while maintaining -40°C to +125°C operational range. | Use Scenario: Storing Wi-Fi credentials, OTA update manifests, and user preferences in always-on home automation hubs. IC Role / Device Role / Timing Role: Secure configuration store leveraging OTP register for MAC address binding and encrypted key storage. Use Value: Factory-programmed 64-byte unique ID enables device-specific provisioning and cloud identity binding without external secure elements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Winbond W25Q10EW | 1-Mbit density, 1.65–3.6 V, 104 MHz, but lacks Dual-Output Read; uses standard Quad SPI commands only. | No dual-read throughput benefit; requires host driver changes to remove dual-I/O support. | Select when dual-read is unnecessary and legacy SPI compatibility is prioritized over peak bandwidth. |
| Micron MT25QL01GBBB8E12-0SIT | 1-Gbit density (1000× larger), same voltage/range, supports octal DTR; significantly higher cost and PCB footprint. | Over-specified for 1-Mbit use cases; suitable only if future scalability to multi-Mbit firmware is required. | Select only if roadmap includes firmware expansion beyond 1 Mbit and octal interface infrastructure exists. |
Compared with W25Q10EW and MT25QL01GBBB8E12-0SIT, the AT25DF011-XMHNGU-B uniquely balances minimal power consumption (200 nA), dual-read acceleration, and precise 256-byte page erase-making it optimal for resource-constrained, battery-aware, and firmware-update-critical designs where density and octal complexity are unnecessary.
Availability
AT25DF011-XMHNGU-B is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical sensor data logging, automotive infotainment boot memory, and smart home gateway configuration requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for AT25DF011-XMHNGU-B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.
The AT25DF011-XMHNGU-B belongs to Renesas' AT25DF serial Flash family, engineered specifically for low-voltage, high-reliability embedded code and data storage with emphasis on power efficiency, security, and flexible erase architecture.
FAQ
What is the maximum operating frequency supported by the AT25DF011-XMHNGU-B?
The AT25DF011-XMHNGU-B supports a maximum operating frequency of 104 MHz for read, program, and erase operations. This applies to standard Read Array (0Bh), Dual-Output Read (3Bh), Page Erase (81h), Block Erase (20h/52h), and Chip Erase (60h/C7h) commands under specified voltage and temperature conditions per datasheet Rev. J Section 13.5.
Does the AT25DF011-XMHNGU-B support Dual-Output Read mode, and how is it enabled?
Yes, the AT25DF011-XMHNGU-B supports Dual-Output Read mode using the 3Bh opcode. When this command is issued, the SI pin functions as I/O0 (outputting LSB bits) while SO functions as I/O1 (outputting MSB bits), allowing two bits per SCK falling edge. No configuration register setting is required-activation is command-driven and fully compliant with SPI Mode 0/3 timing.
What is the purpose and structure of the OTP Security Register in the AT25DF011-XMHNGU-B?
The AT25DF011-XMHNGU-B contains a 128-byte OTP Security Register: 64 bytes are factory-programmed with a unique device identifier (used for serialization), and 64 bytes are user-programmable for secure storage of electronic serial numbers, cryptographic keys, or calibration data. Once programmed, OTP bytes cannot be altered, providing tamper-resistant identity binding.
How does hardware write protection work on the AT25DF011-XMHNGU-B?
Hardware write protection on the AT25DF011-XMHNGU-B is controlled by the WP (Write Protect) pin. When WP is driven low, it locks protected memory sectors and disables status register writes-even if software write-enable is asserted. The pin is internally pulled high, so leaving it unconnected defaults to unprotected mode; external pull-up to VCC is recommended unless protection is actively used.
What erase granularities does the AT25DF011-XMHNGU-B support, and why does that matter for firmware updates?
The AT25DF011-XMHNGU-B supports 256-byte page erase, 4-kByte block erase, 32-kByte block erase, and full chip erase. This granularity allows firmware updates to modify only changed code sections-minimizing erase time, reducing wear on unaffected sectors, and avoiding full-image rewrites. For example, a 2-kByte delta patch can be applied using two page erases instead of one 4-kByte block erase, preserving endurance and latency.
AT25DF011-XMHNGU-B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 8µs, 3.5ms
- Access Time:
- -
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
AT25DF011-XMHNGU-B FAQ
1.How can I place an order for AT25DF011-XMHNGU-B through Aetrix?
Please submit a Request for Quotation (RFQ) for AT25DF011-XMHNGU-B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AT25DF011-XMHNGU-B reliable?
The price and inventory of AT25DF011-XMHNGU-B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AT25DF011-XMHNGU-B is usually 5 days.
3.What payment methods are accepted for AT25DF011-XMHNGU-B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AT25DF011-XMHNGU-B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AT25DF011-XMHNGU-B?
AT25DF011-XMHNGU-B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AT25DF011-XMHNGU-B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AT25DF011-XMHNGU-B?
For technical support, including AT25DF011-XMHNGU-B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AT25DF011-XMHNGU-B requirements.
6.How does Aetrix verify that AT25DF011-XMHNGU-B is sourced from the original manufacturer or authorized distributors?
All AT25DF011-XMHNGU-B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AT25DF011-XMHNGU-B meets industry standards.
7.What is the process for return or replacement of AT25DF011-XMHNGU-B?
All AT25DF011-XMHNGU-B units undergo pre-shipment inspection (PSI). If there is an issue with AT25DF011-XMHNGU-B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AT25DF011-XMHNGU-B part is unused and in its original packaging.
Return procedure for AT25DF011-XMHNGU-B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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